Abstract: A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.

Abstract: A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.

Abstract: A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-m

Abstract: A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-m

Abstract: An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.

Abstract: A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-m

Abstract: This burner apparatus (S1) includes: an ignition system (7) including a heating portion (7a, 7c) which heats air-fuel mixture to its ignition temperature or more; and a windbreak device (10) placed around the heating portion (7a, 7c) apart from the heating portion (7a, 7c), and configured to reduce a flow speed of fluid (X) which is supplied to the heating portion (7a, 7c). According to the burner apparatus (S1), it is possible to improve the ignition performance of the ignition system, and to also generate high-temperature gas stably.

Abstract: A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-m

Abstract: The present invention is a burner apparatus (S1, S2, S3, S4) that combusts air-fuel mixture (Y) of an oxidizing agent and fuel. This burner apparatus (S1, S2, S3, S4) includes a partitioning component (8) that separates an ignition chamber (R2) where the air-fuel mixture (Y) is ignited and a combustion holding chamber (R3) where the combustion of the air-fuel mixture (Y) is maintained such that the air-fuel mixture (Y) is able to pass between them, wherein the partitioning component (8) adjusts the flow rate of the air-fuel mixture (Y) that is supplied from the ignition chamber (R2) to the combustion holding chamber (R3).

Abstract: In a premixed compression ignition diesel engine 1 with fuel being injected midway of a intake passage 15, an intake port 6 is formed with an orifice 10 which is throttled in passage cross-sectional area at least in an opening operation of an intake valve 7. This prevents adhesion of the fuel to an inner wall of the intake passage and promotes atomization of the fuel. A combustion chamber is fed with the sufficiently atomized fuel, which prevents combustion failure in the combustion chamber to attain reduction of particulate matters.

Abstract: A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.

Abstract: An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.

Abstract: In a diesel engine 1 with fuel injection valves 6a and 6b for injecting fuel 5a, 5b into a combustion chamber 4, respectively, the valves 6a and 6b are arranged such that they are opposed to each other horizontally and diametrically of the combustion chamber 4 in a plan view and are out of alignment in height to each other axially of a cylinder 2. With the valves 6a and 6b being positioned close to and away from the cylinder head 7, respectively, an upper surface of the piston 3 has a rising gradient extending from its side adjacent to the valve 6b toward its side adjacent to the valve 6a up to diametrically halfway of the piston 3.

Abstract: In a diesel engine including a fuel injection valve for injection of fuel into a combustion chamber to produce sprays in the chamber, an axis of the valve is deviated radially outwardly of an axis of a cylinder, so that the valve is positioned close to an inner periphery of the cylinder. Nozzle holes of the valve are grouped into two groups with respect to a line formed by connecting, in plan view, the axis of the valve with the axis of the cylinder. The sprays injected from the nozzle holes advance in a fan-like manner in the plan view and strike against the inner periphery of the cylinder on a side away from the valve.

Abstract: A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the second carbon fiber sheets have a thermal expansion coefficient larger than that of the first carbon fiber sheet. Next, the stack of the first carbon fiber sheet is then held between two sets of stack of the second carbon fiber sheets. The stack of the first and second carbon fiber sheets are then impregnated with an epoxy-base resin composition and the resin is solidified. As a result a prepreg composed of the first and second carbon fiber sheets and the resin component composed of the epoxy-base resin composition is obtained. Thereafter, interconnections and the like are then formed on the prepreg, to thereby complete a multilevel interconnection board.

Abstract: This burner apparatus (S1) includes: an ignition system (7) including a heating portion (7a, 7c) which heats air-fuel mixture to its ignition temperature or more; and a windbreak device (10) placed around the heating portion (7a, 7c) apart from the heating portion (7a, 7c), and configured to reduce a flow speed of fluid (X) which is supplied to the heating portion (7a, 7c). According to the burner apparatus (S1), it is possible to improve the ignition performance of the ignition system, and to also generate high-temperature gas stably.

Abstract: The present invention is a burner apparatus (S1, S2, S3, S4) that combusts air-fuel mixture (Y) of an oxidizing agent and fuel. This burner apparatus (S1, S2, S3, S4) includes a partitioning component (8) that separates an ignition chamber (R2) where the air-fuel mixture (Y) is ignited and a combustion holding chamber (R3) where the combustion of the air-fuel mixture (Y) is maintained such that the air-fuel mixture (Y) is able to pass between them, wherein the partitioning component (8) adjusts the flow rate of the air-fuel mixture (Y) that is supplied from the ignition chamber (R2) to the combustion holding chamber (R3).

Abstract: In a diesel engine including a fuel injection valve for injection of fuel into a combustion chamber to produce sprays in the chamber, an axis of the valve is deviated radially outwardly of an axis of a cylinder, so that the valve is positioned close to an inner periphery of the cylinder. Nozzle holes of the valve are grouped into two groups with respect to a line formed by connecting, in plan view, the axis of the valve with the axis of the cylinder. The sprays injected from the nozzle holes advance in a fan-like manner in the plan view and strike against the inner periphery of the cylinder on a side away from the valve.

Abstract: In a diesel engine 1 with fuel injection valves 6a and 6b for injecting fuel 5a, 5b into a combustion chamber 4, respectively, the valves 6a and 6b are arranged such that they are opposed to each other horizontally and diametrically of the combustion chamber 4 in a plan view and are out of alignment in height to each other axially of a cylinder 2. With the valves 6a and 6b being positioned close to and away from the cylinder head 7, respectively, an upper surface of the piston 3 has a rising gradient extending from its side adjacent to the valve 6b toward its side adjacent to the valve 6a up to diametrically halfway of the piston 3.

Abstract: In a premixed compression ignition diesel engine 1 with fuel being injected midway of a intake passage 15, an intake port 6 is formed with an orifice 10 which is throttled in passage cross-sectional area at least in an opening operation of an intake valve 7. This prevents adhesion of the fuel to an inner wall of the intake passage and promotes atomization of the fuel. A combustion chamber is fed with the sufficiently atomized fuel, which prevents combustion failure in the combustion chamber to attain reduction of particulate matters.