Abstract: A solid-state imaging device and one or more bare ICs disposed on a back face of a solid-state imaging apparatus. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. The IC chips may be disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. The imaging apparatus may be within a package with a pinhole.

Abstract: At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case.

Abstract: At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case.

Abstract: At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits are provided. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case.

Abstract: A color matching method for a digital image. Signals of a plurality of main colors in the digital image are extracted and the extracted signals are used to generate a 3×3 color matrix. The signals of the plurality of main colors are transformed into a 3×1 input matrix formed by the intensity of illumination, the color hue, and the color saturation of each of the color signals. An output value and color difference of the plurality of the color signals are recursively calculated by performing an iteration operation based on an equation composed of the color matrix, a predefined weighting matrix and a fine-tuning matrix, until the color difference is smaller than a predetermined threshold value.

Abstract: The present invention provides a color matching method for a digital image comprising a step of extracting signals of a plurality of main colors in the digital image; a step of transformation for generating a 3×3 color matrix from the signals of the plurality of main colors and transforming the signals of the plurality of main colors into a 3×1 input matrix formed by the intensity of illumination, the color hue, and the color saturation of each of the color signals, which are referred to as Lab coordinates; and a step of color-difference calculation for recursively calculating an output value and color difference of the plurality of the color signals by performing an iteration operation based on an equation composed of the color matrix, a predefined weighting matrix and a fine-tuning matrix, until said color difference is smaller than a predetermined threshold value.

Abstract: At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits are provided. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case.

Abstract: At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits are provided. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case.

Abstract: At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits are provided. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case.