Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Abstract: No-remelt solder joints can eliminate die or substrate movement in downstream reflow processes. In one example, one or more solder joints between two substrates can be formed as full IMC (intermetallic compound) solder joints. In one example, a full IMC solder joint includes a continuous layer (e.g., from the top pad to bottom pad) of intermetallic compounds. In one example, a full IMC joint can be formed by dispensing a no-remelt solder paste on some of the pads of one or both substrates to be bonded together.

Abstract: A stiffener for an integrated circuit (IC) package assembly including an IC die electrically interconnected to a substrate. The stiffener is to be mechanically attached to the substrate adjacent to at least one edge of the IC die and have a coefficient of linear thermal expansion (CTE) exceeding that of the substrate. The stiffener may be an “anti-invar” metallic alloy. Anti-invar alloys display “anti-invar” behavior where thermal expansion of the material is significantly enhanced relative to other compositions of the particular alloy system. A package stiffener may be a high-Mn steel, for example, such as ASTM International A128. In other examples, a package stiffener is a MnCuNi, FeNiMn, or FeNiCr alloy having an average CTE over a range of 25-100° C. of at least 18 ppm, and a room temperature modulus of elasticity of at least 120 GPa.

Abstract: A semiconductor package may include a composite magnetic inductor that is formed integral with the semiconductor substrate. The composite magnetic inductor may include a composite magnetic resin layer and a plurality of conductive layers arranged such that the composite magnetic resin layer is interleaved between successive conductive layers. The resultant composite magnetic inductor may be disposed between dielectric layers. A core layer may be disposed proximate the composite magnetic inductor. A build-up layer may be disposed proximate the core layer or proximate the composite magnetic inductor in a coreless semiconductor substrate. A semiconductor die may couple to the build-up layer. The composite magnetic inductor beneficially provides a greater inductance than external inductors coupled to the semiconductor package.

Abstract: An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Abstract: The invention relates to elastomeric compositions containing filler particles that are predominantly two-dimensional in shape. The elastomeric compositions exhibit significantly improved thermal, chemical, and mechanical properties as compared with elastomers containing conventional fillers such as natural clay, carbon black, and carbon fiber. In addition, the elastomeric compositions of the invention exhibit improved resistance to solvent-induced swelling and to unwanted permeation of gases such as hydrogen sulfide. The invention also provides a method of forming such elastomeric compositions and methods of using such elastomeric compositions to prepare elastomeric articles with improved resistance to thermal, chemical, and mechanical stresses.

Abstract: A semiconductor package may include a composite magnetic inductor that is formed integral with the semiconductor substrate. The composite magnetic inductor may include a composite magnetic resin layer and a plurality of conductive layers arranged such that the composite magnetic resin layer is interleaved between successive conductive layers. The resultant composite magnetic inductor may be disposed between dielectric layers. A core layer may be disposed proximate the composite magnetic inductor. A build-up layer may be disposed proximate the core layer or proximate the composite magnetic inductor in a coreless semiconductor substrate. semiconductor die may couple to the build-up layer. The composite magnetic inductor beneficially provides a greater inductance than external inductors coupled to the semiconductor package.

Abstract: The inductor includes a plurality of inductive elements that are at least partially encapsulated, covered, or embedded in a composite magnetic material that improves the inductance of the inductor without a corresponding, detrimental, increase in the size of the inductor. The composite magnetic material includes a plurality of magnetic particles dispersed in a carrier medium. Each of the magnetic particles includes a magnetic core that is encapsulated in a dielectric magnetic coating. The dielectric magnetic coating is a thermally stable material having high electrical resistivity.

Abstract: A conductive metal pillar is disposed within a composite material used as a die overflow material to form inductor on a module substrate. In situ fabrication of inductors on a module substrate enable customized selection of an inductance value, thus enabling inductors (and other similar peripheral devices) to be placed on a module substrate rather than on a motherboard. Furthermore, these in situ fabricated peripheral devices may also be used to remove excess heat produced by a die because the magnetic particles of the composite material are also thermally conductive. Furthermore, electrically conductive elements of the peripheral devices can be placed in contact with the die and/or integrated heat spreader.

Abstract: A microelectronics package, comprising a substrate that comprises a dielectric and an inductor component comprising one or more wires within a magnetic core over the dielectric. The inductor component is bonded to the substrate by one or more solder joints. A solder mask is between the inductor component and the dielectric. The one or more solder joints are surrounded by the solder mask, and wherein the solder mask comprises a magnetic material.

Abstract: Embodiments herein relate to a magnetic encapsulant composite, comprising a mixture of a first material that is a soft magnetic filler, a second material that is a polymer matrix, and a third material that is a process ingredient. The magnetic encapsulant composite may then encapsulate or partially encapsulate a magnetic inductor coupled to a substrate to increase the inductance of the magnetic inductor and/or to strengthen the substrate to which the magnetic inductor and the composite are coupled.

Abstract: Embodiments include an encapsulation material, one or more semiconductor packages, and methods of the semiconductor packages. A semiconductor package including dies disposed on a package substrate. The semiconductor package also includes at least one of an underfill layer, a mold layer, and a dielectric layer on or in the package substrate. The semiconductor package further includes an encapsulation material having a fluorescent chemical compound and an epoxy. The encapsulation material may be incorporated into at least one of the underfill layer, the mold layer, and/or the dielectric layer on or in the package substrate. The fluorescent chemical compound of the encapsulation material may include at least one of a poly(vinylcarbazole) (PVCz), a 1,4-Bis(5-phenyl-2-oxazolyl) benzene (POPOP), and/or a plurality of conjugated, aromatic molecules and polymers. The encapsulation material may include at least one of a hardener, a filler, an additive, and/or a polymer.

Abstract: The invention relates to elastomeric compositions containing filler particles that are predominantly two-dimensional in shape. The elastomeric compositions exhibit significantly improved thermal, chemical, and mechanical properties as compared with elastomers containing conventional fillers such as natural clay, carbon black, and carbon fiber. In addition, the elastomeric compositions of the invention exhibit improved resistance to solvent-induced swelling and to unwanted permeation of gases such as hydrogen sulfide. The invention also provides a method of forming such elastomeric compositions and methods of using such elastomeric compositions to prepare elastomeric articles with improved resistance to thermal, chemical, and mechanical stresses.

Abstract: The invention provides a powder coating composition comprising of thermoplastic polymers, ceramic particles, and cermet particles for lowering the friction coefficient, and improving wear and corrosion resistance of coated surfaces in high-temperature, high-pressure, and corrosive environments. It also provides a method of coating application for improving adhesion of the coating to the substrate. The coating compositions are devoid of volatile organic solvents and can be applied on surfaces using thermal spraying, compression molding and other particle sintering approaches. A multilayer architecture consisting of an adhesive bottom layer and a non-adhesive, low friction top layer is disclosed. The coating can be used in oil and gas production and seawater injection.