Patents by Inventor Malgorzata Rubinsztajn

Malgorzata Rubinsztajn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin compositions, solid state devices encapsulated therewith and method
    Publication number: 20050222298
    Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.
    Type: Application
    Filed: May 27, 2005
    Publication date: October 6, 2005
    Inventors: Malgorzata Rubinsztajn, Slawomir Rubinsztajn
  • Encapsulants for solid state devices
    Patent number: 6507049
    Abstract: A packaged solid state device having a package, a chip, and an encapsulate having an epoxy resin, a boron containing catalyst that is essentially free of halogen. A LED device having a package, a LED chip, a encapsulate having a cycloaliphatic epoxy resin and a boroxine catalyst essentially free of halogen. A method of encapsulating a solid state device whereby a solid state device is placed into a package, and an encapsulant comprising an epoxy resin, and a boron containing catalyst that is essentially free of halogen, are provided.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: January 14, 2003
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Malgorzata Rubinsztajn