Abstract: A curing process of an ultraviolet curable paint by which a paint cured layer can be formed on an object to be processed without needing a long time, and intended color can be obtained of the object to be processed on which the paint cured layer is formed. The curing process of an ultraviolet curable paint is one for curing an ultraviolet curable paint through an ultraviolet irradiation step of irradiating a surface of an object to be processed to which the ultraviolet curable paint is applied with ultraviolet rays from an ultraviolet radiation unit. The ultraviolet curable paint is not sensitive to light of not less than 380 nm in wavelength but sensitive to light of less than 380 nm in wavelength. The ultraviolet radiation unit radiates ultraviolet rays having a peak wavelength within a range of not greater than 350 nm in wavelength.

Abstract: An object of the present invention is to provide a method of joining resin tubes, in which the degree of freedom of selecting a tube material is large, and further a defect such as stiffness and contraction at joining portions of the tubes is not developed. The method of joining resin tubes according to the present invention is a method of joining resin tubes so that a first tube is joined to a second tube, the first tube and the second tube each being made of synthetic resin, the method comprising: a surface activation step of activating each of a joining region of the first tube and a joining region of the second tube; and an adhesion step of adhering the joining region of the first tube obtained via the surface activation step with the joining region of the second tube obtained via the surface activation step to each other.

Abstract: A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.

Abstract: An object of the present invention is to provide a process for laminating works together that are capable of giving laminates a high bonding strength ensured therein.

Abstract: An object of the present invention is to provide a method of joining resin tubes, in which the degree of freedom of selecting a tube material is large, and further a defect such as stiffness and contraction at joining portions of the tubes is not developed. The method of joining resin tubes according to the present invention is a method of joining resin tubes so that a first tube is joined to a second tube, the first tube and the second tube each being made of synthetic resin, the method comprising: a surface activation step of activating each of a joining region of the first tube and a joining region of the second tube; and an adhesion step of adhering the joining region of the first tube obtained via the surface activation step with the joining region of the second tube obtained via the surface activation step to each other.

Abstract: An object of the present invention is to provide a process for laminating works together that are capable of giving laminates a high bonding strength ensured therein.

Abstract: Provided is a workpiece bonding method that makes it possible to achieve a joining state with a high strength and to obtain a good repeatability of the joining state. A workpiece bonding method according to the present invention is a workpiece bonding method for bonding two workpieces to each other, each of the two workpieces being composed of a material selected from the group consisting of synthetic resin, glass, silicon wafer, crystal and sapphire, the workpiece bonding method including: a surface activation step of activating a bonded surface of at least one of the workpieces; and a laminating step of laminating the two workpieces such that respective bonded surfaces contact with each other, and a pretreatment step of removing moisture from the bonded surface of the workpiece that is to be subjected to the surface activation step is performed before the surface activation step is performed.

Abstract: A curing process of an ultraviolet curable paint by which a paint cured layer can be formed on an object to be processed without needing a long time, and intended color can be obtained of the object to be processed on which the paint cured layer is formed. The curing process of an ultraviolet curable paint is one for curing an ultraviolet curable paint through an ultraviolet irradiation step of irradiating a surface of an object to be processed to which the ultraviolet curable paint is applied with ultraviolet rays from an ultraviolet radiation unit. The ultraviolet curable paint is not sensitive to light of not less than 380 nm in wavelength but sensitive to light of less than 380 nm in wavelength. The ultraviolet radiation unit radiates ultraviolet rays having a peak wavelength within a range of not greater than 350 nm in wavelength.

Abstract: Disclosed are a desmear treatment method for a wiring board material that can sufficiently perform a desmear treatment on the interior of a through hole formed in an insulating layer without requiring a complicated step and can obtain an insulating layer having appropriate surface roughness, a method of manufacturing a wiring board material to be subjected to the desmear treatment method, and a composite insulating layer forming material used in the manufacturing method. The desmear treatment method of the present invention is a desmear treatment method for a wiring board material in which an insulating layer made of a resin containing a filler is layered on a conductive layer. The desmear treatment method includes: a hole forming step of forming a hole passing through the insulating layer in a thickness direction thereof; and a desmear treatment step of treating the wiring board material having undergone the hole forming step with radicals.

Abstract: Provided is a low-dielectric constant material curing process including irradiating a low-dielectric constant material on a semiconductor substrate with ultraviolet rays. In the low-dielectric constant material curing process, the ultraviolet light source is a fluorescent lamp including: a light-emitting tube sealed and filled with a discharge gas containing xenon gas; a pair of electrodes for inducing a discharge in the interior space of the light-emitting tube; a dielectric material being interposed between the interior space and at least one of the pair of electrodes; and a phosphor layer formed on a surface of the light-emitting tube and containing a phosphor that is excited by light generated from the discharge gas by a discharge in the interior space. The phosphor emits ultraviolet rays having a wavelength within a range of 180 to 300 nm.