Abstract: Electrostatic discharge (ESD) protection is provided in using a supply clamp circuit using an ESD event actuated MOSFET device. Triggering of the MOSFET device is made at both the gate terminal and the substrate (back gate) terminal. Additionally, the MOSFET device can be formed of cascoded MOSFETs.

Abstract: Electrostatic discharge (ESD) protection is provided in using a supply clamp circuit using an ESD event actuated MOSFET device. Triggering of the MOSFET device is made at both the gate terminal and the substrate (back gate) terminal. Additionally, the MOSFET device can be formed of cascoded MOSFETs.

Abstract: Electrostatic discharge (ESD) protection is provided in using a supply clamp circuit using an ESD event actuated SCR device. The SCR device may include an embedded field effect transistor (FET) having an insulated gate that receives a trigger signal from an ESD detection circuit. The SCR device may alternatively include a variable substrate resistor having an insulated gate that receives a trigger signal from an ESD detection circuit.

Abstract: Electrostatic discharge (ESD) protection is provided in using a supply clamp circuit using an ESD event actuated MOSFET device. Triggering of the MOSFET device is made at both the gate terminal and the substrate (back gate) terminal. Additionally, the MOSFET device can be formed of cascoded MOSFETs.

Abstract: Electrostatic discharge (ESD) protection is provided in using a supply clamp circuit using an ESD event actuated SCR device. The SCR device may include an embedded field effect transistor (FET) having an insulated gate that receives a trigger signal from an ESD detection circuit. The SCR device may alternatively include a variable substrate resistor having an insulated gate that receives a trigger signal from an ESD detection circuit.

Abstract: Electrostatic discharge (ESD) protection is provided in using a supply clamp circuit using an ESD event actuated MOSFET device. Triggering of the MOSFET device is made at both the gate terminal and the substrate (back gate) terminal. Additionally, the MOSFET device can be formed of cascoded MOSFETs.

Abstract: An SRAM bitcell includes first and second CMOS inverters connected as a latch defining a true node and a complement node. The bitcell further includes true and complement bitline nodes. A first direct connection is provided between the true bitline node and a back gate of at least a p-channel transistor, and perhaps also an n-channel transistor, in the second CMOS inverter. A second direct connection is provided between the complement bitline node and a back gate of at least a p-channel transistor, and perhaps also an n-channel transistor, in the first CMOS inverter. A first pass transistor is coupled between the true bitline node and the true node, and a second pass transistor is coupled between the complement bitline node and the complement node. Direct connections are also provided between a wordline and the back gates of each of the first and second pass transistors.

Abstract: An SRAM bitcell includes first and second CMOS inverters connected as a latch defining a true node and a complement node. The bitcell further includes true and complement bitline nodes. A first direct connection is provided between the true bitline node and a back gate of at least a p-channel transistor, and perhaps also an n-channel transistor, in the second CMOS inverter. A second direct connection is provided between the complement bitline node and a back gate of at least a p-channel transistor, and perhaps also an n-channel transistor, in the first CMOS inverter. A first pass transistor is coupled between the true bitline node and the true node, and a second pass transistor is coupled between the complement bitline node and the complement node. Direct connections are also provided between a wordline and the back gates of each of the first and second pass transistors.