Abstract: A component includes a main member that includes a first surface that opposes a circuit board, the component being mounted to the circuit board during an assembly procedure, and a plurality of legs that protrude from the first surface, the plurality of legs having ends, wherein the component is mounted on the circuit board with the ends of the plurality of legs fixed to the circuit board, each of the ends of the plurality of legs includes an end surface that opposes the circuit board at time of the assembly procedure, and also includes a bevel that is continuous with the end surface and inclined with respect to the end surface, and an interior angle formed between the end surface and the bevel is larger than or equal to 120° and smaller than or equal to 170°.

Abstract: A component includes a main member that includes a first surface that opposes a circuit board, the component being mounted to the circuit board during an assembly procedure, and a plurality of legs that protrude from the first surface, the plurality of legs having ends, wherein the component is mounted on the circuit board with the ends of the plurality of legs fixed to the circuit board, each of the ends of the plurality of legs includes an end surface that opposes the circuit board at time of the assembly procedure, and also includes a bevel that is continuous with the end surface and inclined with respect to the end surface, and an interior angle formed between the end surface and the bevel is larger than or equal to 120° and smaller than or equal to 170°.

Abstract: A wireless module includes a substrate that includes a first portion, a second portion, and a first flexible portion connecting the first portion and the second portion to each other. The first portion includes a circuit element that is mounted on the first main surface and a circuit including at least the circuit element. The second portion includes a first coil connected to the circuit. The first portion and the second portion face each other. A magnetic sheet is disposed on a second main surface of the second portion, and a battery is disposed between the second main surface of the first portion and the magnetic layer.

Abstract: A wireless module includes a substrate that includes a first portion, a second portion, and a first flexible portion connecting the first portion and the second portion to each other. The first portion includes a circuit element that is mounted on the first main surface and a circuit including at least the circuit element. The second portion includes a first coil connected to the circuit. The first portion and the second portion face each other. A magnetic sheet is disposed on a second main surface of the second portion, and a battery is disposed between the second main surface of the first portion and the magnetic layer.

Abstract: A wireless communication device includes a loop antenna that wirelessly communicates with a device of another party through an occurrence of an eddy current, a parallel inductor connected in parallel to the loop antenna, and a wireless IC element that is connected to the parallel inductor and that processes a transmission/reception signal. At least the parallel inductor and the wireless IC element provide a predetermined resonant frequency.

Abstract: A component mount board includes a resin board, an electronic component, and a molding resin. A land conductor is provided in the resin board. The electronic component is mounted on a surface of the resin board, and includes a mounting terminal that is bonded to the land conductor. The resin board includes a body resin portion including the land conductor provided on a surface thereof, and a surface resin layer disposed on a surface of the body resin portion and made of a material of the same type as that of the body resin portion. A conductor is not provided on a surface of the surface resin layer. The surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board. The mounting terminal is bonded to the land conductor via a bonding material filled in the through hole.

Abstract: A component mount board includes a resin board, an electronic component, and a molding resin. A land conductor is provided in the resin board. The electronic component is mounted on a surface of the resin board, and includes a mounting terminal that is bonded to the land conductor. The resin board includes a body resin portion including the land conductor provided on a surface thereof, and a surface resin layer disposed on a surface of the body resin portion and made of a material of the same type as that of the body resin portion. A conductor is not provided on a surface of the surface resin layer. The surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board. The mounting terminal is bonded to the land conductor via a bonding material filled in the through hole.

Abstract: A wireless communication device includes an antenna resonance circuit and a wireless IC element. The antenna resonance circuit includes a loop-shaped antenna that performs wireless communication by generating a magnetic field and series inductors connected in series to the loop-shaped antenna. The antenna resonance circuit has a resonant frequency corresponding to a carrier frequency. The wireless IC element is connected to the antenna resonance circuit and processes transmission and reception signals. An inductance value of the series inductors is larger than an inductance value of the loop-shaped antenna, and the series inductors are covered with a magnetic material.

Abstract: A wireless communication device includes an antenna resonance circuit and a wireless IC element. The antenna resonance circuit includes a loop-shaped antenna that performs wireless communication by generating a magnetic field and series inductors connected in series to the loop-shaped antenna. The antenna resonance circuit has a resonant frequency corresponding to a carrier frequency. The wireless IC element is connected to the antenna resonance circuit and processes transmission and reception signals. An inductance value of the series inductors is larger than an inductance value of the loop-shaped antenna, and the series inductors are covered with a magnetic material.

Abstract: A wireless communication device includes an antenna resonance circuit and a wireless IC element. The antenna resonance circuit includes a loop-shaped antenna that performs wireless communication by generating a magnetic field and series inductors connected in series to the loop-shaped antenna. The antenna resonance circuit has a resonant frequency corresponding to a carrier frequency. The wireless IC element is connected to the antenna resonance circuit and processes transmission and reception signals. An inductance value of the series inductors is larger than an inductance value of the loop-shaped antenna, and the series inductors are covered with a magnetic material.

Abstract: A wireless communication device includes an antenna resonance circuit and a wireless IC element. The antenna resonance circuit includes a loop-shaped antenna that performs wireless communication by generating a magnetic field and series inductors connected in series to the loop-shaped antenna. The antenna resonance circuit has a resonant frequency corresponding to a carrier frequency. The wireless IC element is connected to the antenna resonance circuit and processes transmission and reception signals. An inductance value of the series inductors is larger than an inductance value of the loop-shaped antenna, and the series inductors are covered with a magnetic material.

Abstract: A wireless communication device includes an antenna resonance circuit and a wireless IC element. The antenna resonance circuit includes a loop-shaped antenna that performs wireless communication by generating a magnetic field and series inductors connected in series to the loop-shaped antenna. The antenna resonance circuit has a resonant frequency corresponding to a carrier frequency. The wireless IC element is connected to the antenna resonance circuit and processes transmission and reception signals. An inductance value of the series inductors is larger than an inductance value of the loop-shaped antenna, and the series inductors are covered with a magnetic material.

Abstract: A wireless communication device includes a loop antenna that wirelessly communicates with a device of another party through an occurrence of an eddy current, a parallel inductor connected in parallel to the loop antenna, and a wireless IC element that is connected to the parallel inductor and that processes a transmission/reception signal. At least the parallel inductor and the wireless IC element provide a predetermined resonant frequency.

Abstract: A wireless communication device includes an antenna resonance circuit and a wireless IC element. The antenna resonance circuit includes a loop-shaped antenna that performs wireless communication by generating a magnetic field and series inductors connected in series to the loop-shaped antenna. The antenna resonance circuit has a resonant frequency corresponding to a carrier frequency. The wireless IC element is connected to the antenna resonance circuit and processes transmission and reception signals. An inductance value of the series inductors is larger than an inductance value of the loop-shaped antenna, and the series inductors are covered with a magnetic material.

Abstract: A radio IC device includes a radio IC element that includes an antenna terminal connected to an antenna element, and a ground terminal connected to a ground conductor provided integrally with the antenna element, and a circuit element that includes an impedance matching circuit connected to the antenna terminal of the radio IC element. The circuit element includes a first inductance element that defines the impedance matching circuit, and a second inductance element that is connected, as a high-frequency cutoff circuit for the radio IC element, to the ground terminal.

Abstract: A printed wiring board includes a circuit substrate on which sheets are laminated, a wireless IC element provided on the sheet, a radiator provided on the sheet, and a loop-shaped electrode defined by first planar conductors, via hole conductors, and one side of the radiator, coupled to the wireless IC element. The first planar conductors are coupled to the radiator and the second planar conductors by auxiliary electrodes.

Abstract: A composite printed wiring board includes a parent board and a child board that is mounted on the parent board. A wireless IC element that processes a high-frequency signal, a loop-shaped electrode that is coupled to the wireless IC element, and a first radiator that is coupled to the loop-shaped electrode are provided on the child board. A second radiator that is coupled to the loop-shaped electrode via an electromagnetic field is provided on the parent board.

Abstract: A wireless communication apparatus includes a first communication system, and a second communication system configured to transmit a transmission signal in a communication frequency band which is the same or substantially the same as that of the first communication system and at an electric power which is stronger than that of a reception signal of the first communication system. The first communication system includes a feeder circuit having a resonant frequency, the resonant frequency being within the communication frequency band if a reception signal of the first communication system is input, and the resonant frequency being out of the communication frequency band if a transmission signal of the second communication system is input.

Abstract: A radio IC device includes a radio IC element that includes an antenna terminal connected to an antenna element, and a ground terminal connected to a ground conductor provided integrally with the antenna element, and a circuit element that includes an impedance matching circuit connected to the antenna terminal of the radio IC element. The circuit element includes a first inductance element that defines the impedance matching circuit, and a second inductance element that is connected, as a high-frequency cutoff circuit for the radio IC element, to the ground terminal.