Abstract: The present invention provides a polyamideimide resin for flexible printed circuit boards that prior to curing exhibits an excellent solubility, processability, and handling characteristics, and that after curing exhibits flame retardancy, solder heat resistance, circuit embeddability, and flexibility and further has a high glass-transition temperature (Tg) and is able to maintain a high adhesive strength. The present invention provides a polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 taking the total molar amount of the acid component as 1.

Abstract: A composition for a polyimide resin, comprising a polyamic acid and a perylene black pigment having an isoindole skeleton, wherein a content of the perylene black pigment is 1 to 10% by mass based on 100% by mass of a weight of a solid content of the polyamic acid.

Abstract: A composition for a polyimide resin, comprising a polyamic acid and a perylene black pigment having an isoindole skeleton, wherein a content of the perylene black pigment is 1 to 10% by mass based on 100% by mass of a weight of a solid content of the polyamic acid.

Abstract: A mixture identification system for detecting foreign matter admixed in a tobacco material includes a conveyor for conveying the material, an irradiation device for irradiating infrared light toward an inspection line extending across the conveyor, an infrared camera device for receiving the infrared light reflected from the tobacco material passing across the inspection line and outputting image data of the material based on the received infrared light, and a discrimination circuit for detecting foreign matter in the material based on the output from the camera device. The infrared camera device has infrared filters for receiving the infrared light reflected from the tobacco material and allowing only respective specific wavelengths to pass therethrough, and optical line sensors for receiving the infrared light passed through the respective filters.

Abstract: The present invention provides a polyamideimide resin for flexible printed circuit boards that prior to curing exhibits an excellent solubility, processability, and handling characteristics, and that after curing exhibits flame retardancy, solder heat resistance, circuit embeddability, and flexibility and further has a high glass-transition temperature and is able to maintain a high adhesive strength. The present invention provides a polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 taking the total molar amount of the acid component as 1.

Abstract: A mixture identification system for detecting foreign matter admixed in a tobacco material (T) includes a conveyor (2) for conveying the material (T), an irradiation device (6) for irradiating infrared light toward an inspection line (IL) extending across the conveyor (2), an infrared camera device (10) for receiving the infrared light reflected from the tobacco material (T) passing across the inspection line (IL) and outputting image data of the material (T) based on the received infrared light, and a discrimination circuit (96) for detecting foreign matter in the material (T) based on the output from the camera device (10). The infrared camera device (10) has infrared filters (70, 76, 82) for receiving the infrared light reflected from the tobacco material (T) and allowing only respective specific wavelengths to pass therethrough, and optical line sensors (72, 78, 84) for receiving the infrared light passed through the respective filters (70, 76, 82).

Abstract: The present invention provides a polyamideimide resin for flexible printed circuit boards that prior to curing exhibits an excellent solubility, processability, and handling characteristics, and that after curing exhibits flame retardancy, solder heat resistance, circuit embeddability, and flexibility and further has a high glass-transition temperature (Tg) and is able to maintain a high adhesive strength. The present invention provides a polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 taking the total molar amount of the acid component as 1.

Abstract: An insulated electrical wire coated with a polyamide-imide insulating material which is a copolymer of anhydrotrimellitic acid, aliphatic and aromatic dicarboxylic acids and a diisocyanate, with a molar ratio of the acids to the diisocyanate of from about 0.9:1.0 to about 1.1:1.0 and optionally further containing from about 1 part wt. to about 30 parts wt. of an epoxy resin per each 100 parts of the copolymer. Optionally the aforementioned insulation can be an interior, first coating, coated by a second coating of a polyamide, polyamide-imide, and when the first coat does not contain an epoxy, then a polyimide.