Abstract: A method for manufacturing a phosphor sheet is provided. In the method, a particulate phosphor and a particulate transparent medium are mixed to a first light transmissive resin in a liquid state. The first light transmissive resin containing the phosphor and the transparent medium in the liquid state is supplied into a lower mold of a mold, and the mold is closed. The first light transmissive resin containing the phosphor and the transparent medium in the liquid state is changed to a solid state having a predetermined thickness by applying a heat and a pressure to the first light transmissive resin containing the phosphor and the transparent medium in the liquid state.

Abstract: A method includes mounting a light emitting device on a board having electrodes on its surface, disposing a resin sheet containing a light conversion material so as to face the surface of the board and filling a space between the resin sheet and the board with a first light transmissive resin, covering a surface of the resin sheet opposite to a surface of the resin sheet covered with the first light transmissive resin, with a second light transmissive resin, forming a groove extending from a top surface of the second light transmissive resin to the board, filling the groove with light reflective resin and covering the top surface of the second light transmissive resin with the light reflective resin, removing the light reflective resin, and dicing the light emitting device by cutting along the light reflective resin.

Abstract: A method for manufacturing a module including N layers of stacked resin is provided, wherein N is a natural number of two or more. In the method, resin of a first layer is cured to a degree that does not fully harden the resin of the first layer. Resin of a Mth layer is stacked on resin of a (M?1)th layer, wherein M is a natural number of two or more and less than N. The resin of the Mth layer is cured to a degree that does not fully harden the resin of the Mth layer. Stacking the resin of the Mth layer and curing the resin of the Mth layer are repeated. Then, resin of Nth layer is stacked, and all of the N layers of stacked resin are fully hardened.

Abstract: A method for manufacturing an optical module includes a step of mounting a light emitting device on a board having a plurality of electrodes on its surface in a facedown manner, a step of disposing a resin sheet containing a light conversion material so as to face the surface on which the light emitting device is mounted of the board and filling a space between the resin sheet and the board including the resin sheet and the light emitting device with a first light transmissive resin, a step of covering a surface opposite to a surface of the resin sheet covered with the first light transmissive resin with a second light transmissive resin, a step of forming a groove extending from a top surface of the second light transmissive resin to a predetermined depth of the board, a step of filling the groove with the light reflective resin and covering the top surface of the second light transmissive resin with the light reflective resin, a step of removing the light reflective resin on the second light transmissive re

Abstract: A method for manufacturing a module including N layers of stacked resin is provided, wherein N is a natural number of two or more. In the method, resin of a first layer is cured to a degree that does not fully harden the resin of the first layer. Resin of a Mth layer is stacked on resin of a (M?1)th layer, wherein M is a natural number of two or more and less than N. The resin of the Mth layer is cured to a degree that does not fully harden the resin of the Mth layer. Stacking the resin of the Mth layer and curing the resin of the Mth layer are repeated. Then, resin of Nth layer is stacked, and all of the N layers of stacked resin are fully hardened.

Abstract: A method for manufacturing a phosphor sheet is provided. In the method, a particulate phosphor and a particulate transparent medium are mixed to a first light transmissive resin in a liquid state. The first light transmissive resin containing the phosphor and the transparent medium in the liquid state is supplied into a lower mold of a mold, and the mold is closed. The first light transmissive resin containing the phosphor and the transparent medium in the liquid state is changed to a solid state having a predetermined thickness by applying a heat and a pressure to the first light transmissive resin containing the phosphor and the transparent medium in the liquid state.

Abstract: An optical module includes a wiring substrate; an optical element mounted on the wiring substrate; a first light-transmitting body mounted on an upper surface of the optical element; and a light-shielding resin covering the optical element and a side surface portion of the first light-transmitting body, wherein the light-shielding resin includes filler, an upper surface of the light-shielding resin is a ground surface, and a ground surface of the filler is exposed on the upper surface of the light-shielding resin.

Abstract: The module is implemented on a circuit board, the module including a wiring board; an electronic component implemented on a first surface of the wiring board; an external connection electrode formed on a second surface of the wiring board; a solder bump connected to the external connection electrode; a bare chip implemented facedown on the second surface of the wiring board; and a resin covering a surface and a side surface of the bare chip and a side surface of the solder bump on the second surface of the wiring board, wherein a reverse surface of the bare chip and a connection surface of the solder bump are exposed from the resin such that the reverse surface of the bare chip and the connection surface of the solder bump are on a same plane, and wherein the module is implemented on the circuit board so that the reverse surface of the bare chip and the connection surface of the solder bump face the circuit board.

Abstract: The module is implemented on a circuit board, the module including a wiring board; an electronic component implemented on a first surface of the wiring board; an external connection electrode formed on a second surface of the wiring board; a solder bump connected to the external connection electrode; a bare chip implemented facedown on the second surface of the wiring board; and a resin covering a surface and a side surface of the bare chip and a side surface of the solder bump on the second surface of the wiring board, wherein a reverse surface of the bare chip and a connection surface of the solder bump are exposed from the resin such that the reverse surface of the bare chip and the connection surface of the solder bump are on a same plane, and wherein the module is implemented on the circuit board so that the reverse surface of the bare chip and the connection surface of the solder bump face the circuit board.

Abstract: An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.

Abstract: An electronic component module includes a double-sided mounting board having a front surface and a back surface; components mounted on the front surface and the back surface of the double-sided mounting board; an insulating resin sealing the components mounted on the front surface and the back surface; and a lead frame bonded to the back surface of the double-sided mounting board. The back surface of the double-sided mounting board is sealed with the insulating resin such that the lead frame is not covered by the insulating resin, and the thickness of the insulating resin sealing the components mounted on the back surface of the double-sided mounting board is less than or equal to the thickness of the lead frame.