Abstract: A device housing package includes a substrate having a device mounting region; a frame body having a through hole formed in part thereof, the frame body being disposed on the substrate so as to lie along a periphery of the device mounting region; and an input-output terminal disposed in the through hole, having a first dielectric layer; a signal line formed on the first dielectric layer; a first ground layer formed on a lower face of the first dielectric layer; a second dielectric layer formed on the signal line so as to overlap the frame body; a second ground layer formed on an upper face of the second dielectric layer; and a metal layer disposed within the second dielectric layer The metal layer is formed to extend from the second dielectric layer to the first dielectric layer, being separated from the signal line.

Abstract: A device housing package includes a substrate having a device mounting region; a frame body having a through hole formed in part thereof, the frame body being disposed on the substrate so as to lie along a periphery of the device mounting region; an input-output terminal disposed in the through hole, having a first dielectric layer; a signal line formed on the first dielectric layer; a first ground layer formed on a lower face of the first dielectric layer; a second dielectric layer formed on the signal line so as to overlap the frame body; a second ground layer formed on an upper face of the second dielectric layer; and a metal layer disposed within the second dielectric layer The metal layer is formed to extend from the second dielectric layer to the first dielectric layer, being separated from the signal line.