Abstract: A substrate manufacturing method includes: chamfering an outer peripheral portion of the substrate, which is a boundary between the main surface and the side surface, so as to form at least one of an inclined surface or a curved surface; and polishing the main surface, and the chamfering includes forming, at the outer peripheral portion of the substrate, a first chamfered portion by forming an inclined surface or by forming a curved surface as defined herein, and forming a second chamfered portion by forming an inclined surface or by forming a curved surface as defined herein.

Abstract: A processing method includes: acquiring data on an impurity concentration of a workpiece; and planarizing one surface of the workpiece held on a holding table by grinding or polishing the one surface with a planarization processor, and in the planarizing, the one surface of the workpiece is planarized based on the data acquired in the acquiring.

Abstract: A polishing surface dressing method includes: a dressing step of dressing a polishing surface; a polishing surface shape measuring step of measuring the shape of the polishing surface based on a displacement amount in a first direction orthogonal to the polishing surface and a movement position in the second direction of the dressing section that is in contact with the polishing surface; a determination step of determining appropriateness of the shape of the polishing surface measured in the polishing surface shape measuring step; and a condition change step of changing a contact condition in which the dressing section makes contact with the polishing surface in the dressing step, when the shape of the polishing surface is determined to be “No Good”, and the dressing step is performed again based on the contact condition changed in the condition change step.