Patents by Inventor Makoto Uchida
Makoto Uchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9075506Abstract: Systems and methods for providing real-time analysis of feature relationships are provided. In some aspects, a method includes receiving user activity data and user status data for users in the interactive network, the interactive network comprising at least two user features; generating a user dataset by associating, for each user, the user's activity data with the user's status data using a unique identification of the user and a timestamp; analyzing the user dataset using a statistical model; and providing, for display, an output of the analysis by the statistical model, the output including an indicator of a relationship between a use of one of the two user features with a use of the other of the two user features.Type: GrantFiled: October 16, 2012Date of Patent: July 7, 2015Assignee: Google Inc.Inventors: Makoto Uchida, David Andrew Huffaker, Abhijit Bose
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Patent number: 8765314Abstract: A fuel cell system includes a fuel cell; a fuel gas supplying unit supplying the fuel gas into the fuel cell on the anode side thereof; an oxidizing agent gas supplying unit supplying the oxidizing agent gas into the fuel cell on the cathode side thereof; a raw material gas supplying unit supplying the raw material gas into the fuel cell; and a controlling unit controlling the supply of the fuel gas, the oxidizing agent gas and the raw material gas. After switching the output of electric power or the fuel cell off, the fuel gas supplying unit suspends the supply of the fuel gas, the oxidizing agent gas supplying unit suspends the supply of the oxidizing agent gas and the raw material gas supplying unit supplies the raw material gas into the fuel cell to purge the fuel cell on the cathode side.Type: GrantFiled: August 24, 2004Date of Patent: July 1, 2014Assignee: Panasonic CorporationInventors: Yasushi Sugawara, Junji Morita, Makoto Uchida, Takayuki Urata, Shinya Kosako, Takahiro Umeda, Soichi Shibata, Masataka Ozeki, Akinari Nakamura, Yoshikazu Tanaka, Yoichiro Tsuji
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Patent number: 8706733Abstract: A system and method for facilitating automatic objective-based feature improvement, the method including receiving a request to identify an optimal alternative for each of one or more features of a computer-implemented entity, determining an alternative feature range for each of the one or more features, the alternative feature range defining a range of possible alternative features available with respect to the feature, selecting one or more alternative features for each feature from the alternative feature range of the feature, generating a plurality of alternative sets, each including an alternative feature for at least one of the one or more features, selecting a plurality of user groups from a pool of users and assigning each user group of the plurality of users groups to one of the plurality of alternative sets based on user characteristics of the users and historical information regarding the interaction of the user with the computer-implemented entity.Type: GrantFiled: July 27, 2012Date of Patent: April 22, 2014Assignee: Google Inc.Inventors: Zach Yeskel, David Andrew Huffaker, Rachel Ida Rosenthal Schutt, Andrew Stephen Tomkins, David Andrew Gibson, Abhijit Bose, Alexander Fabrikant, Makoto Uchida
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Patent number: 8410620Abstract: The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3?,4?-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3?,4?-benzophenone tetracarboxylic acid, R2 represents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4?-hydroxydiphenylsulfone, 4,4?-diamino-3,3?5,5?-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor devicType: GrantFiled: September 18, 2008Date of Patent: April 2, 2013Assignee: Nippon Kayaku Kabushiki KaishaInventors: Makoto Uchida, Shigeru Moteki, Ryutaro Tanaka, Hiromi Morita
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Publication number: 20120295184Abstract: Disclosed is an oxide and/or nitride support for electrode catalysts, which is used for electrodes for polymer electrolyte fuel cells (PEFC). The support for electrode catalysts is an aggregation body of primary particles of oxide of at least one kind of metal selected from rare earths, alkaline earths, transition metals, niobium, bismuth, tin, antimony, zirconium, molybdenum, indium, tantalum, and tungsten, and the aggregation body is configured such that at least 80% of the metal oxide primary particles having a size of 5 nm to 100 nm aggregate and bind each other to form dendritic or chain structures each of which is made of 5 or more of the metal oxide primary particles.Type: ApplicationFiled: November 26, 2010Publication date: November 22, 2012Inventors: Masahiro Watanabe, Katsuyoshi Kakinuma, Makoto Uchida, Takeo Kamino, Hiroyuki Uchida
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Publication number: 20120288725Abstract: Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy the relation: 0.005?n/(m+n)<1, and m+n is an integer which is more than 0 but equal to or less than 200, Ar1 represents a divalent aromatic group, Ar2 represents a divalent aromatic group having a phenolic hydroxy group, and Ar3 represents a divalent aromatic group), an epoxy resin (B), a curing catalyst (C), an inorganic filler (D), and an epoxy resin curing agent other than the component (A) as an optional component, in which the amount of the component (D) contained therein relative to 100 parts by mass of the total amount of the components (A) to (C) and the epoxy resin curing agent as the optional component is 30 to 950 parts by mass.Type: ApplicationFiled: March 10, 2011Publication date: November 15, 2012Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Ryutaro Tanaka, Makoto Uchida, Shigeru Moteki, Yasumasa Akatsuka
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Publication number: 20120178332Abstract: The present invention relates to a fiber comprising a heat curable polyamide resin composition containing both a) a phenolic hydroxy group-containing polyamide and b) an epoxy resin having two or more epoxy groups in one molecule, a nanofiber comprising said resin composition obtained by electrospinning method, a nonwoven fabric obtained by applying heat treatment to a laminate of said nanofiber, a method for producing said nanofiber by electrospinning method and a heat curable polyamide resin composition for fiber. A nonwoven fabric can be obtained only by subjecting a deposit of the nanofiber obtained by electrospinning method to heat treatment, nanofibers in the obtained nonwoven fabric are bonded to each other by heat-curing, and the nonwoven fabric has such characteristics that its mechanical strength, heat resistance and chemical resistance are excellent and that it has a high strength.Type: ApplicationFiled: October 22, 2010Publication date: July 12, 2012Applicant: NIPPON KAYAKU KABUSHIKI KAISHAInventors: Makoto Uchida, Yasumasa Akatsuka, Kazunori Ishikawa, Shigeru Moteki
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Patent number: 8114940Abstract: The present invention relates to a phenolic hydroxy group-containing rubber-modified polyamide resin which has, in the molecule, a phenolic hydroxy group-containing aromatic polyamide segment having a structure represented by the following formula (A) (wherein, m and n are average values and Ar represents a divalent aromatic group) and a butadiene (co)polymer segment selected from the following formula (B-1) or (B-2), —(CH2—CH?CH—CH2)X—??(B-1) —(CH2—CH?CH—CH2)Y—(CH2—CH(CN))Z—??(B-2) (wherein, each of x, y and z is an average value and 0.01?z/(y+z)?0.13, x represents a positive number of 5 to 200, and also y+z is a positive number of 10 to 200), and a resin composition containing said resin, in particular an epoxy resin composition; a cured product of said epoxy resin composition is excellent in flexibility, heat resistance and electrical properties especially at high temperature and high humidity.Type: GrantFiled: October 26, 2006Date of Patent: February 14, 2012Assignee: Nippon Kayaku Kabushiki KaishaInventors: Kazunori Ishikawa, Makoto Uchida, Shigeru Moteki
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Patent number: 8080319Abstract: Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.Type: GrantFiled: October 18, 2006Date of Patent: December 20, 2011Assignee: Kippon Kayaku Kabushiki KaishaInventors: Ryutaro Tanaka, Makoto Uchida, Hiroo Koyanagi
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Patent number: 8039154Abstract: Problems of acceleration of drying of electrolyte membrane and local reaction, etc. can be properly coped with to attain the stabilization of performance of fuel cell.Type: GrantFiled: August 24, 2004Date of Patent: October 18, 2011Assignee: Panasonic CorporationInventors: Junji Morita, Makoto Uchida, Yasushi Sugawara, Takayuki Urata, Shinya Kosako, Takahiro Umeda, Soichi Shibata, Yoichiro Tsuji, Masataka Ozeki, Akinari Nakamura, Yoshikazu Tanaka
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Patent number: 7981571Abstract: A solid polymer electrolyte fuel cell includes a membrane electrode assembly having an anode, a cathode arranged facing the anode, and a polyelectrolyte membrane arranged between the anode and the cathode, and a pair of separator plates that are arranged facing each other so as to sandwich the membrane electrode assembly, and have an anode side gas channel for supplying a fuel gas to the anode, and a cathode side gas channel for supplying an oxidant gas to the cathode, formed thereon, wherein the catalyst layer of the anode contains at least one electrode catalyst selected from the group consisting of Pt particles and Pt alloy particles, having a particle diameter of from 6 to 10 nm, the catalyst layer of the anode has a thickness of from 1 to 5 ?m, Pt volume density in the catalyst layer of the anode is from 1 to 5 g/cm3, the catalyst layer of the cathode has a thickness of 10 ?m or more, and Pt volume density in the catalyst layer of the cathode is from 0.1 to 0.5 g/cm3.Type: GrantFiled: July 12, 2005Date of Patent: July 19, 2011Assignee: Panasonic CorporationInventors: Yoichiro Tsuji, Yasuhiro Ueyama, Makoto Uchida, Yusuke Ozaki
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Patent number: 7943261Abstract: A method of operating a fuel cell capable of suppressing degradation of a fuel cell caused by starting and stopping of the fuel cell, including carrying out a restoring operation by decreasing a voltage of the cathode following termination of the fuel cell.Type: GrantFiled: October 30, 2003Date of Patent: May 17, 2011Assignee: Panasonic CorporationInventors: Yasuo Takebe, Kazuhito Hatoh, Hiroki Kusakabe, Teruhisa Kanbara, Makoto Uchida, Shinya Kosako, Yoichiro Tsuji, Yasushi Sugawara
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Patent number: 7863345Abstract: A process for producing a microparticulate hardening catalyst, comprising the steps of jetting a liquid composition containing epoxy resin hardening catalyst (A), monomer having an ethylenically unsaturated group (B) and photopolymerization initiator (C) through a minute nozzle into a gas so as to form microparticles; and while the microparticles are floating, irradiating the same with high-energy rays to thereby effect polymerization of the monomer having an ethylenically unsaturated group (B).Type: GrantFiled: July 6, 2006Date of Patent: January 4, 2011Assignee: Nippon Kayaku Kabushiki KaishaInventors: Hiroo Koyanagi, Makoto Uchida, Shigeru Moteki
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Publication number: 20100233476Abstract: The present invention relates to a copper foil having a primer resin layer which improves the adhesive strength between a copper foil surface without roughening treatment and a substrate resin and a laminated sheet using the same and is characterized by using a polyimide represented by the following formula (1): (wherein, R1 represents a quadrivalent aromatic group which is a residual group of a dicarboxylic acid dianhydride ingredient (pyromellitic acid anhydride, 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride, 3,3?,4,4?-benzophenontetracarboxylic acid dianhydride or 2,3,6,7-naphthalenetetracarboxylic acid dianhydride), R2 represents a divalent aromatic group which is a residual group of a diamine ingredient (1,3-bis-(3-aminophenoxy)benzene, 3,3?-diamino-4,4?-dihydroxydiphenylsulfone or/and 4,4?-diamino-3,3?,5,5?-tetraethyldiphenylmethane), and n1 represents a repeating number) as a primer resin; and copper foils and laminated sheets having said polyimide layer as a primer have high adhesive strengthType: ApplicationFiled: June 19, 2007Publication date: September 16, 2010Inventors: Makoto Uchida, Ryutaro Tanaka, Shigeo Hayashimoto, Shigeru Moteki, Mitsuyo Nishitoh
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Publication number: 20100207282Abstract: The present invention relates to a primer resin for semiconductor devices which comprises a polyamide resin represented by the following formula (1): (wherein, R1 represents a tetravalent aromatic tetracarboxylic acid residue selected from the group consisting of pyromellitic acid, 3,4,3?,4?-diphenyl ether tetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid and 3,4,3?,4?-benzophenone tetracarboxylic acid, R2 represents at least one kind of divalent diamine residue selected from the group consisting of diamino-4,4?-hydroxydiphenylsulfone, 4,4?-diamino-3,3?5,5?-tetraethyldiphenylmethane and 1,3-bis-(aminophenoxy)benzene, and n is a repeating number and represents a positive number of 10 to 1000) and has a lead frame comprising copper or 42 alloy, a semiconductor device having said primer resin layer between a lead frame comprising copper or 42 alloy and a cured product of a sealing resin, and a semiconductor sealing epoxy resin composition containing said primer resin; and said semiconductor devicType: ApplicationFiled: September 18, 2008Publication date: August 19, 2010Applicant: Nippon Kayaku Kabushiki KaishaInventors: Makoto Uchida, Shigeru Moteki, Ryutaro Tanaka, Hiromi Morita
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Publication number: 20100129604Abstract: An object of the present invention is to provide a copper foil with a resin layer to be used as a resin substrate for a flexible printed wiring board and having good adhesiveness between the copper foil, to which no roughening treatment is applied, and a raw material resin layer. A copper foil with a resin layer characterized in that a copper foil having no roughening treatment applied thereto is directly joined to a resin layer, which contains a phenolic hydroxyl group-containing aromatic polyamide resin having a structure represented by the following formula (1): in the formula (1), m and n denote average values and satisfy the relationship: 0.005?n/(m+n)<0.05, m+n is 2 to 200; Ar1 is a divalent aromatic group; Ar2 is a divalent aromatic group having a phenolic hydroxyl group, and Ar3 is a divalent aromatic group.Type: ApplicationFiled: May 13, 2008Publication date: May 27, 2010Inventors: Makoto Uchida, Ryutaro Tanaka, Shigeo Hayashimoto
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Publication number: 20100096169Abstract: The invention provides a phenolic hydroxyl group-containing rubber-modified polyamide resin capable of providing a cured product with excellent heat resistance, adhesion properties, electrically insulating property and flame retardance and having a sufficient flexibility when being shaped into a film, which is characterized by having in its molecule (a) a phenolic hydroxyl group-containing aromatic polyamide segment represented by the following formula (1): (in the formula (1), m and n are average values and satisfy a relationship of 0.005?n/(m+n)?1.00 and m+n is an integer of 2-200, and Ar1 is a bivalent aromatic group, Ar2 is a bivalent aromatic group having a phenolic hydroxyl group and Ar3 is a bivalent aromatic group) and (b) a hydrogenated butadiene polymer segment.Type: ApplicationFiled: December 11, 2007Publication date: April 22, 2010Applicant: NIPPONKAYAKU KABUSHIKIKAISHAInventors: Ryutaro Tanaka, Makoto Uchida, Mitsuyo Nishitoh
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Patent number: 7687184Abstract: In a conventional polymer membrane electrode assembly, particularly when operated for a long period of time, a portion of the polymer electrolyte membrane to be in contact with the gas diffusion layer has suffered significant degradation. In order to address this, in a membrane electrode assembly including a hydrogen ion conductive polymer electrolyte membrane, a pair of catalyst layers arranged on both surfaces of the polymer electrolyte membrane, and a pair of gas diffusion layers, each including a fibrous substrate, arranged on the outer surfaces of the catalyst layers, a thickness TA of a center portion that faces the catalyst layer and a thickness TB of a peripheral portion surrounding the center portion are set to satisfy a expression (1): 0.7?TB/TA?0.9.Type: GrantFiled: September 22, 2005Date of Patent: March 30, 2010Assignee: Panasonic CorporationInventors: Masaki Yamauchi, Yoshihiro Hori, Akihiko Yoshida, Mikiko Yoshimura, Makoto Uchida
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Publication number: 20100035182Abstract: The present invention relates to a positive type photosensitive polyimide resin composition comprising a phenolic hydroxy group-containing soluble polyimide resin (A) formed from a tetrabasic acid dianhydride (a), an aminophenol compound having at least two amino groups and at least one phenolic hydroxy group in one molecule (b), and a diamino compound (c); a diazo-based positive type photosensitizer (B); and an epoxy resin (C). Using the positive type photosensitive polyimide resin composition of the present invention, a resin composition which allows easy patterning, satisfies various properties such as flame retardancy, heat resistance, mechanical properties and flexibility, and is capable of coping with high functionalization of various electronic devices, and a cured product thereof can be provided.Type: ApplicationFiled: April 7, 2008Publication date: February 11, 2010Applicant: Nippon Kayaku Kabushiki KaishaInventors: Ryutaro Tanaka, Makoto Uchida, Kenji Sekine
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Patent number: 7622215Abstract: To provide a polymer electrolyte membrane having excellent size stability and excellent mechanical strength that can sufficiently prevent the size change due to the swelling condition, the displacement of the polymer electrolyte membrane and the formation of wrinkles during the production of the polymer electrolyte fuel cell, and can prevent damage during the production and operation of the polymer electrolyte fuel cell. In a composite electrolyte membrane including a porous reinforcement layer made of a resin and an electrolyte layer made of a polymer electrolyte and laminated at least one main surface of the reinforcement layer, the direction having a high tensile modulus of elasticity in the reinforcement layer is substantially corresponded with the direction having a high rate of size change in the electrolyte layer.Type: GrantFiled: March 4, 2005Date of Patent: November 24, 2009Assignees: Panasonic Corporation, Asahi Glass Co., Ltd.Inventors: Yoshihiro Hori, Akihiko Yoshida, Mikiko Yoshimura, Makoto Uchida, Shinji Kinoshita, Hirokazu Wakabayashi