Patents by Inventor Mami MIYATAKE

Mami MIYATAKE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959000
    Abstract: Provided are a photon up-conversion film, which is capable, of high-efficiency up-conversion even in air and even when low-intensity light is used, and a simple method of producing the film. The photon up-conversion film according to one embodiment of the present invention includes: a matrix including a resin; and a pore portion, wherein the photon up-conversion film includes at least a sensitizing component capable of absorbing light in a first wavelength region ?1, and a light-emitting component capable of radiating light in a second wavelength region ?2 including wavelengths shorter than those of the first wavelength region ?1, and wherein the sensitizing component and the light-emitting component are present at an interface between the matrix and the pore portion.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: April 16, 2024
    Assignees: WAKAYAMA PREFECTURE, NITTO DENKO CORPORATION
    Inventors: Takeshi Mori, Tomohiro Mori, Akane Saito, Tsuyoshi Masuda, Hitoshi Saomoto, Mami Kawaguchi, Minoru Miyatake, Shoichi Matsuda, Masato Katsuda
  • Patent number: 11422105
    Abstract: A humidity sensor includes a semiconductor substrate, an insulating film, an interconnect layer formed above the semiconductor substrate via the insulating film, a protective film that covers the interconnect layer, a moisture sensitive film formed above the protective film, and a metal oxide film formed between the protective film and the moisture sensitive film.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: August 23, 2022
    Assignee: MINEBEA MITSUMI Inc.
    Inventor: Mami Miyatake
  • Publication number: 20210181136
    Abstract: A humidity sensor includes a semiconductor substrate, an insulating film, an interconnect layer formed above the semiconductor substrate via the insulating film, a protective film that covers the interconnect layer, a moisture sensitive film formed above the protective film, and a metal oxide film formed between the protective film and the moisture sensitive film.
    Type: Application
    Filed: December 8, 2020
    Publication date: June 17, 2021
    Inventor: Mami MIYATAKE