Patents by Inventor Mamoru ISOBE

Mamoru ISOBE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210197320
    Abstract: A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.
    Type: Application
    Filed: December 14, 2020
    Publication date: July 1, 2021
    Applicant: AGC Inc.
    Inventors: Mamoru ISOBE, Kohei HORIUCHI
  • Publication number: 20200130105
    Abstract: A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.
    Type: Application
    Filed: October 22, 2019
    Publication date: April 30, 2020
    Applicant: AGC Inc.
    Inventors: Mamoru ISOBE, Shigetoshi MORI, Kohei HORIUCHI
  • Patent number: 10531566
    Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: January 7, 2020
    Assignee: AGC Inc.
    Inventors: Mamoru Isobe, Motoshi Ono, Shigetoshi Mori, Kohei Horiuchi
  • Patent number: 10501369
    Abstract: A translucent substrate includes a glass substrate containing at least one element selected from a group consisting of Bi, Ti and Sn; a coating layer formed on the glass substrate; and a transparent conductive film formed on the coating layer, wherein the coating layer is deposited by a dry depositing method.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: December 10, 2019
    Assignee: AGC Inc.
    Inventors: Takahiro Mashimo, Naoto Kihara, Kazunobu Maeshige, Teruo Fujiwara, Masahiro Kishi, Nobuhiro Nakamura, Mamoru Isobe
  • Patent number: 10292275
    Abstract: A method of manufacturing a glass substrate that has a through hole, includes (1) forming an initial hole in a glass substrate by irradiating laser light from a first surface side of the glass substrate; (2) performing a first etching process using a first etching solution to form, from the initial hole, a first through hole that extends from a first opening formed at a first surface to a second opening formed at a second surface, and to make a ratio “d1/Rt1” of a thickness “d1” of the glass substrate with respect to a diameter “Rt1” of the first opening to be within a range between 10 to 20; and (3) performing a second etching process to enlarge the first through hole using a second etching solution, whose etching rate with respect to the glass substrate is faster than that of the first etching solution.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: May 14, 2019
    Assignee: AGC INC.
    Inventor: Mamoru Isobe
  • Patent number: 10264672
    Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: April 16, 2019
    Assignee: AGC Inc.
    Inventors: Shigetoshi Mori, Motoshi Ono, Mamoru Isobe, Kohei Horiuchi
  • Publication number: 20190021170
    Abstract: A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 ?m or less. Perpendicularity expressed by P=tc/t0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, tc is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t0 is the thickness of the glass substrate.
    Type: Application
    Filed: July 9, 2018
    Publication date: January 17, 2019
    Applicant: AGC Inc.
    Inventors: Mamoru ISOBE, Motoshi ONO, Shigetoshi MORI, Kohei HORIUCHI
  • Publication number: 20180339936
    Abstract: A manufacturing method of a glass substrate having through holes includes (i) irradiating at a through hole forming target position on a first surface of the glass substrate with a laser light; and (ii) performing a wet etching treatment on the glass substrate. During the wet etching treatment being performed on the glass substrate, an ultrasonic vibration with a frequency of less than 40 kHz is applied to an etchant over at least a part of the wet etching period, referred to as an ultrasonic vibration application period.
    Type: Application
    Filed: May 25, 2018
    Publication date: November 29, 2018
    Applicant: Asahi Glass Company, Limited
    Inventors: Motoshi Ono, Mamoru Isobe, Shigetoshi Mori, Kohei Horiuchi
  • Publication number: 20180317319
    Abstract: A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.
    Type: Application
    Filed: April 25, 2018
    Publication date: November 1, 2018
    Applicant: Asahi Glass Company, Limited
    Inventors: Shigetoshi MORI, Motoshi ONO, Mamoru ISOBE, Kohei HORIUCHI
  • Publication number: 20180312432
    Abstract: A glass substrate having a plurality of holes includes a first surface and a second surface, which are opposite to each other. Each of the holes is arranged so as to have an aperture on the first surface. The plurality of holes includes a first hole group including a plurality of first holes having a first aperture diameter including a first variation, and a second hole group including a second hole or a plurality of second holes having a second aperture diameter including a second variation. Each of the first holes has an aspect ratio of greater than 1, and a surface roughness on an inner wall (arithmetic average roughness Ra) of less than 0.1 ?m. The second aperture diameter is greater than the first aperture diameter by 15% or more, or less than the first aperture diameter by 15% or more.
    Type: Application
    Filed: April 24, 2018
    Publication date: November 1, 2018
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Kohei HORIUCHI, Motoshi ONO, Mamoru ISOBE, Shigetoshi MORI
  • Publication number: 20170295652
    Abstract: A method of manufacturing a glass substrate that has a through hole, includes (1) forming an initial hole in a glass substrate by irradiating laser light from a first surface side of the glass substrate; (2) performing a first etching process using a first etching solution to form, from the initial hole, a first through hole that extends from a first opening formed at a first surface to a second opening formed at a second surface, and to make a ratio “d1/Rt1” of a thickness “d1” of the glass substrate with respect to a diameter “Rt1” of the first opening to be within a range between 10 to 20; and (3) performing a second etching process to enlarge the first through hole using a second etching solution, whose etching rate with respect to the glass substrate is faster than that of the first etching solution.
    Type: Application
    Filed: April 5, 2017
    Publication date: October 12, 2017
    Applicant: Asahi Glass Company, Limited
    Inventor: Mamoru ISOBE
  • Publication number: 20160347643
    Abstract: There is provided a glass substrate manufacturing method for manufacturing a glass substrate with a plurality of through-holes. The method includes a laser processing of forming the plurality of through-holes in the glass substrate, the glass substrate having a first main surface and a second main surface facing the first main surface, by irradiating a laser beam toward the first main surface; and an etching process of injecting an etchant only from a position facing the second main surface of the glass substrate toward the plurality of through-holes formed in the glass substrate.
    Type: Application
    Filed: May 23, 2016
    Publication date: December 1, 2016
    Applicant: Asahi Glass Company, Limited
    Inventors: Hiroyuki YAMAUCHI, Go Takahashi, Motoshi Ono, Mamoru Isobe
  • Publication number: 20160060162
    Abstract: A translucent substrate includes a glass substrate containing at least one element selected from a group consisting of Bi, Ti and Sn; a coating layer formed on the glass substrate; and a transparent conductive film formed on the coating layer, wherein the coating layer is deposited by a dry depositing method.
    Type: Application
    Filed: November 5, 2015
    Publication date: March 3, 2016
    Applicant: Asahi Glass Company, Limited
    Inventors: Takahiro MASHIMO, Naoto KIHARA, Kazunobu MAESHIGE, Teruo FUJIWARA, Masahiro KISHI, Nobuhiro NAKAMURA, Mamoru ISOBE
  • Patent number: 8451704
    Abstract: A phase difference layer 12 and a reflection layer 13 are provided. Then, adjustment is performed such that the phase difference layer 12 and the reflection layer 13 impart a predetermined phase difference to light having a particular wavelength bandwidth or plural kinds of light of different wavelengths that enter in an oblique direction relative to the normal direction of the plane of the phase difference layer 12. By virtue of this, the light 16a that goes forward and backward through the phase difference layer 12 and then exits the layer has an ellipticity ? of 0.7 or greater. Thus, in particular, when this wave plate is employed in an optical head device, the function of reflection and the function of a ¼-wave plate are integrated. Thus, stable recording and reproduction of an optical disk are achieved, and size reduction is achieved in the optical head device.
    Type: Grant
    Filed: April 19, 2012
    Date of Patent: May 28, 2013
    Assignee: Asahi Glass Company, Limited
    Inventors: Koji Miyasaka, Takuji Nomura, Mamoru Isobe
  • Publication number: 20120207007
    Abstract: A phase difference layer 12 and a reflection layer 13 are provided. Then, adjustment is performed such that the phase difference layer 12 and the reflection layer 13 impart a predetermined phase difference to light having a particular wavelength bandwidth or plural kinds of light of different wavelengths that enter in an oblique direction relative to the normal direction of the plane of the phase difference layer 12. By virtue of this, the light 16a that goes forward and backward through the phase difference layer 12 and then exits the layer has an ellipticity ? of 0.7 or greater. Thus, in particular, when this wave plate is employed in an optical head device, the function of reflection and the function of a ¼-wave plate are integrated. Thus, stable recording and reproduction of an optical disk are achieved, and size reduction is achieved in the optical head device.
    Type: Application
    Filed: April 19, 2012
    Publication date: August 16, 2012
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Koji MIYASAKA, Takuji NOMURA, Mamoru ISOBE