Abstract: A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.

Abstract: An edge gripping device grips and ungrips a substrate, such as a semiconductor wafer. A blade extends in a distal direction from a base of the device. At least one distal contact member is provided at the tip of the blade. Two proximal lever arms are pivotally coupled for synchronized, oppositely directed rotation to the base. Each lever arm has at least one proximal contact member at an outer end. A biasing member is coupled to the two proximal lever arms and to an actuator to effect pivoting movement of the lever arms. The pivoting motion moves the ends of the arms generally radially toward and away from the center of the substrate to be gripped or ungripped, thereby minimizing sliding of the substrate. The biasing member is biased to retain the lever arms in a closed position in the event of a power failure. Ramps are provided next to each contact member. The contact members and ramps are profiled to minimize the zone of the substrate edge that is contacted.

Abstract: An edge gripping device for a robot arm grips and ungrips substrates, such as semiconductor wafers. A base is fixed to an end of the robot arm. A blade, having a distal contact location thereon, and a pusher bar, having preferably two proximal contact locations thereon, are movably mounted to the base via a linkage mechanism. The linkage mechanism includes two four-bar linkages. The first four-bar linkage has a stationary link and three movable links connected in a parallelogram configuration. The pusher bar is fixed to one of the movable links of the first linkage for movement therewith. The second four-bar linkage has a stationary link and three movable links connected in a trapezoidal configuration. The blade is fixed to one of the movable links of the second linkage for movement therewith. The two linkages share a stationary pivot point.

Abstract: An edge gripping device grips and ungrips a substrate, such as a semiconductor wafer. A blade extends in a distal direction from a base of the device. At least one distal contact member is provided at the tip of the blade. Two proximal lever arms are pivotally coupled for synchronized, oppositely directed rotation to the base. Each lever arm has at least one proximal contact member at an outer end. A biasing member is coupled to the two proximal lever arms and to an actuator to effect pivoting movement of the lever arms. The pivoting motion moves the ends of the arms generally radially toward and away from the center of the substrate to be gripped or ungripped, thereby minimizing sliding of the substrate. The biasing member is biased to retain the lever arms in a closed position in the event of a power failure. Ramps are provided next to each contact member. The contact members and ramps are profiled to minimize the zone of the substrate edge that is contacted.

Abstract: An edge gripping device for a robot arm grips and ungrips substrates, such as semiconductor wafers. A base is fixed to an end of the robot arm. A blade, having a distal contact location thereon, and a pusher bar, having preferably two proximal contact locations thereon, are movably mounted to the base via a linkage mechanism. The linkage mechanism includes two four-bar linkages. The first four-bar linkage has a stationary link and three movable links connected in a parallelogram configuration. The pusher bar is fixed to one of the movable links of the first linkage for movement therewith. The second four-bar linkage has a stationary link and three movable links connected in a trapezoidal configuration. The blade is fixed to one of the movable links of the second linkage for movement therewith. The two linkages share a stationary pivot point.

Abstract: A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.

Abstract: A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.

Abstract: A carrier head for a semiconductor wafer polishing apparatus includes a rigid plate which has a major surface with a plurality of open fluid channels. A flexible wafer carrier membrane has a perforated wafer contact section for contacting the semiconductor wafer, and a bellows extending around the wafer contact section. A retaining ring is secured to the rigid plate with a flange on the bellows sandwiched between the plate's major surface and the retaining ring, thereby defining a cavity between the wafer carrier membrane and the rigid plate. A fluid conduit is coupled to the rigid plate allowing a source of a vacuum and a source of pressurized fluid alternately to be connected to the cavity.