Patents by Inventor Malikarjun Vasa

Malikarjun Vasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Add-in card connector edge finger optimization for high-speed signaling
    Patent number: 11683887
    Abstract: An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: June 20, 2023
    Assignee: Dell Products L.P.
    Inventors: Malikarjun Vasa, Sanjay Kumar, Bhyrav Mutnury
  • GUARD TRACE GROUND VIA OPTIMIZATION FOR HIGH-SPEED SIGNALING
    Publication number: 20230030534
    Abstract: A printed circuit board (PCB) includes first and second signal voids and a guard trace formed on a surface of the PCB. The first and second signal voids are for connecting to signal contacts of a high-speed data communication interface. The guard trace is located between the first signal void and the second signal void. The PCB further includes first, second, and third ground vias that couple the guard trace to a ground plane of the PCB. The first ground via is located at a first end of the guard trace. The second ground via is located at a second end of the guard trace. The third ground via is located between the first via and the second via.
    Type: Application
    Filed: October 26, 2021
    Publication date: February 2, 2023
    Inventors: Vijender Kumar, Malikarjun Vasa, Bhyrav Mutnury
  • ADD-IN CARD CONNECTOR EDGE FINGER OPTIMIZATION FOR HIGH-SPEED SIGNALING
    Publication number: 20230025833
    Abstract: An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.
    Type: Application
    Filed: October 20, 2021
    Publication date: January 26, 2023
    Inventors: Malikarjun Vasa, Sanjay Kumar, Bhyrav Mutnury