Patents by Inventor Makoto Nakagoshi

Makoto Nakagoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns
    Patent number: 7378745
    Abstract: A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: May 27, 2008
    Assignees: NEC Electronics Corporation, Denso Corporation
    Inventors: Akimori Hayashi, Katsunobu Suzuki, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera, Tadashi Murai, Chiho Ogihara, Ryohei Kataoka, Koji Kondo, Tomohiro Yokochi
  • Printed circuit board having colored outer layer
    Patent number: 7323238
    Abstract: In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: January 29, 2008
    Assignees: DENSO Corporation, NEC Electronics Corporation
    Inventors: Koji Kondo, Ryohei Kataoka, Tomohiro Yokochi, Makoto Nakagoshi, Tadashi Murai, Akimori Hayashi, Katsunobu Suzuki
  • Printed board and manufacturing method thereof
    Publication number: 20060068180
    Abstract: In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
    Type: Application
    Filed: September 22, 2005
    Publication date: March 30, 2006
    Applicants: DENSO CORPORATION, NEC Electronics Corporation
    Inventors: Koji Kondo, Ryohei Kataoka, Tomohiro Yokochi, Makoto Nakagoshi, Tadashi Murai, Akimori Hayashi, Katsunobu Suzuki
  • Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device
    Publication number: 20060044735
    Abstract: A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
    Type: Application
    Filed: August 30, 2005
    Publication date: March 2, 2006
    Applicants: NEC ELECTRONICS CORPORATION, DENSO CORPORATION
    Inventors: Akimori Hayashi, Katsunobu Suzuki, Ryuichi Oikawa, Makoto Nakagoshi, Naoko Sera, Tadashi Murai, Chiho Ogihara, Ryohei Kataoka, Koji Kondo, Tomohiro Yokochi