Abstract: In a method for manufacturing a laminated coil component, in which a laminated coil component is manufactured by laminating insulator sheets in order on which conductors having predetermined patterns are formed, the insulator sheets are laminated such that a distance in a lamination direction between a first lead-out conductor laminated first and a first coil conductor laminated next is larger than a distance in the lamination direction between a second lead-out conductor laminated last and a second coil conductor laminated immediately before the second lead-out conductor.

Abstract: A laminated coil component includes: an element body having a first surface and a second surface facing each other in a first direction; a coil unit formed by laminating a plurality of coil conductors in a second direction orthogonal to the first direction inside the element body; a first lead-out conductor; and a second lead-out conductor. A first coil conductor adjacent to the first lead-out conductor in the second direction includes a first side portion extending along the first surface, on a first surface side. A second coil conductor adjacent to the second lead-out conductor in the second direction includes a second side portion extending along the second surface, on a second surface side. The first side portion has a larger line width than other side portions of the first coil conductor and the second side portion.

Abstract: The electronic component includes an element body, an internal conductor, a cover layer, and a conductor layer. The internal conductor is disposed in the element body. The cover layer is disposed on an outer surface of the element body and has an electrical insulation property. The conductor layer is disposed on the cover layer and is electrically connected to the internal conductor. The conductor layer includes a portion. The portion protrudes toward the element body through the cover layer and is physically and electrically connected to the internal conductor. The conductor layer is electrically connected to the internal conductor.

Abstract: A method for making a semiconductor device is provided. The method generally includes forming a package having a first plurality of leads extending from a first side of the package, the package disposed on a leadframe. The method generally includes making a first cut adjacent to a first side of a first lead of the first plurality of leads, the first side extending from the first side of the package. The method generally includes making a second cut adjacent to a second side of the first lead of the first plurality of the lead, the second side of the lead opposite the first side of the lead and extending from the first side of the package.

Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.

Abstract: A multilayer coil component 1 includes an element body 2, a coil 8, and a terminal electrode 4 and a terminal electrode 5. Each of the terminal electrode 4 and the terminal electrode 5 is disposed over at least the end surfaces 2a and 2b and a main surface 2d. Each of the terminal electrode 4 and the terminal electrode 5 and at least a part of the coil 8 overlap when viewed from the facing direction of the pair of side surfaces 2e and 2f. Each of the terminal electrode 4 and the terminal electrode 5 and the coil 8 do not overlap when viewed from the facing direction of the pair of end surfaces 2a and 2b.

Abstract: In a multilayer coil component 1, a coil 7 includes a first connection part 22a and a second connection part 26a, the first connection part 22a is connected to one end part of the coil 7, which part is placed on a side of one principal surface 2c, and is arranged in an identical dielectric layer 6 with a conductor 22 included in the one end part, the second connection part 26a is connected to the other end part of the coil 7, which part is placed on a side of the other principal surface 2d, and is arranged in an identical dielectric layer 6 with a conductor 26 included in the other end part, and recessed parts 8a and 8b and recessed parts 9a and 9b are respectively provided in the first terminal electrode 4 and the second terminal electrode 5 in the element body 2.

Abstract: An electronic component has an element body; and an external electrode having a main body portion covering at least the second surface and a first wrapping-around portion wrapping around the third surface in the element body. The wrapping-around portion of the external electrode has a first part having a first distance, a second part having a second distance, a third part having a third distance, a fourth part having a fourth distance, and a fifth part having a fifth distance in the second direction in order from one side to the other side in the first direction. The second distance is longer than the first distance and the third distance. The fourth distance is longer than the third distance and the fifth distance.

Abstract: A pair of terminal electrodes 4 and 5 have electrode parts 4a and 5a and electrode parts 4b and 5b when viewed from a stacking direction, respectively. A plurality of connection conductors are disposed at positions not overlapping a plurality of coil conductors when viewed from the stacking direction. At least two of the plurality of connection conductors are disposed in a first region A1 or a second region A2 between the terminal electrodes 4 and 5 and an outer edge 9a of a coil 9 when viewed from the stacking direction. The first region A1 and the second region A2 overlap the electrode parts 4a and 5a when viewed from the facing direction of a pair of end surfaces 2a and 2b and overlap the electrode parts 4b and 5b when viewed from the facing direction of a pair of main surfaces 2c and 2d.

Abstract: In a multilayer coil component, a plurality of coil conductors are stacked in a coil axis direction. A connecting conductor connects the coil conductors adjacent to each other in the coil axis direction. First, second, and third coil conductors are arranged in order in the coil axis direction. A main body portion extends in a circumferential direction of the coil axis. Pad portions are connected to the main body portion, are connected to the first coil conductor via the connecting conductor, overhang from the third coil conductor in a direction away from the coil axis when viewed from the coil axis direction, and are inclined with respect to a virtual plane orthogonal to the coil axis direction.

Abstract: A described example includes: a package substrate having a die pad with a die side surface and having an opposite backside surface, having leads arranged along two opposite sides and having die pad straps extending from two opposing ends of the die pad. The leads lie in a first plane, a portion of the die pad straps lie in a second plane that is spaced from the first plane and located closer to the die pad, and the die pad lies in a third plane that is spaced from and parallel to the second plane in a direction away from the first plane. A semiconductor die is mounted to the die side surface and mold compound covers the semiconductor die, a portion of the leads, and the die side surface of the die pad, and the backside surface of the die pad exposed from the mold compound.

Abstract: An electronic component includes an element provided with a recess, a mounting conductor disposed in the recess, and an internal conductor disposed inside the element and connected to the mounting conductor. A first region includes a first surface. A second region includes a third surface connecting a second surface and the first surface. The second surface and the third surface overlap with the first surface as viewed in a direction in which the first surface and the second surface face each other. The internal conductor is connected to the second region away from a connection portion between the first surface and the third surface.

Abstract: A laminated coil component 1 includes an element body 2, a coil 8 disposed in the element body 2, and a first external electrode 4 and a second external electrode 5, and at least a part of the coil 8 is disposed in a first region A1 and a second region A2 when seen in a facing direction of the pair of side surfaces 2e and 2f, and the coil 8 is not disposed in a third region A3 and a fourth region A4 when seen in the facing direction of the pair of side surfaces 2e and 2f.

Abstract: A multilayer coil component includes an element body including a plurality of laminated insulator layers, and a coil disposed in the element body. The coil includes a first coil conductor having a first inner diameter, a second coil conductor having a second inner diameter smaller than the first inner diameter, and a connection conductor connecting the first coil conductor and the second coil conductor. The second coil conductor is adjacent to the first coil conductor in a direction in which the plurality of insulator layers are laminated. The connection conductor has a shape along the first coil conductor and the second coil conductor.

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Abstract: In some examples, a semiconductor package includes a semiconductor die having a device side and a non-device side opposing the device side. The device side has a circuit formed therein. The package includes a first conductive member having a first surface coupled to the non-device side of the semiconductor die and a second surface opposing the first surface. The second surface is exposed to a top surface of the semiconductor package. The package includes a second conductive member exposed to an exterior of the semiconductor package and coupled to the device side of the semiconductor die. The package includes a plurality of wirebonded members coupled to the second surface of the first conductive member and exposed to the exterior of the semiconductor package. At least one of the wirebonded members in the plurality of wirebonded members has a gauge of at least 5 mils.

Abstract: In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.

Abstract: In the multi-layer inductor, all of the plurality of through conductors are not aligned in a straight line, and the distance between the through conductors can be sufficiently kept in the element body having a predetermined dimensional standard. Therefore, the through conductor as a heat source is apart from each other, and the heat of the through conductor can be efficiently radiated to the outside of the element body.

Abstract: In the multi-layer coil component, the hole portion is provided in the vicinity of the side surface of the element body, and the distance from the tip position of the external electrode to the hole portion is shorter than the distance from the tip position of the external electrode to the coil. Therefore, when a crack is generated starting from the tip position of the external electrode on the mounting surface, the crack progress toward the hole portion located at a distance closer than the coil. Therefore, in the multi-layer coil component, splitting of the coil due to the crack can be prevented.

Abstract: In the multi-layer coil component, the lead conductor is exposed from the end surface of the element body and is connected to the external electrode provided on the end surface. When the lead conductor is led out to the end surface of the element body, the lead area can be easily increased as compared with the case where the lead conductor is led out to the side surface of the element body. Therefore, by connecting the coil and the external electrode via the lead conductor, high connectivity between the coil and the external electrode is achieved.