Abstract: A System-in-Package includes a first chip to be mounted in common for a plurality of product types, a second chip having different specifications for each product type, and a wiring substrate being common to a plurality of product types, on which the first chip and the second chip are to be mounted. A setting signal is supplied from the second chip to the first chip.

Abstract: A method for producing an electronic element comprising a housing composed of an insulating ceramic substrate and a lid member covering a surface of the ceramic substrate, with at least one electronic element being mounted inside the housing. After preparing a plate-like ceramic substrate by baking a composite containing inorganic powders and a binder, the ceramic substrate is shaped in accordance with a predetermined design of the device, a metalized layer is formed on a surface of the shaped ceramic substrate, an electronic element is mounted in a predetermined area of the ceramic substrate, and the ceramic substrate is sealed with the lid member.

Abstract: A method for producing an electronic element comprising a housing composed of an insulating ceramic substrate and a lid member covering a surface of the ceramic substrate, with at least one electronic element being mounted inside the housing. After preparing a plate-like ceramic substrate by baking a composite containing inorganic powders and a binder, the ceramic substrate is shaped in accordance with a predetermined design of the device, a metalized layer is formed on a surface of the shaped ceramic substrate, an electronic element is mounted in a predetermined area of the ceramic substrate, and the ceramic substrate is sealed with the lid member.

Abstract: An interpolation circuit for calculating the value of an arbitrary point by interpolation using the values of points on the boundaries of a domain which surrounds the arbitrary point comprises a partial product generation circuit composed of multiplexers and a partial product addition circuit for adding partial products generated by the partial product generation circuit together. When an interpolated value f(C) between f(Ci) and f(Ci+1) (where the integer part of C is Ci and the decimal part of C as a binary number of n digits is c=C.sub.n-1 2.sup.n-1 +C.sub.n-2 2.sup.n-2 + . . . +C.sub.1 2.sup.1 +C.sub.0 2.sup.0) is calculated by the interpolation circuit, each multiplexer MPk+1 (k=0, 1, . . . , n-2, n-1) corresponding to 2.sup.k of the decimal part c is supplied with two input values f(Ci) and f(Ci+1) and one selection signal Ck (k=0, 1, . . .

Abstract: With a cylindrical case (10) and a base (18) for sealing an aperture part of the case (10), a piezo-electric transducer is enclosed in the case (10). The base (18) has a cylindrical shape and its section intersecting its axis at right angles at the part where the base (18) comes into contact with the case (10) is elliptical or nearly elliptical. The shape of an inner circumference of a section of the case (10) intersecting its axis at right angles at the part where the case (10) touches the base (18) is smaller than that of the section of the base (18), and is elliptical or nearly elliptical. The case (10) is a cylinder with one end closed and one end open. The piezo-electric transducer is enclosed by press fitting the base (18) into the open end of the case (10). In this case, a press-fitting allowance has a maximum value at parts between minor and major axes of the ellipse or near ellipse.

Abstract: In a first glass bonding process, a silicon-dioxide layer is formed on either a first or second magnetic material by vacuum evaporation. The first or second magnetic material with the silicon-dioxide layer is dipped in a warm solution containing alkali sodium or potassium for a predetermined period of time. Alkali metal is diffused on a surface of the silicon-dioxide layer to form a glass layer thereon, thereby bonding the first and second magnetic materials.

Abstract: A pair of parallel frame members 30 and 31 are formed in the inner bobbin faces of recording/reproducing and erasing coil assemblies 3, 4 on the opposite sides and spaced equidistant from a core tip center line T. An orthogonal frame member 32 is formed on the outer side of each of the bobbin end face to extend in a direction perpendicular to the parallel frame members 30 and 31. The end of the orthogonal frame member 32 extending toward an auxiliary sliding face 15 of a slider 2 extends outwardly from one of the parallel frame members 31. The recording/reproducing and erasing coil assemblies 3 and 4 are disposed asymmetrically to each other about the core tip center line T. When the recording/reproducing and erasing coil assemblies 3 and 4 are respectively housed in coil assembly receiving portions 26 and 27, the coil assemblies 3 and 4 will not extend outwardly beyond a slider plane projection line C.

Abstract: A magnetic head is manufactured by the steps of accommodating a core chip blank into an elongated hole provided in a slider blank, joining the core chip blank and the slider blank together with glass and then grinding the surface to form a surface which makes sliding-contact with a recording medium. Glass for joining the core chip blank and the slider blank together is obtained by melting a glass rod mounted in a predetermined position on the slider blank. In order to prevent the core chip from being positionally moved by surface tension of the molten glass when the glass rod is melted, the edges of the elongated hole are partially provided with protrusions for positioning the glass rod so as to prevent surface tension of the molten glass from positionally moving the core chip.

Abstract: A magnetic head is manufactured by the steps of accommodating a core chip blank into an elongated hole provided in a slider blank, joining the core chip blank and the slider blank together with glass and then grinding the surface to form a surface which makes sliding-contact with a recording medium. Glass for joining the core chip blank and the slider blank together is obtained by melting a glass rod mounted in a predetermined position on the slider blank. In order to prevent the core chip from being positionally moved by surface tension of the molten glass when the glass rod is melted, the edges of the elongated hole are partially provided with protrusions for positioning the glass rod so as to prevent surface tension of the molten glass from positionally moving the core chip.

Abstract: In a combined magnetic head of the present invention, a slider (20) for holding a combined magnetic core (10) has a couple of anti-slant noses (25) whose confronting surfaces each include an abutment ridge (26) extending along the height of the anti-slant nose and intended to be abutted against the combined magnetic core which has been inserted into a core slit (22) of the slider. This construction enables the interval between the couple of noses to be accurately adjusted in conformity with the thickness of the combined magnetic core at the time of integral molding of the slider. As a result, a secure prevention of the slant of the combined magnetic core can be accomplished to ensure an accurate positioning of the combined magnetic core with respect to the slider.

Abstract: In a method of manufacturing a tunnel erase type combined magnetic head core using a first core member having a predetermined pole height dimension defined by a surface on a magnetic gap formation side and an apex, and a predetermined back height dimension defined by the apex and a bottom of a coil core into which a coil is inserted, and a second core member, the bottom of the coil core of the first core member is used as a back height reference face and the combined magnetic head core is manufactured with the back height reference face as reference, thereby facilitating processing of a surface on the pole height side at intermediate steps, namely, a final contact face with which magnetic recording media are brought into contact. Since the back height reference face is used as reference, when combined core chips are incorporated into sliders to manufacture magnetic heads, the process is not affected by variations in core dimensions.

Abstract: A magnetic head includes a core chip, a slider having an aperture for receiving the core chip and protrusions for positioning and constraining the core chip received in the aperture. The protrusions are formed on the inner walls of the aperture. After the core chip has been inserted into the aperture, a molten welding material is flowed into the clearance between the core chip and the inner walls of the aperture so as to weld the core chip to the inner walls of the aperture in the slider. The clearance between the core chip and the inner walls of the aperture is equalized. If the core chip is formed of soft magnetic material, the slider can absorb electromagnetic noises.

Abstract: A structure of an electrode film deposited on a tuning fork-type quartz crystal vibrator in which an electrode film on a tuning fork-type quartz crystal vibrator has a laminated structure obtained by forming, in the order mentioned, three overlapping layers, namely layers of chrome, nickel and silver, or two overlapping layers, namely layers of nickel and silver, on the surface of a tuning fork-shaped quartz crystal from the side nearest thereto, and in which the thickness of each layer of the electrode film is less than 300 A for the chrome layer, less than 500 A for the nickel layer, and less than 2000 A for the silver layer.

Abstract: A metal electrode film is formed by evaporation on a tuning fork-type quartz crystal vibrator by means of a thin flat mask which has a portion of reduced thickness so that the metallic evaporant is deposited beneath the thinner portion of the mask. In forming electrodes on a tuning fork-type quartz crystal vibrator having X, Y and Z surfaces, a mask has a portion which is positioned in the X-plane between the evaporative deposition source and the inner end of the slit between the tines of vibrator so that the metallic film is prevented from being deposited on portions of the X and Y surfaces of the vibrator adjacent to the inner end of the slit.