Abstract: Disclosed is an automatic transaction apparatus comprising an upper unit and a lower unit, wherein a means is provided for reducing the cost of manufacturing the upper unit. An automatic transaction apparatus comprises: an upper unit (2a) provided with a bill deposit/withdrawal part (3) and a sorting part (4); and a lower unit (2b) comprising denomination-specific cassettes (13) and a reject storage part (15). The automatic transaction apparatus is provided with: an upper conveyance path (7) which conveys bills to the parts in the upper unit (2a); and a lower conveyance path (10) which is connected to the upper conveyance path (7) and is disposed in the lower unit (2b), and which branches midway and conveys bills to the denomination-specific cassettes (13) or the reject storage part (15).

Abstract: Disclosed is an automatic transaction apparatus comprising an upper unit and a lower unit, wherein a means is provided for reducing the cost of manufacturing the upper unit. An automatic transaction apparatus comprises: an upper unit (2a) provided with a bill deposit/withdrawal part (3) and a sorting part (4); and a lower unit (2b) comprising denomination-specific cassettes (13) and a reject storage part (15). The automatic transaction apparatus is provided with: an upper conveyance path (7) which conveys bills to the parts in the upper unit (2a); and a lower conveyance path (10) which is connected to the upper conveyance path (7) and is disposed in the lower unit (2b), and which branches midway and conveys bills to the denomination-specific cassettes (13) or the reject storage part (15).

Abstract: A semiconductor device comprises: a first semiconductor chip having a control circuit; a plurality of second semiconductor chips whose operation is controlled by the control circuit; and a resin sealing body for sealing the first semiconductor chip and the plurality of second semiconductor chips, wherein: the first semiconductor chip is arranged in the central portion of the resin sealing body; and the plurality of second semiconductor chips are arranged on a periphery of the first semiconductor chip. A fuse element is further arranged outside the plurality of second semiconductor chips.

Abstract: A semiconductor device comprises: a first semiconductor chip having a control circuit; a plurality of second semiconductor chips whose operation is controlled by the control circuit; and a resin sealing body for sealing the first semiconductor chip and the plurality of second semiconductor chips, wherein: the first semiconductor chip is arranged in the central portion of the resin sealing body; and the plurality of second semiconductor chips are arranged on a periphery of the first semiconductor chip. A fuse element is further arranged outside the plurality of second semiconductor chips.