Patents by Inventor Makoto Sumiyoshi

Makoto Sumiyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105408
    Abstract: A relay device includes a first contact, a second contact, a first conductor, a second conductor, a housing, and a heat transfer member. The first contact and the second contact are switchable between a state of being close to each other and a state of being separated from each other. The first contact is electrically coupled at the first conductor. the second contact is electrically coupled at the second conductor. The housing accommodates the first contact, the second contact, the first conductor, and the second conductor. The heat transfer member is higher in thermal conductivity than the housing. The heat transfer member extends from outside the housing to inside the housing and is in contact with one or both of the first conductor and the second conductor.
    Type: Application
    Filed: September 13, 2023
    Publication date: March 28, 2024
    Inventors: Tomoya SATO, Makoto SUMIYOSHI
  • Patent number: 5586006
    Abstract: A multi-chip module includes a base board, a thin-film multi-layer circuit board which is provided on a first surface of the base board and has a multi-layer structure in which insulating layers and wiring conductors are stacked, circuit elements mounted on a main surface of the thin-film multi-layer circuit board, and terminals which are attached to the main surface of the thin-film multi-layer circuit board and electrically connect the wiring conductors to circuits formed on a wiring board on which the multi-chip module is mounted.
    Type: Grant
    Filed: December 15, 1995
    Date of Patent: December 17, 1996
    Assignee: Fujitsu Limited
    Inventors: Kiyotaka Seyama, Shunichi Kikuchi, Makoto Sumiyoshi, Naoki Yasuda, Minoru Hirano, Hitoshi Nori
  • Patent number: 5432675
    Abstract: A multi-chip module (MCM) having semiconductor chips on a top surface of multi-layered interconnection circuits formed on a planar surface of a substrate including: (a) multi-layered interconnection circuits comprising alternatively laminated interconnection layers with insulating layers, and thermal contacts, each of the thermal contacts comprising successively laminated interconnection layers on a bottom and on side-walls of a vertical hole penetrating a plurality of the insulating layers, and a thermal conductor filling the vertical hole on the successively laminated interconnection layers, and (b) a plurality of the semiconductor chips attached to the thermal conductor.
    Type: Grant
    Filed: November 15, 1993
    Date of Patent: July 11, 1995
    Assignee: Fujitsu Limited
    Inventors: Haruo Sorimachi, Kiyotaka Seyama, Makoto Sumiyoshi, Kazuaki Satoh
  • Patent number: 4794221
    Abstract: An apparatus for exchanging electrode chips used for resistance welding. The apparatus includes a base to which a shaft is rotatably mounted. A power source is connected to one end of the shaft to rotate the shaft. An electrode chip-withdrawing knife tool is made of a board connected to the other end of the shaft. The knife tool is provided with recesses which are radially directed about the axis of the shaft. The recesses have their respective knife edge portions each of which is fitted into an annular groove formed between the step portion at the front end of the shank of each arm of a welding gun and the electrode chip fitted over the shank. An electrode chip supply holder in which new polished electrode chips are received is held by a guide member.
    Type: Grant
    Filed: September 14, 1987
    Date of Patent: December 27, 1988
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Fumio Takabe, Masashi Kitadate, Makoto Sumiyoshi, Kiyohiko Igarashi, Kazuo Suzuki, Takashi Akita