Patents by Inventor Malcolm K. Grief
Malcolm K. Grief has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9431312Abstract: A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.Type: GrantFiled: March 24, 2016Date of Patent: August 30, 2016Assignee: Medtronic, Inc.Inventors: Richard J O'Brien, John K Day, Paul F Gerrish, Michael F Mattes, David A Ruben, Malcolm K Grief
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Publication number: 20160204004Abstract: A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.Type: ApplicationFiled: March 24, 2016Publication date: July 14, 2016Inventors: Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben, Malcolm K. Grief
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Patent number: 9318400Abstract: A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.Type: GrantFiled: February 21, 2014Date of Patent: April 19, 2016Assignee: Medtronic, Inc.Inventors: Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben, Malcolm K. Grief
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Publication number: 20140171822Abstract: A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.Type: ApplicationFiled: February 21, 2014Publication date: June 19, 2014Applicant: Medtronic, Inc.Inventors: Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben, Malcolm K. Grief
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Patent number: 8666505Abstract: A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.Type: GrantFiled: January 28, 2011Date of Patent: March 4, 2014Assignee: Medtronic, Inc.Inventors: Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben, Malcolm K. Grief
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Publication number: 20120101540Abstract: A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.Type: ApplicationFiled: January 28, 2011Publication date: April 26, 2012Applicant: MEDTRONIC, INC.Inventors: Richard J. O'Brien, John K. Day, Paul F. Gerrish, Michael F. Mattes, David A. Ruben, Malcolm K. Grief
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Patent number: 6555466Abstract: A method of improving planarity of semiconductor wafer surfaces containing damascene and dual-damascene circuitry using chemical-mechanical polishing techniques. The method includes using a first polishing step to substantially remove excess surface metal up to a detected end point. After rinsing, a second step of chemical-mechanical polishing is applied, using a second slurry that has a higher selectivity for dielectric than metal, preferably from 1.8 to 4 or more times greater. The second step of polishing, in accordance with the invention, has been found to substantially eliminate dishing and improve planarity.Type: GrantFiled: March 29, 1999Date of Patent: April 29, 2003Assignee: Speedfam CorporationInventors: Thomas Laursen, Malcolm K. Grief, Krishna P. Murella, Sanjay Basak
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Patent number: 6387188Abstract: A method of conditioning pads used in the polishing of semiconductor wafers containing copper circuitry. The method includes applying a treatment solution that contains a reactant for particulate copper-containing debris on the pad resulting from the copper circuitry. Preferably, the reactant is a carboxylic acid present in a concentration of from about 0.1 to about 10 weight percent in a solution. The pH of the solution may be adjusted to the range from about 1 to about 6 with a compatible base.Type: GrantFiled: March 3, 1999Date of Patent: May 14, 2002Assignee: SpeedFam-IPEC CorporationInventors: Thomas Laursen, Malcolm K. Grief, Krishna P. Murella, Sanjay Basak
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Patent number: 5738562Abstract: A chemical-mechanical polishing apparatus includes a slurry-wetted polishing pad attached to a substantially planar surface of a platen. A wafer carrier is positioned in close proximity to the platen, and it has a substantially planar surface to which one side of a semiconductor wafer is removably attachable so that an opposing side of the semiconductor wafer is disposed against the polishing pad. An actuator imparts a translational motion to the platen so that the polishing pad moves relative to and in polishing contact with the semiconductor wafer. A sensor detects a change in the imparted translational motion corresponding to a change in the coefficient of friction between the polishing pad and the opposing side of the semiconductor wafer indicative of a planar end point on the opposing side of the semiconductor wafer. The sensor preferably includes a laser and a laser detector using a laser reflection or laser interferometric method to detect the change in the imparted translational motion.Type: GrantFiled: January 24, 1996Date of Patent: April 14, 1998Assignee: Micron Technology, Inc.Inventors: Trung Tri Doan, Gurtej Singh Sandhu, Malcolm K. Grief
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Patent number: 5136362Abstract: A device is provided by forming a diffusion barrier at the interface between a metalized contact and the surface of a semiconductor substrate. A three-layer sandwich is formed over the contact region and then annealed in free nitrogen. The sandwich is made of a titanium nitride layer interposed between layers of titanium. During the anneal, material from the titanium layer adjacent to the substrate migrates thereinto to produce a highly conductive diffusion region of titanium silicide. Concurrently during the anneal the other layer of titanium, which is exposed to the nitrogen atmosphere, is converted into a backing layer of titanium nitride which enhances the barrier effect of the titanium nitride layer at the center of the sandwich structure. The conversion of titanium to titanium nitride causes a physical expansion in the layer involved. This serves to enhance the thickness of the barrier layer at all locations, but of particular significance at the corners of the contact well.Type: GrantFiled: November 27, 1990Date of Patent: August 4, 1992Inventors: Malcolm K. Grief, Trung Doan
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Patent number: 4936950Abstract: A method of the kind consisting in that a contact is obtained with an active zone (11) carried by a semiconductor substrate (10) by means of conductive contact studs (18a) located in the contact openings (16c) of an isolating layer (12) and in that then a metallic configuration of interconnections (22) is formed establishing the conductive connection with the conductive contact studs (18a). A separation layer (13) is provided between the isolating layer (12) and the conductive layer (18), which can be eliminated selectively with respect to the isolating layer (12). Thus, the isolating layer (12) retains its original flatness and the conductive contact studs (18a) have an upper level (20) exceeding slightly the level (21) of the isolating layer (12), thus favoring the contact between these contact studs (18a) and the metallic configuration of interconnections (22). Application in microcircuits having a high integration density.Type: GrantFiled: April 14, 1989Date of Patent: June 26, 1990Assignee: U.S. Philips CorporationInventors: Trung T. Doan, Leendert De Bruin, Malcolm K. Grief, Harald Godon
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Patent number: RE34583Abstract: A method of the kind consisting in that a contact is obtained with an active zone (11) carried by a semiconductor substrate (10) by means of conductive contact studs (18a) located in the contact openings (16c) of an isolating layer (12) and in that then a metallic configuration of interconnections (22) is formed establishing the conductive connection with the conductive contact studs (18a). A separation layer (13) is provided between the isolating layer (12) and the conductive layer (18), which can be eliminated selectively with respect to the islating layer (12). Thus, the isolating layer (12) retains its original flatness and the conductive contact studs (18a) have an upper level (20) exceeding slightly the level (21) of the isolating layer (12), thus favoring the contact between these contact studs (18a) and the metallic configuration of interconnections (22). Application in microcircuits having a high integration density.Type: GrantFiled: May 11, 1992Date of Patent: April 12, 1994Assignee: U.S. Philips CorporationInventors: Malcolm K. Grief, Trung T. Doan, Hendrikus J. W. van Houtum, Josephus M. F. G. van Laarhoven