Abstract: A method of controlling an information processing device related to a content platform including transmitting content information relating to content to a user's terminal device, receiving action information relating to actions transmitted from one or more other users' terminal devices with respect to a content situation of the content from a distribution information processing device related to a distribution platform that is configured to distribute the content situation that progresses on the user's terminal device to the one or more other users' terminal devices, and associating benefit information relating to the content with the user in a case where the action satisfies conditions on the basis of the action information may be provided. Also provided is a device and a non-transitory computer-readable recording medium storing a program for performing the method.

Abstract: A method of controlling an information processing device related to a content platform including transmitting content information relating to content to a user's terminal device, receiving action information relating to actions transmitted from one or more other users' terminal devices with respect to a content situation of the content from a distribution information processing device related to a distribution platform that is configured to distribute the content situation that progresses on the user's terminal device to the one or more other users' terminal devices, and associating benefit information relating to the content with the user in a case where the action satisfies conditions on the basis of the action information may be provided. Also provided is a device and a non-transitory computer-readable recording medium storing a program for performing the method.

Abstract: A method of controlling an information processing device related to a content platform including transmitting content information relating to content to a user's terminal device, receiving action information relating to actions transmitted from one or more other users' terminal devices with respect to a content situation of the content from a distribution information processing device related to a distribution platform that is configured to distribute the content situation that progresses on the user's terminal device to the one or more other users' terminal devices, and associating benefit information relating to the content with the user in a case where the action satisfies conditions on the basis of the action information may be provided. Also provided is a device and a non-transitory computer-readable recording medium storing a program for performing the method.

Abstract: A method of controlling an information processing device related to a content platform including transmitting content information relating to content to a user's terminal device, receiving action information relating to actions transmitted from one or more other users' terminal devices with respect to a content situation of the content from a distribution information processing device related to a distribution platform that is configured to distribute the content situation that progresses on the user's terminal device to the one or more other users' terminal devices, and associating benefit information relating to the content with the user in a case where the action satisfies conditions on the basis of the action information may be provided. Also provided is a device and a non-transitory computer-readable recording medium storing a program for performing the method.

Abstract: An aggregate substrate has a first varistor part, a second varistor part, and a heat dissipation layer. The first varistor part includes a first varistor element layer to exhibit nonlinear voltage-current characteristics, and a plurality of first internal electrodes juxtaposed in the first varistor element layer. The second varistor part includes a second varistor element layer to exhibit nonlinear voltage-current characteristics, and a plurality of second internal electrodes juxtaposed in the second varistor element layer. The heat dissipation layer is located between the first and second varistor parts and is in contact with the first and second varistor parts.

Abstract: A varistor having a favorable heat-dissipating property is provided. In the varistor, a composite part having a favorable heat-dissipating property formed by a composite material composed of ZnO and Ag is arranged between main faces of a varistor matrix. Therefore, the heat transmitted from a semiconductor light-emitting device to a varistor part through an outer electrode can rapidly be transferred toward a main face on the opposite side through the composite part. In this varistor, side faces excluding inner side faces are exposed at side faces of the varistor matrix. Such a structure yields a favorable heat-dissipating property.

Abstract: A first varistor section includes a first face of an element body, and a third face facing the first face. The first varistor section has a first varistor element body, a first varistor electrode electrically connected to a first external electrode, and a second varistor electrode electrically connected to a second external electrode. A heat radiation section has a first heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the first and third external electrodes, a second heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the second and fourth external electrodes, and an insulating layer located between the first heat radiation portion and the second heat radiation portion and electrically insulating the first heat radiation portion and the second heat radiation portion from each other. The first heat radiation portion and the second heat radiation portion contain a metal.

Abstract: In a varistor, a heat radiating portion contains the same components as ZnO that is the main component of a varistor element body, as metal oxides, thereby, the structural components of the varistor element body and the heat radiating portion are caused to be common. During firing, Ag contained in the heat radiating portion diffuses into the grain boundaries of ZnO, near the interface between surfaces of the heat radiating portion and the varistor element body. Consequently, in the varistor, cracks hardly occur between the varistor portion and the heat radiating portion during firing (or during binder removal), thereby, ensuring sufficient bonding strength between the varistor portion and the heat radiating portion. Therefore, heat conducted to the varistor portion is radiated efficiently conducting through electrically conducted paths formed in the heat radiating portion from the surface facing the varistor element body to other three surfaces of the heat radiating portion.

Abstract: A varistor comprises an element body, two external electrodes, and a metal conductor. The element body includes a portion having first and second faces opposing each other. Two external electrodes are arranged on the first face of the element body. The metal conductor is arranged on the second face of the element body. The metal conductor has a thermal conductivity higher than that of the element body. At least a region between the two external electrodes and metal conductor in the element body exhibits a nonlinear current-voltage characteristic. The heat transmitted to the varistor is efficiently diffused from the metal conductor in the varistor.

Abstract: A varistor having a favorable heat-dissipating property is provided. In the varistor, a composite part having a favorable heat-dissipating property formed by a composite material composed of ZnO and Ag is arranged between main faces of a varistor matrix. Therefore, the heat transmitted from a semiconductor light-emitting device to a varistor part through an outer electrode can rapidly be transferred toward a main face on the opposite side through the composite part. In this varistor, side faces excluding inner side faces are exposed at side faces of the varistor matrix. Such a structure yields a favorable heat-dissipating property.

Abstract: A varistor comprises a varistor portion, a metal portion, and buffer portion. The varistor portion has a varistor element body exhibiting a nonlinear current-voltage characteristic and two electrode portions. The metal portion has a thermal conductivity higher than that of the varistor element body. The buffer portion is disposed between the varistor portion and metal portion so as to be bonded to each of the varistor portion and metal portion and mainly composed of glass. The two electrode portions are arranged in the varistor element body so as to be electrically insulated from each other while exposing at least a portion of each thereof from an outer surface of the varistor element body. The metal portion and varistor portion are joined firmly to each other. The heat transmitted to the varistor can efficiently be diffused from the metal portion.

Abstract: A laminated chip varistor comprises a varistor body, first and second inner electrodes, a heat conductor, and first and second outer electrodes. The varistor body has first and second outer faces. The first and second inner electrodes are disposed in the varistor body so that at least portions thereof are opposing to each other. The first and second outer electrodes are formed on the first outer face, the first outer electrode being connected to the first inner electrode, and the second outer electrode being connected to the second inner electrode. The heat conductor is formed in the varistor body extending in a direction from the first outer face toward the second outer face with one end face thereof exposed on the first outer face and the other end face thereof exposed on the second outer face.

Abstract: A varistor comprises a varistor element body, first and second inner electrodes opposing each other, a first outer electrode connected to the first inner electrode physically and electrically, a second outer electrode connected to the second inner electrode physically and electrically, and an electrically insulating layer. The first and second inner electrodes are arranged within the varistor element body so as to have end portions exposed at two outer surfaces of the varistor element body. The first outer electrode is arranged on one of the two outer surfaces so as to cover a portion of the end portion of the first inner electrode exposed at the one outer surface. The second outer electrode is arranged on the one outer surface so as to cover a portion of the end portion of the second inner electrode exposed at the one outer surface.

Abstract: A first varistor section includes a first face of an element body, and a third face facing the first face. The first varistor section has a first varistor element body, a first varistor electrode electrically connected to a first external electrode, and a second varistor electrode electrically connected to a second external electrode. A heat radiation section has a first heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the first and third external electrodes, a second heat radiation portion kept in contact with the third face of the first varistor section and electrically connected to the second and fourth external electrodes, and an insulating layer located between the first heat radiation portion and the second heat radiation portion and electrically insulating the first heat radiation portion and the second heat radiation portion from each other. The first heat radiation portion and the second heat radiation portion contain a metal.

Abstract: An aggregate substrate has a first varistor part, a second varistor part, and a heat dissipation layer The first varistor part includes a first varistor element layer to exhibit nonlinear voltage-current characteristics, and a plurality of first internal electrodes juxtaposed in the first varistor element layer. The second varistor part includes a second varistor element layer to exhibit nonlinear voltage-current characteristics, and a plurality of second internal electrodes juxtaposed in the second varistor element layer The heat dissipation layer is located between the first and second varistor parts and is in contact with the first and second varistor parts.

Abstract: A light emitting device has a semiconductor light emitting element and a multilayer chip varistor. The multilayer chip varistor has a multilayer body with a varistor portion therein, and a plurality of external electrodes disposed on an outer surface of the multilayer body. The varistor portion has a varistor layer containing ZnO as a principal component and exhibiting nonlinear voltage-current characteristics, and a plurality of internal electrodes arranged to interpose the varistor layer between them. Each of the external electrodes is connected to a corresponding internal electrode out of the plurality of internal electrodes. The semiconductor light emitting element is disposed on the multilayer chip varistor. The semiconductor light emitting element is connected to corresponding external electrodes out of the plurality of external electrodes so as to be connected in parallel to the varistor portion.

Abstract: In a varistor, a heat radiating portion contains the same components as ZnO that is the main component of a varistor element body, as metal oxides, thereby, the structural components of the varistor element body and the heat radiating portion are caused to be common. During firing, Ag contained in the heat radiating portion diffuses into the grain boundaries of ZnO, near the interface between surfaces of the heat radiating portion and the varistor element body. Consequently, in the varistor, cracks hardly occur between the varistor portion and the heat radiating portion during firing (or during binder removal), thereby, ensuring sufficient bonding strength between the varistor portion and the heat radiating portion. Therefore, heat conducted to the varistor portion is radiated efficiently conducting through electrically conducted paths formed in the heat radiating portion from the surface facing the varistor element body to other three surfaces of the heat radiating portion.

Abstract: A laminated chip varistor comprises a varistor body, first and second inner electrodes, a heat conductor, and first and second outer electrodes. The varistor body has first and second outer faces. The first and second inner electrodes are disposed in the varistor body so that at least portions thereof are opposing to each other. The first and second outer electrodes are formed on the first outer face, the first outer electrode being connected to the first inner electrode, and the second outer electrode being connected to the second inner electrode. The heat conductor is formed in the varistor body extending in a direction from the first outer face toward the second outer face with one end face thereof exposed on the first outer face and the other end face thereof exposed on the second outer face.

Abstract: A varistor comprises a varistor portion, a metal portion, and buffer portion. The varistor portion has a varistor element body exhibiting a nonlinear current-voltage characteristic and two electrode portions. The metal portion has a thermal conductivity higher than that of the varistor element body. The buffer portion is disposed between the varistor portion and metal portion so as to be bonded to each of the varistor portion and metal portion and mainly composed of glass. The two electrode portions are arranged in the varistor element body so as to be electrically insulated from each other while exposing at least a portion of each thereof from an outer surface of the varistor element body. The metal portion and varistor portion are joined firmly to each other. The heat transmitted to the varistor can efficiently be diffused from the metal portion.

Abstract: A varistor comprises an element body, two external electrodes, and a metal conductor. The element body includes a portion having first and second faces opposing each other. Two external electrodes are arranged on the first face of the element body. The metal conductor is arranged on the second face of the element body. The metal conductor has a thermal conductivity higher than that of the element body. At least a region between the two external electrodes and metal conductor in the element body exhibits a nonlinear current-voltage characteristic. The heat transmitted to the varistor is efficiently diffused from the metal conductor in the varistor.