Patents by Inventor Makoto IYAMA

Makoto IYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220084813
    Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes loading a substrate into a processing container, airtightly sealing the processing container in which the substrate has been loaded, reducing a pressure of the processing container airtightly sealed, supplying a processing solution into the processing container with reduced pressure, performing a process on the substrate using the processing solution, discharging the processing solution used for the process from the processing container, after discharging the processing solution, opening the processing container, and unloading the substrate subjected to the process out of the processing container.
    Type: Application
    Filed: March 12, 2021
    Publication date: March 17, 2022
    Applicant: Kioxia Corporation
    Inventors: Makoto IYAMA, Fumito SHOJI, Masatoshi SHOMURA