Abstract: A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200° or more.

Abstract: Provided is a method for bonding an insulated coating wire, which is capable of stably bonding a metal wire in an insulated coating wire and an electrode. One aspect of the present invention provides a method for bonding an insulated coating wire for electrically connecting a first electrode 12 and a second electrode to each other by an insulated coating wire 11 in which a metal wire is coated with an organic substance, the method including: a step (a) for placing the insulated coating wire 11 onto the first electrode 12; a step (b) for exposing a metal wire from the insulated coating wire; and a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.

Abstract: Provided is a method for bonding an insulated coating wire, which is capable of stably bonding a metal wire in an insulated coating wire and an electrode. One aspect of the present invention provides a method for bonding an insulated coating wire for electrically connecting a first electrode 12 and a second electrode to each other by an insulated coating wire 11 in which a metal wire is coated with an organic substance, the method including: a step (a) for placing the insulated coating wire 11 onto the first electrode 12; a step (b) for exposing a metal wire from the insulated coating wire; and a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.

Abstract: A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200° or more.

Abstract: A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing an amount of antioxidant gas that is used are provided. The work clamp includes an interior hollow portion 10 providing an atmosphere of the antioxidant gas, a lower opening portion 11a provided below the interior hollow portion, for containing the bonding area in the interior hollow portion, an upper opening portion 11 provided above the interior hollow portion, for exposing the bonding area, a cavity 13 covering the interior hollow portion and having an area larger than an opening area of the upper opening portion, gas introduction ports 14a, 14b provided at the cavity, for introducing the antioxidant gas into the cavity, and holes 21 connected to below the cavity, for blowing the antioxidant gas introduced from the gas introduction port to a portion other than the bonding area of the work.

Abstract: A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing a use amount of antioxidant gas are provided. The work clamp according to the present invention includes an interior hollow portion 10 providing an atmosphere of the antioxidant gas, a lower opening portion 11a provided below the interior hollow portion, for containing the bonding area in the interior hollow portion, an upper opening portion 11 provided above the interior hollow portion, for exposing the bonding area, a cavity 13 covering the interior hollow portion and having an area larger than an opening area of the upper opening portion, gas introduction ports 14a, 14b provided at the cavity, for introducing the antioxidant gas into the cavity, and holes 21 connected to below the cavity, for blowing the antioxidant gas introduced from the gas introduction port to a portion other than the bonding area of the work.