Patents by Inventor Makoto Kawato

Makoto Kawato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210013695
    Abstract: A light source unit for thermally-assisted magnetic head includes a substrate member having a first bonding surface; a light source assembly attached on the first bonding surface of the substrate member and having a second bonding surface; and a heater circuit assembly formed between the substrate member and the light source assembly, the heater circuit assembly having a heater formed on the substrate member and two leads connected at two ends of the heater, the lead being thicker than the heater, thereby a distance between the heater and the second bonding surface is farther than that between the lead and the second bonding surface. The light source unit can reduce mechanical stress and thermal conduction between a light source assembly and a substrate member, thereby improving the performance of the light source assembly and the heater.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 14, 2021
    Inventors: Takashi HONDA, Kowang LIU, Kwun Pan NG, Makoto KAWATO
  • Patent number: 10622783
    Abstract: A light source-unit which is used for a thermally assisted magnetic head, comprises a laser diode and a sub-mount which the laser diode is joined. The sub-mount comprises a joint-surface which the laser diode is joined and a convex part protruding from the joint-surface. The light source-unit comprises an alloy layer, made of alloy, which is formed between the surface of the convex part and an opposing-surface, of the laser diode, opposing to the joint-surface.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: April 14, 2020
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Ryo Hosoi, Takashi Honda, Makoto Kawato
  • Patent number: 10566013
    Abstract: A light source unit for thermally-assisted magnetic head includes a substrate member having a bonding surface, multiple layers formed on the bonding surface and comprising a base layer, a connection pad layer, an insulation layer and a bonding layer; a light source assembly attached on the bonding layer of the substrate member and having a laser diode embedded therein and connected to the connection pad layer on the bonding surface, so as to form a laser diode circuit; and a heater buried in the insulation layer and connected to the connection pad layer, so as to form a heater circuit. The light source unit can maintain stable heat power for facilitating performance of the thermally-assisted magnetic head, and further reduce the sizes of the light source unit and substrate member.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: February 18, 2020
    Assignees: SAE MAGNETICS (H.K.) LTD., HEADWAY TECHNOLOGIES, INC.
    Inventors: Takashi Honda, Ryo Hosoi, Wah Chun Chan, Makoto Kawato, Dayu Zhou, Koji Shimazawa, Kowang Liu