Patents by Inventor Mami Okamura

Mami Okamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing composition for silicon wafers
    Patent number: 8926859
    Abstract: A polishing composition for a silicon wafer includes a macromolecular compound, an abrasive, and an aqueous medium. The macromolecular compound includes a constitutional unit (a1) represented by the following general formula (1), a constitutional unit (a2) represented by the following general formula (2), and a constitutional unit (a3) represented by the following general formula (3). The total of the constitutional unit (a3) is 0.001 to 1.5 mol % of all the constitutional units of the macromolecular compound.
    Type: Grant
    Filed: July 5, 2010
    Date of Patent: January 6, 2015
    Assignee: Kao Corporation
    Inventors: Masahiko Suzuki, Mami Okamura, Toshiaki Oi
  • POLISHING COMPOSITION FOR SILICON WAFERS
    Publication number: 20120108064
    Abstract: A polishing composition for a silicon wafer includes a macromolecular compound, an abrasive, and an aqueous medium. The macromolecular compound includes a constitutional unit (a1) represented by the following general formula (1), a constitutional unit (a2) represented by the following general formula (2), and a constitutional unit (a3) represented by the following general formula (3). The total of the constitutional unit (a3) is 0.001 to 1.5 mol % of all the constitutional units of the macromolecular compound.
    Type: Application
    Filed: July 5, 2010
    Publication date: May 3, 2012
    Inventors: Masahiko Suzuki, Mami Okamura, Toshiaki Oi