Abstract: A liquid absorbing apparatus for absorbing a liquid component from a formed ink image includes an endless liquid absorbing sheet, a mechanism configured to move the liquid absorbing sheet cyclically, an absorption mechanism configured to absorb the liquid component from the ink image by making the liquid absorbing sheet contact the ink image, a removing mechanism configured to squeeze and remove a liquid with a nipping pressure by nipping the liquid absorbing sheet, and at least one nipping portion, different from the absorption mechanism and the removing mechanism, configured to nip the liquid absorbing sheet. In the apparatus, the nipping pressure of the removing mechanism is set higher than a nipping pressure of the nipping unit.

Abstract: A liquid ejection head substrate that includes a nozzle plate provided with an ejection orifice adapted to eject liquid droplets, in which a projection/depression pattern is provided on a liquid droplet ejection surface of the nozzle plate, the projection/depression pattern being made up of a plurality of projections and depressions, the projections being separated by depressions 1 ?m or less in depth and disposed at predetermined spacing 10 ?m or less in length; and the projection/depression pattern includes a part having water repellency due to lotus effect.

Abstract: A porous body belt includes a body to be connected including a porous body, a connecting material A that is disposed on the body to be connected by spanning a gap between end portions of the body to be connected and contains a fiber A and a resin material A, and the resin material A penetrates at least a part of a void portion of the porous body of the body to be connected, and bonds the end portions of the body to be connected to each other.

Abstract: A porous body belt includes a body to be connected including a porous body, a connecting material A that bonds end portions of the body to be connected to each other, and a welding material A which is disposed between the body to be connected and the connecting material A, penetrates at least a part of a void portion of the porous body of the body to be connected, and adheres the body to be connected and the connecting material A to each other.

Abstract: There is provided a liquid absorbing apparatus for absorbing a liquid component from a formed ink image, including an endless liquid absorbing sheet, a mechanism configured to move the liquid absorbing sheet cyclically, an absorption mechanism configured to absorb the liquid component from the ink image by making the liquid absorbing sheet contact the ink image, a removing mechanism configured to squeeze and remove a liquid with a nipping pressure by nipping the liquid absorbing sheet, and at least one nipping portion, different from the absorption mechanism and the removing mechanism, configured to nip the liquid absorbing sheet. In the apparatus, the nipping pressure of the removing mechanism is set higher than a nipping pressure of the nipping unit.

Abstract: In a printing apparatus, an image is formed by an inkjet printhead, and a liquid component is absorbed from the image by bringing a cyclically movable liquid absorbing member into contact with the image. Then, the member is nipped by the first roller that contacts the first surface of the member, and the second roller that has a vertical positional relationship with respect to the first roller and contacts the second surface on a side opposite to the first surface. Furthermore, a region where the member is pressurized is formed by sealing the member by bending and winding the member around the first roller located on an upper side of the second roller at the nipped position. Then, the absorbed liquid component is pushed out and collected by moving the member in the nipped state.

Abstract: A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.

Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.

Abstract: A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane.

Abstract: A method for manufacturing a liquid discharge head that includes a discharge-port-forming member, which has discharge ports through which a liquid is discharged, and a pressure-chamber-forming member, which includes pressure chambers communicating with the discharge ports and each including a heating resistor formed in a bottom portion thereof and which has a surface joined to the discharge-port-forming member, includes preparing the pressure-chamber-forming member in which wiring layers each including a barrier metal as a base member are formed, forming the pressure chambers, whose depths from the surface are different from each other and which include the heating resistors each formed of one of the barrier metals, by recessing the pressure-chamber-forming member from the surface and removing at least two of the wiring layers, which are formed at different positions in a depth direction from the surface, to expose the corresponding barrier metals, and forming the discharge-port-forming member on the surface.

Abstract: A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer.

Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive patterns and having an opening portion, a wiring structure accommodated in the opening portion of the second insulation layer and including an insulation layer and conductive patterns on the insulation layer, second conductive patterns formed on the second insulation layer; and a via conductor formed in the second insulation layer and connecting one of the first conductive patterns and one of the second conductive patterns.

Abstract: A wiring board includes a first resin insulating layer, conductor pads on the first insulating layer including first and second conductor pads, a second resin insulating layer on the first insulating layer covering the first and second pads, an outermost conductor layer on the second insulating layer including first and second outermost wiring layers, via conductors through the second insulating layer including a first via conductor connecting the first wiring layer and first pad and a second via conductor connecting the second wiring layer and second pad, and a solder resist layer on the second insulating layer such that the solder resist layer is covering the first wiring layer and has one or more openings exposing the second wiring layer. The first wiring layer includes first main metal, and the second wiring layer includes second main metal which is different from the first metal of the first wiring layer.

Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads.

Abstract: An electronic component includes an insulation layer, an alignment mark positioned on a first surface of the insulation layer, and an adhesive layer including an optically opaque agent and formed on the first surface of the insulation layer or a second surface of the insulation layer on the opposite side with respect to the first surface of the insulation layer. The adhesive layer has an opening portion formed at the position corresponding to the alignment mark such that the opening portion exposes the alignment mark directly or through the insulation layer.

Abstract: A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and including a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and are set off from the second mounting pads toward the semiconductor element.

Abstract: A liquid-discharging head includes a substrate; a flow passage wall-forming layer bonded to the substrate so as to form a flow passage for liquid between the substrate and the flow passage wall-forming layer, the flow passage communicating with a discharge port configured to discharge the liquid; an element configured to generate energy used for discharging the liquid from the discharge port and provided on the flow passage wall-forming layer; a metal layer provided with the discharge port so as to correspond to the element; and a projecting portion made of a metal and extending from the metal layer through the flow passage wall-forming layer and projecting in the direction of the substrate.

Abstract: A method for manufacturing a liquid discharge head that includes a discharge-port-forming member, which has discharge ports through which a liquid is discharged, and a pressure-chamber-forming member, which includes pressure chambers communicating with the discharge ports and each including a heating resistor formed in a bottom portion thereof and which has a surface joined to the discharge-port-forming member, includes preparing the pressure-chamber-forming member in which wiring layers each including a barrier metal as a base member are formed, forming the pressure chambers, whose depths from the surface are different from each other and which include the heating resistors each formed of one of the barrier metals, by recessing the pressure-chamber-forming member from the surface and removing at least two of the wiring layers, which are formed at different positions in a depth direction from the surface, to expose the corresponding barrier metals, and forming the discharge-port-forming member on the surface.

Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity and having electrode terminals, an insulating layer formed on the substrate such that the insulating layer is covering the electronic component in the cavity, and via conductors formed through the insulating layer and including first via conductors and second via conductors such that the second via conductors are connected to the electrode terminals of the electronic component, respectively. The via conductors are formed in via formation holes penetrating through the insulating layer, respectively, and the via formation holes include first via formation holes and second via formation holes such that the second via formation holes are exposing the electrode terminals of the electronic component, respectively, and that a second via formation hole has a diameter which is smaller than a diameter of a first via formation hole.

Abstract: A printed wiring board includes a first resin insulating layer, a first conductor pattern including first mounting pads formed on the first resin insulating layer, and a wiring structure positioned on the first resin insulating layer and including a second resin insulating layer and a second conductor pattern such that the second resin insulating layer and second conductor pattern are positioned adjacent to the first conductor pattern and that the second conductor pattern includes second mounting pads. The second mounting pads are embedded in the second resin insulating layer such that the second mounting pads have mounting surfaces exposed on an exposed surface of the second resin insulating layer, and the first mounting pads have mounting surfaces such that the mounting surfaces of the first and second mounting pads are formed on a same plane.