Patents by Inventor Malcolm Brown
Malcolm Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9832857Abstract: Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.Type: GrantFiled: September 8, 2016Date of Patent: November 28, 2017Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Brown
-
Patent number: 9815240Abstract: The present invention relates to shape memory materials and to a method for controlling shape change in shape memory materials. In particular, the invention relates to a method and a system for forming complex shapes from shape memory materials and to shape memory materials having complex shapes.Type: GrantFiled: April 16, 2008Date of Patent: November 14, 2017Assignee: Smith & Nephew, Inc.Inventors: Horacio Montes de Oca Balderas, Malcolm Brown
-
Patent number: 9770534Abstract: The present disclosure relates to an anchor for fixating a tissue graft to bone. The anchor includes a through hole extending an entire length of the anchor and a polymer composition having shape memory qualities. Other anchors and methods for fixating a tissue graft to bone are also disclosed.Type: GrantFiled: April 16, 2008Date of Patent: September 26, 2017Assignee: Smith & Nephew, Inc.Inventors: Horacio Montes De Oca Balderas, Malcolm Brown, Graeme Howling, Steve Fenwick, Nicholas Cotton, David Brumfield
-
Patent number: 9763709Abstract: The present disclosure relates to a shape memory polymer material containing at least one two dimensional region having a first amount of stored stress in a first direction and a second amount of stored stress higher than the first amount of stored stress in a second direction, wherein the two dimensional region is capable of changing shape in only one of the first or second directions.Type: GrantFiled: April 24, 2014Date of Patent: September 19, 2017Assignee: Smith & Nephew, Inc.Inventors: Horacio Montes De Oca Balderas, Malcolm Brown, Mark Bonner, Ian MacMillan Ward, Michael Andrew Hall, John Rose, Mason James Bettenga
-
Publication number: 20170094802Abstract: Provided are interconnect circuits for interconnecting arrays of devices and methods of forming these interconnect circuits as well as connecting these circuits to the devices. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different electrical terminal of the interconnected devices. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.Type: ApplicationFiled: December 14, 2016Publication date: March 30, 2017Applicant: CelLink CorporationInventors: Kevin Coakley, Malcolm Brown
-
Patent number: 9603639Abstract: The present disclosure relates to systems and methods for installing shape memory polymers relative to orthopedic implants.Type: GrantFiled: October 7, 2013Date of Patent: March 28, 2017Assignee: Smith & Nephew, Inc.Inventors: Malcolm Brown, Horacio Montes De Oca Balderas, Graeme Howling, James K. Rains, John Rose, Michael Hall, Robin A. Chivers, Andy Marsh, Mason James Bettenga, Andrew Thompson, Henry B. Faber
-
Publication number: 20170077487Abstract: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.Type: ApplicationFiled: October 7, 2016Publication date: March 16, 2017Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Brown, Paul Tsoa
-
Publication number: 20170034902Abstract: Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.Type: ApplicationFiled: September 8, 2016Publication date: February 2, 2017Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Brown
-
Patent number: 9545010Abstract: Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.Type: GrantFiled: August 26, 2015Date of Patent: January 10, 2017Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Brown
-
Patent number: 9504574Abstract: Tissue fixation devices are provided. The devices include a first component and a second component, the components having different rates of in vivo degradation. The first component and second component are arranged so that, upon degradation of one of the components, the other component provides a scaffold into which bone can grow.Type: GrantFiled: February 25, 2015Date of Patent: November 29, 2016Assignee: Smith & Nephew, Inc.Inventors: David Farrar, Malcolm Brown, Michael Hall, John Eric Brunelle, Nicholas John Cotton, Rod Berube, John Lipchitz
-
Patent number: 9466777Abstract: Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.Type: GrantFiled: February 3, 2016Date of Patent: October 11, 2016Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Brown
-
Publication number: 20160225969Abstract: Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.Type: ApplicationFiled: February 3, 2016Publication date: August 4, 2016Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Brown
-
Patent number: 9332800Abstract: A helmet structure without any hard outer shell has axially compressible cell units contained in a hemispheric frame by a thin fabric covering stretched over cup shaped cell retainers that have sidewalls of compressible foam. The frame is supported on the wearer's head on plastic foam posts that space the inner ends of compressible bladders from the wearer's head, and ambient air in the bladders compresses at impact, being vented then through openings for gradually absorbing such impact forces. Each bladder is vented into a space between the cup “bottom” and the outer end of a bladder. At least two cell sizes are provided, and some of these are on depending lobes in the frame, for protecting the wearer's ears and neck.Type: GrantFiled: September 13, 2013Date of Patent: May 10, 2016Inventor: George Malcolm Brown
-
Patent number: 9308293Abstract: The present disclosure relates to a multi-modal shape memory polymer material comprising a blend or at least one polymer component having a first molecular weight and at least a second polymer component having a second molecular weight that is less than the first component.Type: GrantFiled: February 5, 2015Date of Patent: April 12, 2016Assignee: Smith & Nephew, Inc.Inventors: Malcolm Brown, Horacio Montes De Oca Balderas, Michael Hall, John Rose
-
Patent number: 9308300Abstract: The present disclosure relates to prosthetic implants, components of prosthetic implants, and methods of fixating the components to one another and, especially fixation of the implants to bone.Type: GrantFiled: April 16, 2008Date of Patent: April 12, 2016Assignee: Smith & Nephew, Inc.Inventors: David C. Kelman, Hamish Forster, Malcolm Brown, Horacio Montes De Oca Balderas, Mason James Bettenga
-
Publication number: 20160073506Abstract: Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.Type: ApplicationFiled: August 26, 2015Publication date: March 10, 2016Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Brown
-
Patent number: 9147875Abstract: Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.Type: GrantFiled: March 27, 2015Date of Patent: September 29, 2015Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Brown
-
Patent number: 9120919Abstract: The present invention relates to polymer compositions namely biodegradable segmented block copolymers comprising polyol residues having a number average molecular weight of at least 4000 Daltons and in that the polyols are connected by actual linkages.Type: GrantFiled: December 22, 2004Date of Patent: September 1, 2015Assignee: Smith & Nephew, Inc.Inventor: Malcolm Brown
-
Publication number: 20150164643Abstract: Tissue fixation devices are provided. The devices include a first component and a second component, the components having different rates of in vivo degradation. The first component and second component are arranged so that, upon degradation of one of the components, the other component provides a scaffold into which bone can grow.Type: ApplicationFiled: February 25, 2015Publication date: June 18, 2015Inventors: David FARRAR, Malcolm Brown, Michael Hall, John Eric Brunelle, Nicholas John Cotton, Rod Berube, John Lipchitz
-
Publication number: 20150151023Abstract: The present disclosure relates to a multi-modal shape memory polymer material comprising a blend or at least one polymer component having a first molecular weight and at least a second polymer component having a second molecular weight that is less than the first component.Type: ApplicationFiled: February 5, 2015Publication date: June 4, 2015Inventors: Malcolm Brown, Horacio Montes De Oca Balderas, Michael Hall, John Rose