Patents by Inventor Makoto Yoshitake

Makoto Yoshitake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10731008
    Abstract: A photocurable silicone composition comprises: (A) an organopolysiloxane represented by the average composition formula: R1aR2bSiO(4-a-b)/2 where R1 is an alkenyl group having from 2 to 12 carbons, R2 is an alkyl group having from 1 to 12 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 12 carbons; provided that, at least 30 mol % of R2 are the aryl groups or the aralkyl groups; and “a” and “b” are positive numbers satisfying: 1?(a+b)?2.5 and 0.001?a/(a+b)?0.2; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a compound having at least two thiol groups in a molecule; (D) a photoradical initiator having a phosphorus atom; and (E) a hindered phenol compound.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: August 4, 2020
    Assignees: Dow Toray Co., Ltd., Dow Silicones Corporation
    Inventors: Ju Young Yook, Makoto Yoshitake
  • Patent number: 10604653
    Abstract: Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: March 31, 2020
    Assignee: Dow Toray Co., Ltd.
    Inventors: Ryota Dogen, Haruna Yamazaki, Shin Yoshida, Makoto Yoshitake
  • Publication number: 20200071580
    Abstract: Disclosed is a curable silicone composition. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in each molecule; (B) a polyoxyalkylene compound represented by the general formula: XO—(C2H4O)p(CnH2nO)q(YO)r—X, wherein, each X represents a hydrogen atom, an alkyl group, an alkenyl group, an aryl group, an acryl group, or a methacryl group, provided that at least one X in each molecule is the alkenyl group, the acryl group, or the methacryl group, Y represents a divalent hydrocarbon group, n represents an integer of 3 to 6, p and q are integers satisfying: 2?p?100 and 0?q?50, and r represents 0 or 1; (C) an organopolysiloxane having at least two silicon bonded hydrogen atoms in each molecule; and (D) a catalyst for a hydrosilylation reaction. The composition forms a cured product having improved properties.
    Type: Application
    Filed: February 28, 2018
    Publication date: March 5, 2020
    Inventors: Takuya OGAWA, Haruna MIZUNO, Atsushi SUGIE, Makoto YOSHITAKE, Michitaka SUTO
  • Publication number: 20200048463
    Abstract: Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.
    Type: Application
    Filed: October 12, 2016
    Publication date: February 13, 2020
    Inventors: Ryota DOGEN, Haruna YAMAZAKI, Shin YOSHIDA, Makoto YOSHITAKE
  • Publication number: 20190140530
    Abstract: There is provided a rotary electric machine that ensures improving a maximum torque and a rated power factor while reducing an increase in a starting current. In view of this, the rotary electric machine includes a shaft, a rotor, and a stator. The rotor is fixed to an outer periphery of the shaft. The stator is located so as to surround an outer periphery of the rotor. The rotor includes a rotor iron core including a plurality of rotor slots located at predetermined intervals in a circumferential direction and rotor bars inserted into the rotor slots. Rotor slits communicate with outer peripheral sides of the rotor slots. The rotor slits have a width ws in a circumferential direction. The width ws is smaller than a height hs in a radial direction of the rotor slit, and when a rated current is denoted as I1, a turn ratio (primary/secondary) is denoted as Tr, and a magnetic permeability in a vacuum is denoted as ?0, a relationship of ws>?0×I1×Tr/0.6 is met.
    Type: Application
    Filed: July 31, 2017
    Publication date: May 9, 2019
    Inventors: Kazuo NISHIHAMA, Masanori SAWAHATA, Takayuki KOYAMA, Makoto IMURA, Yuuichirou YOSHITAKE, Kenichi SUGIMOTO, Kengo UEDA
  • Publication number: 20190112430
    Abstract: A photocurable silicone composition comprises: (A) an organopolysiloxane represented by the average composition formula: R1aR2bSiO(4-a-b)/2 where R1 is an alkenyl group having from 2 to 12 carbons, R2 is an alkyl group having from 1 to 12 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 12 carbons; provided that, at least 30 mol % of R2 are the aryl groups or the aralkyl groups; and “a” and “b” are positive numbers satisfying: 1?(a+b)?2.5 and 0.001?a/(a+b)?0.2; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a compound having at least two thiol groups in a molecule; (D) a photoradical initiator having a phosphorus atom; and (E) a hindered phenol compound.
    Type: Application
    Filed: March 7, 2017
    Publication date: April 18, 2019
    Inventors: Ju Young YOOK, Makoto YOSHITAKE
  • Patent number: 10208164
    Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: February 19, 2019
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Ryota Dogen, Haruna Yamazaki, Makoto Yoshitake
  • Patent number: 10167418
    Abstract: A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: January 1, 2019
    Assignee: Dow Corning Co., Ltd.
    Inventors: Haruna Yamazaki, Makoto Yoshitake, Ryosuke Yamazaki
  • Publication number: 20180305547
    Abstract: Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.
    Type: Application
    Filed: October 12, 2016
    Publication date: October 25, 2018
    Inventors: Ryota DOGEN, Haruna YAMAZAKI, Shin YOSHIDA, Makoto YOSHITAKE
  • Publication number: 20180208816
    Abstract: A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.
    Type: Application
    Filed: June 16, 2015
    Publication date: July 26, 2018
    Inventors: Haruna Yamazaki, Makoto Yoshitake, Ryosuke Yamazaki
  • Patent number: 9902811
    Abstract: This invention relates to a curable silicone composition comprising: (A) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by the following average unit formula: (R1SiO3/2)a(R12SiO2/2)b(R13SiO1/2)c(SiO4/2)d(XO1/2)e wherein, R1 each independently represent an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group in which some or all of the hydrogen atoms of these groups are substituted with halogen atoms, with the proviso that at least two R1 in a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: February 27, 2018
    Assignees: DOW CORNING TORAY CO. LTD., DOW CORNING CORPORATION
    Inventors: Stanton James Dent, Tomohiro Iimura, Yusuke Miyamoto, Yoshitsugu Morita, Fumito Nishida, Emil Radkov, Jacob William Steinbrecher, Hiroaki Yoshida, Makoto Yoshitake
  • Patent number: 9853193
    Abstract: The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: December 26, 2017
    Assignees: Dow Corning Corporation, Dow Corning Toray Co., Ltd.
    Inventors: Masaaki Amako, Steven Swier, Haruna Yamazaki, Shin Yoshida, Makoto Yoshitake
  • Publication number: 20170253700
    Abstract: A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.
    Type: Application
    Filed: August 26, 2015
    Publication date: September 7, 2017
    Inventors: Ryota DOGEN, Haruna YAMAZAKI, Makoto YOSHITAKE
  • Patent number: 9751988
    Abstract: This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.
    Type: Grant
    Filed: February 16, 2015
    Date of Patent: September 5, 2017
    Assignees: DOW CORNING TORAY CO., LTD., DOW CORNING CORPORATION
    Inventors: Gunn Jo, Haruna Yamazaki, Ju Young Yook, Makoto Yoshitake
  • Publication number: 20170166701
    Abstract: This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.
    Type: Application
    Filed: February 16, 2015
    Publication date: June 15, 2017
    Inventors: Gunn JO, Haruna YAMAZAKI, Ju Young YOOK, Makoto YOSHITAKE
  • Publication number: 20170092822
    Abstract: The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.
    Type: Application
    Filed: June 4, 2015
    Publication date: March 30, 2017
    Inventors: Masaaki Amako, Steven Swier, Haruna Yamazaki, Shin Yoshida, Makoto Yoshitake
  • Patent number: 9546309
    Abstract: A curable silicone composition comprising: (A) (A1) an organopolysiloxane having at least two alkenyl groups in a molecule and free of silicon-bonded hydroxyl groups or silicon-bonded hydrogen atoms, or a mixture of said component (A1) and (A2) a branched chain organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a diorganodialkoxysilane represented by a general formula; (D) a straight chain organosiloxane oligomer having at least one silicon-bonded hydroxyl group in a molecule and free of silicon-bonded hydrogen atoms; and (E) a hydrosilylation catalyst, can form a cured product which exhibits excellent initial adhesive properties and transparency and exhibits excellent adhesive durability and retention of transparency under conditions of high temperature and high humidity.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: January 17, 2017
    Assignee: DOW CORNING TORAY CO., LTD.
    Inventors: Yusuke Miyamoto, Makoto Yoshitake
  • Patent number: 9536799
    Abstract: The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: January 3, 2017
    Assignees: Dow Corning Corporation, Dow Corning Toray Co., Ltd.
    Inventors: Shin Yoshida, Makoto Yoshitake, Haruna Yamazaki, Masaaki Amako, Steven Swier, Toshiki Nakata
  • Patent number: 9464211
    Abstract: The present invention relates to a curable silicone composition which is a hydrosilylation reaction curable silicone composition for sealing, coating, or adhering of an optical semiconductor element, and includes at least one type of compound selected from triazole-based compounds with the exception of benzotriazole. The curable silicone composition, for example, includes (A) an organopolysiloxane having at least 2 aliphatic unsaturated hydrocarbon groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, (C) at least one type of compound selected from among triazole-based compounds with the exception of non-substituted benzotriazole, and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having excellent transparency and thermal shock resistance, and the optical semiconductor device utilizing the composition has excellent reliability.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: October 11, 2016
    Assignee: DOW CORNING TORAY CO., LTD.
    Inventors: Yusuke Miyamoto, Makoto Yoshitake, Hiroaki Yoshida, Toshiki Nakata, Kazuo Hirai
  • Publication number: 20150376344
    Abstract: This invention relates to a curable silicone composition comprising: (A) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by the following average unit formula: (R1SiO3/2)a (R12SiO2/2)b(R13SiO1/2)c(SiO4/2)d(XO1/2)e wherein, R1 each independently represent an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group in which some or all of the hydrogen atoms of these groups are substituted with halogen atoms, with the proviso that at least two R1 in a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.
    Type: Application
    Filed: February 21, 2014
    Publication date: December 31, 2015
    Inventors: Stanton James Dent, Tomohiro Iimura, Yusuke Miyamoto, Yoshitsugu Morita, Fumito Nishida, Emil Radkov, Jacob William Steinbrecher, Hiroaki Yoshida, Makoto Yoshitake