Abstract: To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction.

Abstract: To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.

Abstract: An airbag includes an airbag body formed by joining front and rear panels, an inlet of pressurized fluid, a vent hole communicating inside and outside of the airbag body, a regulation portion regulating discharge of the pressurized fluid from the vent hole and a coupling portion temporarily joining the front and rear panels. The inlet and the vent hole are formed on the rear panel. The regulation portion includes a connecting member, a vent hole cover and a link member. The connecting member regulates a thickness of the airbag body in the inflated state. The vent hole cover covers the vent hole and has one end portion supported by the rear panel and the other end portion joined to the coupling portion. The link member has one end portion joined to the vent hole cover and the other end portion joined to the connecting member.

Abstract: A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening.

Abstract: To provide a wiring substrate which can reliably prevent progress of cracking in a solder bump, and which exhibits improved reliability. The wiring substrate 10 of the present invention includes a substrate main body 11, pads 61, and a solder resist 81. The pads 61 are provided on the substrate back surface 13 of the substrate main body, and have surfaces 62 on which solder bumps 84 employed for connection of a motherboard 91 can be formed. The solder resist 81 covers the substrate back surface 13 of the substrate main body, and has openings 82 through which the pads 61 are exposed. A protrusion 71 is formed on a portion of the surface 62 of each pad 61. The height A4 of the end surface 72 of the protrusion 71, as measured from the surface 62 of the pad 61, is smaller than the depth of each opening 82.

Abstract: A control information extraction unit receives information on a frame that contains at least a plurality slots from an access control apparatus for controlling communications between radio apparatuses. The control information extraction unit generates a frame that contains at least a plurality of slots in such a manner as to synchronize with the frame corresponding to the received information. An estimation unit estimates empty slots in the plurality of slots generated. A selection unit selects, at random, at least one of the estimated. A modem unit and the like broadcast data using the selected slot.

Abstract: An RF unit and a modem unit receive a packet signal, containing information regarding a frame construction, which is transmitted from a base station apparatus in a first period of a frame at least including first periods and second periods. An extraction unit identifies the second period in the frame, based on the received packet signal. A setting unit sets a waiting time period in the identified second period. A carrier sensing unit carries out carrier sensing over the waiting time period set by the setting unit. The modem unit and the RF unit broadcast the packet signal based on a result of the carrier sensing.

Abstract: Provided is a wiring substrate which allows connection terminals to be disposed at high density, can increase the degree of freedom of wiring layout, and can enhance the reliability of connection of the connection terminals. A wiring substrate of the present invention includes a laminate which includes one or more insulating layers and one or more conductor layers laminated together; a wiring formed on the laminate; a columnar connection terminal which is formed directly on the wiring and is in contact with at least one of opposite side surfaces of the wiring; and a solder resist layer which covers the wiring and which exposes at least a portion of the connection terminal. The width of the wiring at a position at which the connection terminal is formed is smaller than the length of the connection terminal in the width direction.

Abstract: A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.

Abstract: To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.

Abstract: To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction.

Abstract: An extracting unit detects movement from a first area to a second area, the first area and the second area defined as areas having different priorities. When the extracting unit detects the movement, this changes a communication process defined in the first area to the communication process defined in the second area. A notifying unit notifies that the area changed when the movement is detected. Herein, the priority of the first area and the priority of the second area are defined according to importance of a signal, which should be broadcasted from a processing unit.

Abstract: It is specified that a frame containing at least the plurality of slots is repeated. A detecting unit detects a slot usable in the communications between terminal apparatuses, from among a plurality of slots. A modem unit and an RF unit broadcast the information on the detected slot. A power measuring unit in the detecting unit measures the respective received powers of the plurality of slots, and an empty slot identifying unit identifies a slot whose received power is less than a threshold value.

Abstract: A control information extraction unit receives information on a frame that contains at least a plurality slots from an access control apparatus for controlling communications between radio apparatuses. The control information extraction unit generates a frame that contains at least a plurality of slots in such a manner as to synchronize with the frame corresponding to the received information. An estimation unit estimates empty slots in the plurality of slots generated. A selection unit selects, at random, at least one of the estimated. A modem unit and the like broadcast data using the selected slot.

Abstract: An RF unit broadcasts a packet signal, and receives a packet signal broadcasted from another terminal apparatus. A processing unit generates a packet signal to be broadcasted and processes a received packet signal. A mode setting unit selects a first mode or a second mode as a broadcast mode. The RF unit sets first transmission power in case of the first mode and sets second transmission power lower than the first transmission power in case of the second mode. The processing unit includes an identification number uniquely allocated to the present terminal apparatus in a packet signal in case of the first mode, and includes an identification number commonly allocated to a system of terminal-to-terminal communication in a packet signal in case of the second mode.

Abstract: A map data storage unit holds map data in which a road ID is allocated, as identification information, to every preset section of at least part of roads. A traffic jam determination unit determines whether the section corresponding to every road ID is congested. A transmission unit performs broadcast transmission of vehicle data including a road ID and the traveling speed of a vehicle from the vehicle traveling in each section of a road. At the time, the transmission unit forms a frame in which the received vehicle data of other vehicle and the vehicle data of a driver's vehicle are combined. An information compressing unit compresses an amount of data by deleting the traveling speed from the frame with respect to a section that has been determined not to be congested by the traffic jam determination unit.

Abstract: A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.

Abstract: A control information extraction unit receives information on a frame that contains at least a plurality slots from an access control apparatus for controlling communications between radio apparatuses. The control information extraction unit generates a frame that contains at least a plurality of slots in such a manner as to synchronize with the frame corresponding to the received information. An estimation unit (82) estimates empty slots in the plurality of slots generated. A selection unit selects, at random, at least one of the estimated. A modem unit and the like broadcast data using the selected slot.

Abstract: To provide a light emitting element mounting wiring substrate having a light emitting element mounting section on a substrate main body having a front surface and a back surface, and a confined component electrically connected to the light emitting element, such that the confine component does not obstruct the optical path of the light emitted from the light emitting element, resulting in uniform distribution of light intensity.

Abstract: A modem unit receives a signal broadcasted by a base station apparatus. A storage unit extracts information included in the received signal and stores the extracted information. A detection unit detects a fact that the signal broadcasted by the base station apparatus is not received. A generation unit measures a period of time starting when the storage unit has stored the information. When the detection unit detects the fact and when the measured period of time is shorter than a threshold, the generation unit broadcasts a signal including the information stored in the storage unit.