Patents by Inventor Makoto Matsuura

Makoto Matsuura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240138263
    Abstract: A light emitting element of one or more embodiments includes a first electrode, a second electrode oppositely to the first electrode, and an emission layer between the first electrode and the second electrode. The light emitting element of one or more embodiments includes a polycyclic compound represented by a specific chemical structure in the emission layer, thereby showing improved emission efficiency and life characteristics.
    Type: Application
    Filed: September 18, 2023
    Publication date: April 25, 2024
    Inventors: Makoto YAMAMOTO, Keigo HOSHI, Yuji SUZAKI, Hirokazu KUWABARA, Nobutaka AKASHI, Ryuhei FURUE, Toshiyuki MATSUURA, Yoshiro SUGITA, Yuma AOKI, Yuuki MIYAZAKI
  • Patent number: 11963375
    Abstract: A light-emitting device includes a first electrode. a second electrode facing the first electrode, and an interlayer between the first electrode and the second electrode and including an emission layer. The emission layer may include a hole transporting host, an electron transporting host, a sensitizer, and a delayed fluorescence dopant. The hole transporting host and the electron transporting host may form an exciplex. The sensitizer may include an organometallic compound. The delayed fluorescence dopant may not include a metal atom, and the exciplex may satisfy specific Equations.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jiyoung Lee, Makoto Yamamoto, Toshiyuki Matsuura, Hyunyoung Kim, Hyosup Shin
  • Publication number: 20240109826
    Abstract: A composition containing: a compound (2); a metal compound; and at least one selected from a compound (3) and a compound (4), the compound (3) being contained in an amount of 10000 ppm or less relative to the compound (2), the compound (4) being contained in an amount of 10000 ppm or less relative to the compound (2), the compound (2) being represented by the following formula (2): the compound (3) being represented by the following formula (3): and the compound (4) being represented by the following formula (4): wherein the various substituents of compounds (2), (3) and (4) are as defined herein.
    Type: Application
    Filed: November 9, 2023
    Publication date: April 4, 2024
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yuuki SUZUKI, Akitoshi OGATA, Asako YOSHIYAMA, Makoto MATSUURA, Yoshichika KUROKI, Yosuke KISHIKAWA
  • Patent number: 11945773
    Abstract: An object of the present invention is to provide a method for producing a propionic acid derivative with high productivity. The object can be achieved by a method for producing a compound represented by formula (1): wherein R1 is a halogen atom or the like, R2 and R3 are each independently a hydrogen atom, a halogen atom, or an organic group, X is an oxygen atom or a sulfur atom, R4 and R5 are each independently a hydrogen atom, a halogen atom, or a hydrocarbon group optionally having one or more substituents, R6 is a hydrocarbon group optionally having one or more substituents; the method comprising step A of reacting a compound represented by formula (2): with a compound represented by formula (3): M(R1)n, wherein M is a cation, n is an integer corresponding to the valence of M, and a compound represented by formula (4): R6—X—H; and step B of separating, by filtration, the compound represented by formula (5): MFn from the mixture obtained by the above reaction.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: April 2, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Atsushi Shirai, Asako Yoshiyama, Makoto Matsuura, Yoshichika Kuroki
  • Patent number: 11942384
    Abstract: A semiconductor package including a leadframe has a plurality of leads, and a semiconductor die including bond pads attached to the leadframe with the bond pads electrically coupled to the plurality of leads. The semiconductor die includes a substrate having a semiconductor surface including circuitry having nodes coupled to the bond pads. A mold compound encapsulates the semiconductor die. The mold compound is interdigitated having alternating extended mold regions over the plurality of leads and recessed mold regions in between adjacent ones of the plurality of leads.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: March 26, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Makoto Shibuya, Masamitsu Matsuura, Kengo Aoya, Hideaki Matsunaga, Anindya Poddar
  • Patent number: 11932224
    Abstract: An object of the present invention is to provide a brake control device and a brake system capable of braking with a shortened braking response when shifting from non-braking to braking. A brake control device 10 includes a command value calculation unit 4 that calculates an operation command value required to make a pressing force by which a brake pad 11a is pressed against a brake disc 11b reach a target thrust value. The command value calculation unit 4 includes: a clearance command calculation unit 43 that calculates a command value required for contact between the brake pad 11a and the brake disc 11b; and a thrust command calculation unit 40 that calculates a command value required for reaching the target thrust from a state where the brake pad 11a and the brake disc 11b are in contact with each other.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: March 19, 2024
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Kyoshiro Itakura, Toshiyuki Ajima, Takahiro Ito, Kenichiro Matsubara, Daisuke Goto, Makoto Matsuura
  • Patent number: 11931949
    Abstract: A filament winding device includes a fiber bundle retainer that temporarily retains fiber bundles. The fiber bundle retainer includes: a reel member including an outer peripheral portion having pins movable in the axial direction relative to the fiber bundles supplied through fiber bundle guides and rotatable about the axis of the liner, the reel member capable of winding the fiber bundles onto the outer peripheral portion; a first cutting unit configured to cut a part of each of the fiber bundles in the circumferential direction, the part being between a part of the fiber bundle wound on the outer peripheral portion and a part of the fiber bundle wound on the liner; and a second cutting unit different from the first cutting unit and configured to cut a part of each of the fiber bundles in the axial direction, the part being wound on the outer peripheral portion.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 19, 2024
    Assignee: Murata Machinery, Ltd.
    Inventors: Shu Ikezaki, Motohiro Tanigawa, Tadashi Uozumi, Hirotaka Wada, Takahiro Miura, Makoto Tanaka, Masatsugu Goyude, Shota Miyaji, Daigoro Nakamura, Tetsuya Matsuura
  • Patent number: 11931974
    Abstract: A filament winding apparatus includes a rail extending in a first direction, a core material support device that supports a core material, and a winding device that winds a fiber bundle onto an outer peripheral surface of the core material, the winding device including: a guide unit having an opening through which the core material passes, and guiding the fiber bundle; and a main frame on which the guide unit is mounted; wherein the main frame is movable relative to the core material in the first direction, the main frame is movable in a second direction orthogonal to the first direction, and the main frame is rotatable around a first rotational axis extending in a third direction orthogonal to each of the first direction and the second direction.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: March 19, 2024
    Assignee: Murata Machinery, Ltd.
    Inventors: Shu Ikezaki, Motohiro Tanigawa, Tadashi Uozumi, Hirotaka Wada, Masatsugu Goyude, Shota Miyaji, Takahiro Miura, Makoto Tanaka, Daigoro Nakamura, Tetsuya Matsuura
  • Publication number: 20230294474
    Abstract: A controller controls a suspension apparatus including a variable damper that adjusts a force between a vehicle body and a wheel of a vehicle. The controller includes a first instruction calculation portion and a control instruction output portion. The first instruction calculation portion outputs a first instruction value of a damping force, which corresponds to a first target amount, using a learning result acquired from machine learning in advance by inputting a plurality of different pieces of information. The control instruction output portion limits the first instruction value and outputs it as a control instruction in a case where the first instruction value works in a direction leading to a greater vehicle state amount than a predetermined amount due to control of the variable damper based on the first instruction value.
    Type: Application
    Filed: July 21, 2021
    Publication date: September 21, 2023
    Inventors: Makoto MATSUURA, Ryusuke HIRAO
  • Publication number: 20230249510
    Abstract: A controller as a control apparatus controls a shock absorber of a control target wheel (a rear wheel) located in back of a detection target portion (a front wheel) of an unsprung acceleration sensor based on a detection value detected by the unsprung acceleration sensor on the front wheel side provided on a vehicle. In this case, the controller identifies a movement distance (a delay distance) from the detection target portion (the front wheel) and controls the shock absorber of the control target wheel (the rear wheel) located in back thereof based on the detection value of the unsprung acceleration sensor and a vehicle speed for each control period.
    Type: Application
    Filed: July 14, 2021
    Publication date: August 10, 2023
    Inventors: Yoshifumi KAWASAKI, Makoto MATSUURA, Ryusuke HIRAO
  • Publication number: 20230234910
    Abstract: Disclosed is a method for producing an acrylic acid derivative represented by formula (1): wherein R1 represents hydrogen or the like; R3 represents hydrogen or the like; and X represents hydrogen or the like, the method comprising step B of bringing an organic metal compound represented by formula (A3A): wherein R2, in each occurrence, is the same or different and represents hydrogen or like; R3 represents hydrogen or the like; X represents hydrogen or the like; and M represents hydrogen or the like, or an organic metal compound represented by formula (A3B): wherein the symbols are as defined above, or a combination thereof, into contact with a proton donor and an aldehyde compound to obtain a compound represented by formula (1).
    Type: Application
    Filed: March 9, 2023
    Publication date: July 27, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Makoto MATSUURA, Manaho TOMIOKA, Michiaki OKADA, Atsushi SHIRAI, Sumi ISHIHARA, Yosuke KISHIKAWA
  • Publication number: 20230202962
    Abstract: The present disclosure addresses the problem of providing a method for purifying a halogen-containing (meth)acrylic acid ester, the method being capable of removing an alcohol to a high degree.
    Type: Application
    Filed: February 16, 2023
    Publication date: June 29, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Makoto MATSUURA, Seiji TAKUBO, Moe HOSOKAWA, Yosuke KISHIKAWA, Akihiro GOTOU
  • Publication number: 20230192590
    Abstract: The present disclosure addresses the problem of providing a method for purifying an acrylic acid ester compound. This problem can be solved by a method for purifying a compound represented by formula (1) (wherein R1 and R2 are the same as or different and each represent an alkyl group, a fluoroalkyl group, an aryl group optionally having one or more substituent groups, a halogen atom, or a hydrogen atom, R3 is an alkyl group, a fluoroalkyl group, or an aryl group optionally having one or more substituent groups, and X is a fluoroalkyl group or a halogen atom), the method including step A of distilling composition A containing (a) the compound represented by formula (1), (b) an alcohol, and (c) a salt so as to obtain a concentrate containing the compound represented by formula (1).
    Type: Application
    Filed: February 15, 2023
    Publication date: June 22, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Moe HOSOKAWA, Akihiro GOTOU, Asako YOSHIYAMA, Makoto MATSUURA, Yosuke KISHIKAWA
  • Publication number: 20230069592
    Abstract: An object of the present invention is to provide a novel method for producing a fluorine-containing methylene compound. The above object can be achieved by a method for producing a compound represented by formula (1): wherein R1 represents an organic group, RA represents hydrogen or fluorine, R4a represents hydrogen or an organic group, R4b represents hydrogen or an organic group, R5a represents hydrogen or an organic group, R5b represents hydrogen or an organic group, and R2 represents hydrogen or an organic group; R2 is optionally connected to R4a to form a ring; the method comprising step A of reacting a compound represented by formula (2): wherein X1 represents a leaving group, and other symbols are as defined above, with a compound represented by formula (3): wherein X2 represents a leaving group, and other symbols are as defined above, in the presence of a reducing agent as desired, under light irradiation.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 2, 2023
    Applicants: DAIKIN INDUSTRIES, LTD., UNIVERSITY PUBLIC CORPORATION OSAKA
    Inventors: Makoto MATSUURA, Yoshichika KUROKI, Yosuke KISHIKAWA, Ilhyong RYU, Takahide FUKUYAMA
  • Publication number: 20220363934
    Abstract: An object of the present disclosure is to provide a coating composition containing a dissolved, specific fluoropolymer at a high concentration that is usable in fluoropolymer coating. The present disclosure relates to a coating composition containing a fluoropolymer and an aprotic solvent, and the fluoropolymer contains, as a main component, a monomer unit represented by formula (1): wherein R1 to R4 are each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group; and the concentration of the fluoropolymer is 20 mass % or more based on the total mass of the coating composition.
    Type: Application
    Filed: July 6, 2022
    Publication date: November 17, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshito TANAKA, Makoto MATSUURA, Yuuki SUZUKI, Akitoshi OGATA, Yosuke KISHIKAWA
  • Publication number: 20220355586
    Abstract: An object of the present disclosure is to provide a laminate comprising a fluoropolymer layer with insulating properties, hardness, or transparency. The present disclosure relates to a laminate comprising a fluoropolymer layer, wherein the fluoropolymer comprises, as a main component, a monomer unit represented by formula (1): wherein R1 to R4 are each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group.
    Type: Application
    Filed: July 6, 2022
    Publication date: November 10, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshito TANAKA, Makoto MATSUURA, Yuuki SUZUKI, Akitoshi OGATA, Yosuke KISHIKAWA
  • Patent number: 11492322
    Abstract: An object of the present invention is to provide a novel method for producing a fluorine-containing methylene compound. The above object can be achieved by a method for producing a compound represented by formula (1): wherein R1 represents an organic group, RA represents hydrogen or fluorine, R4a represents hydrogen or an organic group, R4b represents hydrogen or an organic group, R5a represents hydrogen or an organic group, R5b represents hydrogen or an organic group, and R2 represents hydrogen or an organic group; R2 is optionally connected to R4a to form a ring; the method comprising step A of reacting a compound represented by formula (2): wherein X1 represents a leaving group, and other symbols are as defined above, with a compound represented by formula (3): wherein X2 represents a leaving group, and other symbols are as defined above, in the presence of a reducing agent as desired, under light irradiation.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: November 8, 2022
    Assignees: DAIKIN INDUSTRIES, LTD., UNIVERSITY PUBLIC CORPORATION OSAKA
    Inventors: Makoto Matsuura, Yoshichika Kuroki, Yosuke Kishikawa, Ilhyong Ryu, Takahide Fukuyama
  • Publication number: 20220348704
    Abstract: An object of the present disclosure is to provide an insulating film or dielectric film comprising a fluoropolymer and having electrical insulation and hardness. The present disclosure relates to an insulating film or dielectric film comprising a fluoropolymer, wherein the fluoropolymer comprises, as a main component, a monomer unit represented by formula (1): wherein R1 to R4 are each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group.
    Type: Application
    Filed: July 6, 2022
    Publication date: November 3, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshito TANAKA, Makoto MATSUURA, Yuuki SUZUKI, Akitoshi OGATA, Yosuke KISHIKAWA, Hiroyuki YOSHIMOTO
  • Publication number: 20220332865
    Abstract: An object of the present disclosure is to provide, for example, a fluoropolymer electret material with hardness. The present disclosure relates to an electret material comprising a fluoropolymer, wherein the fluoropolymer comprises, as a main component, a monomer unit represented by formula (1): wherein R1 to R4 are each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group; and the fluoropolymer has a mass average molecular weight of 1 million or more and 5 million or less, or 5000 or more and less than 20000.
    Type: Application
    Filed: July 6, 2022
    Publication date: October 20, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshito TANAKA, Makoto MATSUURA, Yuuki SUZUKI, Akitoshi OGATA, Satoru YONEDA
  • Publication number: 20220332880
    Abstract: An object of the present disclosure is to provide an encapsulation resin in which the occurrence of cracks is suppressed when the resin is used for encapsulation of ultraviolet light-emitting elements. Another object of the present disclosure is to provide an encapsulation resin composition for supplying the encapsulation resin. The present disclosure relates to an encapsulation resin for light-emitting elements, comprising a fluoropolymer, wherein the fluoropolymer comprises, as a main component, a monomer unit represented by formula (1): wherein R1 to R4 are each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group.
    Type: Application
    Filed: July 6, 2022
    Publication date: October 20, 2022
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Yoshito TANAKA, Makoto MATSUURA, Yuuki SUZUKI, Akitoshi OGATA, Yosuke KISHIKAWA