Abstract: A heat-resistant resin film having a metallic thin film accumulated thereon or an endless belt having a metallic thin film accumulated thereon having good mechanical characteristics is produced in a simple process. A metallic thin film is formed on an inner surface of a cylindrical substrate, and a layer of a heat-resistant resin is formed thereon. An accumulated body of the heat-resistant resin and the metallic thin film is peeled off from the substrate. The metallic thin film may be formed by electroplating, electroless plating or vapor deposition, or may also be formed by attaching a metallic foil having been prepared on an inner surface of the substrate. The heat-resistant resin layer is formed by injecting a polyamide acid solution in a rotational drum, and then formed by centrifugal forming by rotating the rotational drum on rollers under heating. After forming, imidization is conducted by heating and baking to form a film member of a thermosetting polyimide.

Abstract: A resin composition having a high adhesion between a resin layer and a metallic layer as well as an excellent durability, a process for producing the same, and an electrophotographic fixing member are provided. In the resin composition, a metallic layer is provided on a surface of a resin layer having a porous structure at least on the surface.

Abstract: In a fuser, a cooling structure (5) is disposed so that a bend angle (&agr;) of a part bent during the time between an endless belt (3) coming in contact with a press cooling face (5a) of the cooling structure (5) and exiting from the press cooling face (5a) is placed in the range of 0° C.<&agr;≦7° C. A fixing belt has a minute hardness of 0.1 to 5 at least on the belt surface coming in contact with toner T and preferably has a gloss degree of 75 or more on the belt surface.

Abstract: In a fuser, a cooling structure (5) is disposed so that a bend angle (&agr;) of apart bent during the time between an endless belt (3) coming in contact with a press cooling face (5a) of the cooling structure (5) and exiting from the press cooling face (5a) is placed in the range of 0° C.<&agr;≦7° C. A fixing belt has a minute hardness of 0.1 to 5 at least on the belt surface coming in contact with toner T and preferably has a gloss degree of 75 or more on the belt surface.

Abstract: In a fuser, a cooling structure (5) is disposed so that a bend angle (&agr;) of a part bent during the time between an endless belt (3) coming in contact with a press cooling face (5a) of the cooling structure (5) and exiting from the press cooling face (5a) is placed in the range of 0° C.<&agr;≦7° C. A fixing belt has a minute hardness of 0.1 to 5 at least on the belt surface coming in contact with toner T and preferably has a gloss degree of 75 or more on the belt surface.

Abstract: In a fuser, a cooling structure (5) is disposed so that a bend angle (&agr;) of apart bent during the time between an endless belt (3) coming in contact with a press cooling face (5a) of the cooling structure (5) and exiting from the press cooling face (5a) is placed in the range of 0° C.<&agr;≦7° C. A fixing belt has a minute hardness of 0.1 to 5 at least on the belt surface coming in contact with toner T and preferably has a gloss degree of 75 or more on the belt surface.

Abstract: In a fuser, a cooling structure (5) is disposed so that a bend angle (&agr;) of apart bent during the time between an endless belt (3) coming in contact with a press cooling face (5a) of the cooling structure (5) and exiting from the press cooling face (5a) is placed in the range of 0° C.<&agr;≦7° C. A fixing belt has a minute hardness of 0.1 to 5 at least on the belt surface coming in contact with toner T and preferably has a gloss degree of 75 or more on the belt surface.

Abstract: A heat-resistant resin film having a metallic thin film accumulated thereon or an endless belt having a metallic thin film accumulated thereon having good mechanical characteristics is produced in a simple process. A metallic thin film is formed on an inner surface of a cylindrical substrate, and a layer of a heat-resistant resin is formed thereon. An accumulated body of the heat-resistant resin and the metallic thin film is peeled off from the substrate. The metallic thin film may be formed by electroplating, electroless plating or vapor deposition, or may also be formed by attaching a metallic foil having been prepared on an inner surface of the substrate. The heat-resistant resin layer is formed by injecting a polyamide acid solution in a rotational drum, and then formed by centrifugal forming by rotating the rotational drum on rollers under heating. After forming, imidization is conducted by heating and baking to form a film member of a thermosetting polyimide.

Abstract: A vector processing unit includes data buffers between a storage and a vector processor. Each of the data buffers is divided into four virtual buffers. Each virtual buffer can store 16 words of data, each word having 8 bytes. Accordingly, one load data buffer can store four 8-byte vector data when the vector length is 16, and one 8-byte vector data when the vector length is 64. By compressing two 4-byte vector data into one 8-byte vector data, it is possible to store four 4-byte vector data when the vector length is 32, and 4-byte vector data when the vector length is 128.

Abstract: An image fixing device is provided that includes a heat roller disposed rotatably, and a fixed way to apply pressure for contacting and applying pressure to the heat roller to form a nip portion. A recording sheet on which an unfixed toner image is formed passes through the image fixing device for fixing the toner image. The heat roller has a releasing layer on its surface for stripping the recording sheet which has passed through the nip portion, and .mu..sub.2 and .mu..sub.2 having the following relation.mu..sub.1 /.mu..sub.2 .gtoreq.5,wherein .mu..sub.1 is a frictional coefficient between the releasing layer of the heat roller and the recording sheet and .mu..sub.2 is a frictional coefficient between the surface of the pressure applying means and the recording sheet.

Abstract: In order to effectively accelerate issue of a RAM read instruction which is to access the same memory block as a preceding RAM write instruction, when the RAM write instruction is issued, a counter initiates counting-up of a value indicative a predetermined time duration. When the counter counts up the value, the RAM read instruction is allowed to be issued at appropriate timing. A time duration for which the RAM read instruction is prohibited to be issued, is much shorter than a time duration which expires when the RAM write instruction is completely finished. Thus, the RAM read instruction issue is not required to wait for the completion of execution of the RAM write instruction as in a known technique.

Abstract: An information processing apparatus includes an arithmetic operation executing unit, a memory unit, a memory control unit, a resource managing unit, and an execution designating unit. The arithmetic operation executing unit executes an arithmetic operation on the basis of an instruction. The memory unit stores the arithmetic operation result from the arithmetic operation executing unit. The memory control unit has a buffer for temporarily storing data from the arithmetic operation executing unit and controls data transfer between the arithmetic operation executing unit and the memory unit. The resource managing unit manages use states of resources of the arithmetic operation executing unit. When an instruction is a data store instruction, the execution designating unit sends a buffer holding request to the memory control unit regardless of the resource state of the arithmetic operation executing unit.

Abstract: A molded semiconductor device has a plurality of slender leads formed with a sealing strip connecting them together to prevent the molding material from leaking out between the leads. Specifically, the sealing strip comprising an adhesive and an electrically insulating material is applied to the leads substantially perpendicular to the lengthwise direction of the leads. The strip is place such that an inner edge thereof substantially lies on a boundary line or inside where the molding terminates. The strip is then thrust into spaces formed between the leads. Thereafter the semiconductor chip is connected to the leads, the semiconductor chip and the leads are placed in a molding unit, the strip serving to block the molding material leaking outside the molding unit.

Abstract: A vector operation instruction issue control method includes a meter for measuring an elapse of a time period corresponding to a sum of the number of vector elements of a vector operation instruction and a difference between the number of pipeline stages of two arithmetic functions. When a vector operation instruction using an arithmetic function having a larger number of pipeline stages is issued to a vector arithmetic unit, the meter is activated to measure a time period corresponding to a sum of the number of vector elements of the vector operation instruction and the stage number difference.