Abstract: The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

Abstract: The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

Abstract: The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:

Abstract: Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 ?m and a glass filler having an average particle diameter of 1.0 to 3.0 ?m, a specific gravity of 2.3 to 2.6 g/cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.

Abstract: It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 ?m, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 ?m.

Abstract: Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 ?m and a glass filler having an average particle diameter of 1.0 to 3.0 ?m, a specific gravity of 2.3 to 2.6 g/cm3 and a SiO2 content of 50 to 65% by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50% by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.

Abstract: The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:

Abstract: It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: It is an object of the present invention to provide a printed circuit board that can be housed at high density in the enclosures of electronic devices. The printed circuit board (40) according to a preferred embodiment of the invention has a construction with a substrate (1), a conductor (7) formed in a flexible region (36) and conductors (8,9) formed in non-flexible regions (46). The conductor (7) formed in the flexible region (36) has a total thickness of 1-30 ?m, and the conductors (8,9) formed in the non-flexible regions (46) have a total thickness of 30-150 ?m.

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: It is an object of the present invention to provide a multilayer circuit board that can be housed at high density in the enclosures of electronic devices. According to a preferred embodiment of the invention, a multilayer circuit board (12) has a structure wherein non-flexible printed circuit boards (6) are laminated via cover lays (10) onto both sides of a flexible printed circuit board (1). In the multilayer circuit board (12), the cover lays (10) protect the regions of the printed circuit board (1) where the printed circuit boards (6) are not situated, while also functioning as adhesive layers (11) for bonding with the printed circuit boards (6). In other words, the same layers are used as the cover lays (10) and adhesive layers (11) in the multilayer circuit board (12).

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: This invention provides a prepreg which can yield printed circuit boards with excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages, by impregnating a thin fiber base material with a resin having excellent adhesion with metal foils or fiber base materials, excellent heat resistance and high pliability, as well as a metal foil-clad laminate and printed circuit board employing it. The prepreg of the invention is obtained by impregnating a resin composition containing a resin with an imide structure and a thermosetting resin into a fiber base material with a thickness of 5-50 ?m.

Abstract: In an air conditioner equipped with an air cleaner, a front panel is provided with three air inlets: a first air inlet located on the front face of the front panel, a second air inlet located on the top face thereof, and a third air inlet located therebetween. Each of the first and second air inlets has an opening/closing unit including louvers, and an air cleaner is arranged on the inside of the third air inlet. At the time of cooling/heating operation and at the time of dehumidifying operation, the first and second air inlets are opened and closed by the opening/closing unit, by which the amount of air passing through the air cleaner is changed, thereby utilizing the air cleaner effectively.

Abstract: An image forming apparatus includes a movable image bearing member; an image forming device for forming a toner image on the image bearing member; a charging member for charging the image bearing member in a charging station; and an electrical power source for supplying power to the charging member. A detector detects the voltage-current characteristic between the charging member and the image bearing member; and a controller controls the output of the electrical power source, in accordance with an output of the detector, when a surface area portion of the image bearing member, where the toner image is not going to be formed as the image bearing member rotates, is in the charging station.

Abstract: An image forming apparatus includes a movable image bearing member, having a photosensitive layer; an image forming device for forming an image on the image bearing member: a charging member for charging the image bearing member; and a light radiating device for radiating light on the image bearing member; a detector for detecting a datum rotating to a thickness of the photosensitive layer on the basis of the voltage-current characteristic between the charging member and image bearing member; and a controller for controlling the amount of light radiated from the light radiating device to be increased with decrease in the thickness of the photosensitive layer, in response to the detector.

Abstract: The present invention provides an image forming apparatus with an image forming device for forming a developer image on a recording material, an applicator for applying developer to form an image on an image bearing member to form a developer bearing area. A length of the developer bearing area in the generatrix direction of the image bearing member is longer than a maximum image width on the image bearing member in the generatrix direction thereof.