Patents by Inventor Makoto Tsukada

Makoto Tsukada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5566379
    Abstract: An audio signal recording and reproducing apparatus can perform realtime processing with a structure having a low cost. The audio signal recording and reproducing apparatus records a series of input audio signals as digital audio data, and reproduces and outputs the input signals using the recorded digital audio data as output audio signals. An input audio signal processing unit converts the series of input audio signals into digital audio data. A data file recording unit records the digital audio data, as digital audio data file information, on a recording medium, the recording medium having a plurality of clusters in which data having a predetermined number of bytes is recorded, the digital audio file information being recorded over a plurality of clusters. A file management information recording unit records on the recording medium file management information representing the reproducing order of the clusters in which the digital audio data file information is recorded.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: October 15, 1996
    Assignee: Teac Corporation
    Inventors: Akinori Mawatari, Tetsuji Ono, Hideo Kitayama, Makoto Tsukada, Kazumu Abe, Yoshinori Matsuoka, Toshio Mori, Tomoko Mita
  • Patent number: 5538465
    Abstract: An elastic foamed sheet is disclosed which is usable as waxless polishing backing pads for wafers and capable of producing mirror polish wafers excelling in flatness.
    Type: Grant
    Filed: January 6, 1995
    Date of Patent: July 23, 1996
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Shigeyoshi Netsu, Kihachiro Watanabe, Makoto Tsukada
  • Patent number: 5409770
    Abstract: An elastic foamed sheet is disclosed which is usable as waxless polishing backing pads for wafers and capable of producing mirror polish wafers excelling in flatness.
    Type: Grant
    Filed: March 23, 1993
    Date of Patent: April 25, 1995
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Shigeyoshi Netsu, Kihachiro Watanabe, Makoto Tsukada
  • Patent number: 5333020
    Abstract: Mounted on a horizontal shaft 1 extending along surfaces of a film f are sprocket wheels 2 each having three tooth pairs 2a adapted to engage with perforations on the film. The tooth pairs 2a are angularily spaced apart from each other by 120 degrees around a periphery of the sprocket wheel 2. A triangular cam 11 is attached on one end of a horizontal shaft 7 rotatable in unison with the shaft 1. A lever 17 is attached to a horizontal shaft 15 carrying a cam follower 16 rotatable in unison with the rotation of the cam 11. A projection 20 which reciprocates registration pins 22 for engagement with and disengagement from the perforations g of the film f is fitted into an elongated slot 17a of the lever 17. A switching lever 14 is provided for displacement of the shaft 7 into a position where the shaft 7 is prevented from rotating even when the horizontal shaft 1 is rotated.
    Type: Grant
    Filed: July 20, 1993
    Date of Patent: July 26, 1994
    Assignee: Imagica Corp.
    Inventors: Makoto Tsukada, Yutaka Tokue
  • Patent number: 5282289
    Abstract: A scrubber cleaner for cleaning the unsucked face and peripheral chamfers of a semiconductor wafer. A wafer holder capable of holding the wafer by vacuum suction and turning the wafer circumferentially, and including a wafer suction head for fixing the wafer on it and a motor to rotate the suction head. A brush assembly including a rotatory plate having a brushing surface on one side consisting of a flat ring portion and a side-of-cylinder portion, and being capable of shifting axially and in radial directions; a motor for rotating the rotatory plate circumferentially; an air cylinder for shifting the rotatory plate axially; and another air cylinder for shifting the rotatory plate in radial directions.
    Type: Grant
    Filed: December 28, 1992
    Date of Patent: February 1, 1994
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Fumihiko Hasegawa, Makoto Tsukada, Hideo Kudo, Masayuki Yamada, Isao Uchiyama
  • Patent number: 5226758
    Abstract: A semiconductor wafer handling apparatus and method for transferring a wafer, one of whose faces has been already polished, from a wafer holder, which holds the wafer with the wafer's polished face facing downward, to a wafer cassette submerged in water contained in a water tank; the apparatus includes a wafer receive assembly and a water tank and the wafer receive assembly has a flat surface and is adapted to swing between an up-facing position at which the flat surface faces upward and a down-facing position at which the flat surface faces downward, and the wafer receive assembly is provided with ejection nozzles which eject water with a force sufficient to keep the wafer floating, and the water tank contains a wafer cassette to receive the wafer, and is capable of forcing the wafer which is left to sink in the water to enter the wafer cassette; whereas the method comprises: dropping the wafer from the wafer holder with the polished face facing downward onto a thin water layer formed over the wafer receive
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: July 13, 1993
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Kohichi Tanaka, Makoto Tsukada, Fumio Suzuki