Abstract: A flash resistant epoxy encapsulating composition and its process of manufacture. The composition comprises a blend of from about 15 to about 80 weight percent epoxy resin, from about 9 to about 82 weight percent filler, from about 0.01 to about 2 percent catalyst by weight of resin, from about 10 to about 50 percent hardener by weight of resin, from about 3 to about 12 percent flash retardant by combined weight of resin and hardener and up to about 1.5 weight percent lubricant. The cured blend physically consists essentially of particles intimately and entirely embedded in a matrix. The process comprises blending the components of the above blend followed by milling the resulting blend between the rolls of a differential roll mill equipped with plows where the rolls have different surface temperatures, the hotter of the rolls being near the melting temperature of the resin.