Patents by Inventor Makoto Ohashi

Makoto Ohashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4445200
    Abstract: A current stretch detection method for a bubble device in which bubbles are written at least one bit apart. A stretch pulse is applied to a stretch conductor so that when a bubble is detected, it is maintained stretched, even though the bubble following it has moved one bit. Preferably the stretch pulse is of a convex-shape. A bubble device has a hairpin stretch conductor and a detecting element disposed centrally in the conductor. The terminal of the detecting element on the higher potential side is arranged so that it does not cross the stretch conductor. The contiguous propagation pattern is provided with a notch at a position in which the stretch conductor is located.
    Type: Grant
    Filed: September 18, 1981
    Date of Patent: April 24, 1984
    Assignee: Fujitsu Limited
    Inventors: Makoto Ohashi, Kazunari Komenou, Tsutomu Miyashita, Kazuo Matsuda, Yoshio Satoh
  • Patent number: 4434476
    Abstract: A magnetic bubble memory device includes: a magnetic layer with a first region having an easy axis of magnetization extending in a certain direction and a second region surrounding the first region and having an easy axis of magnetization substantially perpendicular to that of the first region, said first region defining a plurality of bubble propagation patterns; and a replicate gate with a stretch conductor pattern, to which an electric current is applied so as to stretch a bubble between said propagation patterns, and a cutting pattern formed in the second region between the propagation patterns and adapted to lower the bubble collapse field so as to cut the stretched domain. The replicate gate is operated by applying an operating current pulse to the stretch conductor pattern, said operating pulse including a stretch pulse for stretching the bubble and a cut pulse, following the stretch pulse, for cutting the stretched domain.
    Type: Grant
    Filed: August 17, 1982
    Date of Patent: February 28, 1984
    Assignee: Fujitsu Limited
    Inventors: Kazuo Matsuda, Makoto Ohashi, Yoshio Satoh, Tsutomu Miyashita, Kazunari Komenou
  • Patent number: 4415988
    Abstract: A magnetic bubble memory device comprises: a magnetic layer which has a first region having the easy axis of magnetization extending in a certain direction and a second region surrounding said first region and having the easy axis of magnetization substantially perpendicular to that of the first region, said first region defining at least one major loop pattern for propagation of information bubbles and a plurality of minor loop patterns for storage of information bubbles; and an electrical conductor pattern deposited on said magnetic layer in a region in which the major loop pattern and the minor loop patterns are opposed to each other, thereby constructing a transfer gate. The major loop pattern is provided, at the portions thereof substantially opposed to the ends of the minor loop patterns in the transfer gate, with gaps through which the bubbles are transferred between the major loop pattern and the minor loop patterns. The transfer gate is driven by means of a convex-shaped pulse of transfer current.
    Type: Grant
    Filed: July 14, 1981
    Date of Patent: November 15, 1983
    Assignee: Fujitsu Limited
    Inventors: Kazunari Komenou, Tsutomu Miyashita, Makoto Ohashi
  • Patent number: 4410469
    Abstract: In a method for manufacturing a module for a fiber optic link, a plate-shaped transparent circuit unit is molded in advance. The circuit module is transfer molded together with an optoelectronic element connected to leads. The circuit module is clamped between a pair of rod-shaped first dies which have a common central axis and one of which defines an optical path of the module, in such a manner that the optoelectronic element is located on a central axis of the circuit module. Under this condition, the circuit module is housed in a cavity defined by a pair of second dies. A light-shielding molding material is injected into the cavity for injection molding to mold a case. After the case is cured, the first and second dies are removed, and the hole of the case formed by one of the first die is closed with a cap to complete a receptacle.
    Type: Grant
    Filed: November 27, 1981
    Date of Patent: October 18, 1983
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Shuhei Katagiri, Kenichi Donuma, Makoto Ohashi