Patents by Inventor Makoto Tsutsui

Makoto Tsutsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8795516
    Abstract: A gypsum dewatering device 2 installed in a desulfurization facility 105 in which sulfur oxide in flue gas G is absorbed by limestone in an absorber 1, includes a belt filter 22 that absorbs sulfur oxide and dewaters gypsum slurry SS fed from the absorber 1 to form a gypsum cake SC, a vacuum suction mechanism 23 that sucks moisture in the gypsum cake SC via the belt filter 22, a moisture measuring means H1 that measures a moisture content of the gypsum cake SC to be dewatered by the belt filter 22, a heating means 25 that heats the gypsum cake SC dewatered by the belt filter 22 by hot water or steam, and a control means 26 that controls a heated state by the heating means 25 when the moisture content of the gypsum cake SC input from the moisture measuring means H1 has exceeded a predetermined amount.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: August 5, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Hideki Ito, Naoyuki Kamiyama, Makoto Tsutsui, Seiji Kagawa, Tatsuto Nagayasu, Norikazu Inaba
  • Publication number: 20120285326
    Abstract: A gypsum dewatering device 2 installed in a desulfurization facility 105 in which sulfur oxide in flue gas G is absorbed by limestone in an absorber 1, includes a belt filter 22 that absorbs sulfur oxide and dewaters gypsum slurry SS fed from the absorber 1 to form a gypsum cake SC, a vacuum suction mechanism 23 that sucks moisture in the gypsum cake SC via the belt filter 22, a moisture measuring means H1 that measures a moisture content of the gypsum cake SC to be dewatered by the belt filter 22, a heating means 25 that heats the gypsum cake SC dewatered by the belt filter 22 by hot water or steam, and a control means 26 that controls a heated state by the heating means 25 when the moisture content of the gypsum cake SC input from the moisture measuring means H1 has exceeded a predetermined amount.
    Type: Application
    Filed: September 30, 2010
    Publication date: November 15, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Hideki Ito, Naoyuki Kamiyama, Makoto Tsutsui, Seiji Kagawa, Tatsuto Nagayasu, Norikazu Inaba
  • Patent number: 7472541
    Abstract: Provided is a compressor control unit with a high response ability to changes of gas condition of a compressor (compressor suction temperature, pressure, gas specific gravity, pressure ratio of suction pressure and discharge pressure). In the control unit for a compressor that supplies gas into a gas turbine through a header tank, an inlet gas condition is measured and a load command value from a gas turbine controller is corrected to be increased or decreased corresponding to the measured inlet gas condition.
    Type: Grant
    Filed: November 7, 2005
    Date of Patent: January 6, 2009
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Kazuhiro Takeda, Kazuko Takeshita, Makoto Tsutsui, Hiroaki Yoshida, Kengo Hirano
  • Patent number: 7337513
    Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
    Type: Grant
    Filed: July 25, 2006
    Date of Patent: March 4, 2008
    Assignees: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.
    Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
  • Publication number: 20060270115
    Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
    Type: Application
    Filed: July 25, 2006
    Publication date: November 30, 2006
    Applicants: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.
    Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
  • Patent number: 7135754
    Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
    Type: Grant
    Filed: January 13, 2004
    Date of Patent: November 14, 2006
    Assignees: Nec Tokin Corporation, Nec Tokin Toyama, Ltd.
    Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui
  • Publication number: 20060101824
    Abstract: Provided is a compressor control unit with a high response ability to changes of gas condition of a compressor (compressor suction temperature, pressure, gas specific gravity, pressure ratio of suction pressure and discharge pressure). In the control unit for a compressor that supplies gas into a gas turbine through a header tank, an inlet gas condition is measured and a load command value from a gas turbine controller is corrected to be increased or decreased corresponding to the measured inlet gas condition.
    Type: Application
    Filed: November 7, 2005
    Publication date: May 18, 2006
    Inventors: Kazuhiro Takeda, Kazuko Takeshita, Makoto Tsutsui, Hiroaki Yoshida, Kengo Hirano
  • Patent number: 6882521
    Abstract: A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.
    Type: Grant
    Filed: December 16, 2003
    Date of Patent: April 19, 2005
    Assignees: NEC Tokin Corporation, NEC Tokin Toyama, Ltd.
    Inventors: Makoto Tsutsui, Toshihisa Nagasawa
  • Publication number: 20040160730
    Abstract: A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.
    Type: Application
    Filed: December 16, 2003
    Publication date: August 19, 2004
    Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.
    Inventors: Makoto Tsutsui, Toshihisa Nagasawa
  • Publication number: 20040145065
    Abstract: In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
    Type: Application
    Filed: January 13, 2004
    Publication date: July 29, 2004
    Applicants: NEC TOKIN Corporation, NEC TOKIN Toyama, Ltd.
    Inventors: Mitsunori Sano, Takashi Kono, Makoto Tsutsui