Abstract: This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D). In General Formula (1), m is an integer of 1 to 3, n is an integer of 10 to 30, and X is a cation.

Abstract: A method of producing copper oxide powder includes a high-purity copper acidic solution preparation step (S01) of preparing an acidic solution containing 99.99% by mass or more of copper regarding metal components as 100% by mass, an organic acid salt addition step (S02) of adding an organic acid salt to this high-purity copper acidic solution, an organic acid copper production step (S03) of generating an organic acid copper by reacting the added organic acid salt with copper ions, an organic acid copper recovery step (S04) of recovering the obtained organic acid copper, and a heating step (S05) of forming copper oxide powder by heating the recovered organic acid copper, in which the organic acid forming the organic acid salt has 10 or less carbon atoms, and copper oxide powder.

Abstract: A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a surfactant; and (D) a leveling agent. In addition, the surfactant contains polyoxyethylene polyoxypropylene alkylamine, an alkyl group of the polyoxyethylene polyoxypropylene alkylamine is CaH2a+1 (where a is 12 to 18). Further, in a case where a number of a functional group of polyoxypropylene of the polyoxyethylene polyoxypropylene alkylamine is set as p and a number of a functional group of polyoxyethylene of the polyoxyethylene polyoxypropylene alkylamine is set as q, the sum of p and q (p+q) is 8 to 21, and a ratio of p to q (p/q) is 0.1 to 1.6.

Abstract: This plating liquid contains (A) a soluble salt that contains at least a stannous salt, (B) an acid selected from organic acids and inorganic acids or a salt thereof, and (C) two kinds of surfactants of an amine-based surfactant (C1) and a nonionic surfactant(s) (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant(s) (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropviene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1+n2) is 40-50. In formula (3), (m1+m2) is 15-30 and n is 40-50.

Abstract: A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent, here, in the Formula (1), X is CaH2a (a is 1 or 3) and m is 2 to 12.

Abstract: This tin or tin-alloy plating liquid contains (A) a soluble salt including at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid, or a salt thereof; (C) a surfactant; (D) a leveling agent; and (E) an additive, wherein the surfactant is a compound (C1) represented by Formula (1) and/or a compound (C2) represented by Formula (2). In Formulas (1) and (2), R is an alkyl group having 7 to 13 carbon atoms, m is 5 to 11, n is 1 to 3, and m and n are different from each other.

Abstract: This plating liquid contains (A) a soluble salt that contains at least a stannous salt, (B) an acid selected from organic acids and inorganic acids or a salt thereof, and (C) two kinds of surfactants of an amine-based surfactant (C1) and a nonionic surfactant(s) (C2 and/or C3). The amine-based. surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant(s) (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropviene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula. (2), m is 15-30 and (n1+n2) is 40-50. In formula. (3), (m1+m2) is 15-30 and n is 40-50.

Abstract: A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a phenyl-based surfactant formed of polyoxyethylene bisphenol ether represented by the General Formula (1); and (D) a leveling agent, here, in the Formula (1), X is CaH2a (a is 1 or 3) and m is 2 to 12.

Abstract: A tin or tin alloy plating solution includes: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a surfactant; and (D) a leveling agent. In addition, the surfactant contains polyoxyethylene polyoxypropylene alkylamine, an alkyl group of the polyoxyethylene polyoxypropylene alkylamine is CaH2a+1 (where a is 12 to 18). Further, in a case where a number of a functional group of polyoxypropylene of the polyoxyethylene polyoxypropylene alkylamine is set as p and a number of a functional group of polyoxyethylene of the polyoxyethylene polyoxypropylene alkylamine is set as q, the sum of p and q (p+q) is 8 to 21, and a ratio of p to q (p/q) is 0.1 to 1.6.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing a specific ammonium salt is provided.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing sulfonium salt with one or more of aromatic rings is provided.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing phosphonium salt with two or more of aromatic rings is provided.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing a specific ammonium salt is provided.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing phosphonium salt with two or more of aromatic rings is provided.

Abstract: A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing sulfonium salt with one or more of aromatic rings is provided.

Abstract: This electrolytic refining method of high-purity electrolytic copper includes: performing electrolysis by using an electrolyte which includes a copper nitrate solution, a cathode made of stainless steel, and an anode made of copper so as to deposit high-purity electrolytic copper on the cathode. (a) The electrolyte includes a mixture of polyethylene glycol and polyvinyl alcohol at a content of 20 ppm or more as an additive. (b) When a molecular weight of the polyethylene glycol is given as Z and a current density during the electrolysis is given as X (A/dm2), the electrolysis is performed under conditions that fulfill the following relational expressions, 1000?Z?2000 1.2?(Z?1000)×0.0008?X?2.2?(Z?1000)×0.001.

Abstract: This electrolytic refining method of high-purity electrolytic copper includes: performing electrolysis by using an electrolyte which includes a copper nitrate solution, a cathode made of stainless steel, and an anode made of copper so as to deposit high-purity electrolytic copper on the cathode. (a) The electrolyte includes a mixture of polyethylene glycol and polyvinyl alcohol at a content of 20 ppm or more as an additive. (b) When a molecular weight of the polyethylene glycol is given as Z and a, current density during the electrolysis is given as X (A/dm2), the electrolysis is performed under conditions that fulfill the following relational expressions, 1000?Z?2000 1.2?(Z?1000)×0.0008?X?2.2?(Z?1000)×0.001.

Abstract: Provided are a highly pure copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the highly pure copper anode. The highly pure copper anode obtains a crystal grain boundary structure having a special grain boundary ratio L?N/LN of 0.35 or more. LN is a unit total special grain boundary length. L?N is a unit total special boundary length. By having the configuration described above, plating defect can be reduced by suppressing the occurrence of the particles, such as the slime or the like, which are generated on the anode side in the plating bath.