Patents by Inventor Mamoru Kurashina

Mamoru Kurashina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9754830
    Abstract: A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: September 5, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Taiga Fukumori, Daisuke Mizutani, Mamoru Kurashina
  • Publication number: 20160233128
    Abstract: A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.
    Type: Application
    Filed: April 19, 2016
    Publication date: August 11, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Taiga Fukumori, Daisuke Mizutani, Mamoru Kurashina
  • Patent number: 9326372
    Abstract: A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-m
    Type: Grant
    Filed: April 8, 2015
    Date of Patent: April 26, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Mamoru Kurashina, Daisuke Mizutani
  • Publication number: 20150216040
    Abstract: A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-m
    Type: Application
    Filed: April 8, 2015
    Publication date: July 30, 2015
    Inventors: Mamoru KURASHINA, Daisuke MIZUTANI
  • Patent number: 9055685
    Abstract: An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: June 9, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Mamoru Kurashina, Daisuke Mizutani, Taiga Fukumori
  • Patent number: 9048332
    Abstract: A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-m
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: June 2, 2015
    Assignee: FUJITSU LIMITED
    Inventors: Mamoru Kurashina, Daisuke Mizutani
  • Patent number: 8905752
    Abstract: This burner apparatus (S1) includes: an ignition system (7) including a heating portion (7a, 7c) which heats air-fuel mixture to its ignition temperature or more; and a windbreak device (10) placed around the heating portion (7a, 7c) apart from the heating portion (7a, 7c), and configured to reduce a flow speed of fluid (X) which is supplied to the heating portion (7a, 7c). According to the burner apparatus (S1), it is possible to improve the ignition performance of the ignition system, and to also generate high-temperature gas stably.
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: December 9, 2014
    Assignee: IHI Corporation
    Inventors: Youichi Marutani, Yasunori Ashikaga, Syouji Itoh, Akihiko Ogasawara, Mamoru Kurashina
  • Publication number: 20140264935
    Abstract: A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-m
    Type: Application
    Filed: December 19, 2013
    Publication date: September 18, 2014
    Applicant: Fujitsu Limited
    Inventors: Mamoru Kurashina, Daisuke Mizutani
  • Patent number: 8733085
    Abstract: The present invention is a burner apparatus (S1, S2, S3, S4) that combusts air-fuel mixture (Y) of an oxidizing agent and fuel. This burner apparatus (S1, S2, S3, S4) includes a partitioning component (8) that separates an ignition chamber (R2) where the air-fuel mixture (Y) is ignited and a combustion holding chamber (R3) where the combustion of the air-fuel mixture (Y) is maintained such that the air-fuel mixture (Y) is able to pass between them, wherein the partitioning component (8) adjusts the flow rate of the air-fuel mixture (Y) that is supplied from the ignition chamber (R2) to the combustion holding chamber (R3).
    Type: Grant
    Filed: July 14, 2010
    Date of Patent: May 27, 2014
    Assignee: IHI Corporation
    Inventors: Youichi Marutani, Yasunori Ashikaga, Syouji Itoh, Akihiko Ogasawara, Mamoru Kurashina
  • Patent number: 8651082
    Abstract: In a premixed compression ignition diesel engine 1 with fuel being injected midway of a intake passage 15, an intake port 6 is formed with an orifice 10 which is throttled in passage cross-sectional area at least in an opening operation of an intake valve 7. This prevents adhesion of the fuel to an inner wall of the intake passage and promotes atomization of the fuel. A combustion chamber is fed with the sufficiently atomized fuel, which prevents combustion failure in the combustion chamber to attain reduction of particulate matters.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: February 18, 2014
    Assignee: IHI Corporation
    Inventors: Youichi Marutani, Yasunori Ashikaga, Mamoru Kurashina
  • Publication number: 20140022751
    Abstract: An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.
    Type: Application
    Filed: May 24, 2013
    Publication date: January 23, 2014
    Applicant: FUJITSU LIMITED
    Inventors: Mamoru Kurashina, Daisuke Mizutani, Taiga Fukumori
  • Publication number: 20140021609
    Abstract: A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate.
    Type: Application
    Filed: June 18, 2013
    Publication date: January 23, 2014
    Inventors: Taiga Fukumori, Daisuke Mizutani, Mamoru Kurashina
  • Patent number: 8534262
    Abstract: In a diesel engine 1 with fuel injection valves 6a and 6b for injecting fuel 5a, 5b into a combustion chamber 4, respectively, the valves 6a and 6b are arranged such that they are opposed to each other horizontally and diametrically of the combustion chamber 4 in a plan view and are out of alignment in height to each other axially of a cylinder 2. With the valves 6a and 6b being positioned close to and away from the cylinder head 7, respectively, an upper surface of the piston 3 has a rising gradient extending from its side adjacent to the valve 6b toward its side adjacent to the valve 6a up to diametrically halfway of the piston 3.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: September 17, 2013
    Assignee: IHI Corporation
    Inventors: Youichi Marutani, Yasunori Ashikaga, Takayuki Yamada, Mamoru Kurashina
  • Patent number: 8418673
    Abstract: In a diesel engine including a fuel injection valve for injection of fuel into a combustion chamber to produce sprays in the chamber, an axis of the valve is deviated radially outwardly of an axis of a cylinder, so that the valve is positioned close to an inner periphery of the cylinder. Nozzle holes of the valve are grouped into two groups with respect to a line formed by connecting, in plan view, the axis of the valve with the axis of the cylinder. The sprays injected from the nozzle holes advance in a fan-like manner in the plan view and strike against the inner periphery of the cylinder on a side away from the valve.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: April 16, 2013
    Assignee: IHI Corporation
    Inventors: Youichi Marutani, Yasunori Ashikaga, Takayuki Yamada, Mamoru Kurashina
  • Patent number: 8257542
    Abstract: A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the second carbon fiber sheets have a thermal expansion coefficient larger than that of the first carbon fiber sheet. Next, the stack of the first carbon fiber sheet is then held between two sets of stack of the second carbon fiber sheets. The stack of the first and second carbon fiber sheets are then impregnated with an epoxy-base resin composition and the resin is solidified. As a result a prepreg composed of the first and second carbon fiber sheets and the resin component composed of the epoxy-base resin composition is obtained. Thereafter, interconnections and the like are then formed on the prepreg, to thereby complete a multilevel interconnection board.
    Type: Grant
    Filed: October 9, 2009
    Date of Patent: September 4, 2012
    Assignee: Fujitsu Limited
    Inventors: Keishiro Okamoto, Mamoru Kurashina, Tomoyuki Abe
  • Publication number: 20120107755
    Abstract: This burner apparatus (S1) includes: an ignition system (7) including a heating portion (7a, 7c) which heats air-fuel mixture to its ignition temperature or more; and a windbreak device (10) placed around the heating portion (7a, 7c) apart from the heating portion (7a, 7c), and configured to reduce a flow speed of fluid (X) which is supplied to the heating portion (7a, 7c). According to the burner apparatus (S1), it is possible to improve the ignition performance of the ignition system, and to also generate high-temperature gas stably.
    Type: Application
    Filed: July 14, 2010
    Publication date: May 3, 2012
    Inventors: Youichi Marutani, Yasunori Ashikaga, Syouji Itoh, Akihiko Ogasawara, Mamoru Kurashina
  • Publication number: 20120096840
    Abstract: The present invention is a burner apparatus (S1, S2, S3, S4) that combusts air-fuel mixture (Y) of an oxidizing agent and fuel. This burner apparatus (S1, S2, S3, S4) includes a partitioning component (8) that separates an ignition chamber (R2) where the air-fuel mixture (Y) is ignited and a combustion holding chamber (R3) where the combustion of the air-fuel mixture (Y) is maintained such that the air-fuel mixture (Y) is able to pass between them, wherein the partitioning component (8) adjusts the flow rate of the air-fuel mixture (Y) that is supplied from the ignition chamber (R2) to the combustion holding chamber (R3).
    Type: Application
    Filed: July 14, 2010
    Publication date: April 26, 2012
    Inventors: Youichi Marutani, Yasunori Ashikaga, Syouji Itoh, Akihiko Ogasawara, Mamoru Kurashina
  • Publication number: 20110155101
    Abstract: In a diesel engine including a fuel injection valve for injection of fuel into a combustion chamber to produce sprays in the chamber, an axis of the valve is deviated radially outwardly of an axis of a cylinder, so that the valve is positioned close to an inner periphery of the cylinder. Nozzle holes of the valve are grouped into two groups with respect to a line formed by connecting, in plan view, the axis of the valve with the axis of the cylinder. The sprays injected from the nozzle holes advance in a fan-like manner in the plan view and strike against the inner periphery of the cylinder on a side away from the valve.
    Type: Application
    Filed: November 5, 2008
    Publication date: June 30, 2011
    Applicant: IHI Corporation
    Inventors: Youichi Marutani, Yasunori Ashikaga, Takayuki Yamada, Mamoru Kurashina
  • Publication number: 20100294234
    Abstract: In a diesel engine 1 with fuel injection valves 6a and 6b for injecting fuel 5a, 5b into a combustion chamber 4, respectively, the valves 6a and 6b are arranged such that they are opposed to each other horizontally and diametrically of the combustion chamber 4 in a plan view and are out of alignment in height to each other axially of a cylinder 2. With the valves 6a and 6b being positioned close to and away from the cylinder head 7, respectively, an upper surface of the piston 3 has a rising gradient extending from its side adjacent to the valve 6b toward its side adjacent to the valve 6a up to diametrically halfway of the piston 3.
    Type: Application
    Filed: November 5, 2008
    Publication date: November 25, 2010
    Applicant: IHI Corporation
    Inventors: Youichi Marutani, Yasunori Ashikaga, Takayuki Yamada, Mamoru Kurashina
  • Publication number: 20100263624
    Abstract: In a premixed compression ignition diesel engine 1 with fuel being injected midway of a intake passage 15, an intake port 6 is formed with an orifice 10 which is throttled in passage cross-sectional area at least in an opening operation of an intake valve 7. This prevents adhesion of the fuel to an inner wall of the intake passage and promotes atomization of the fuel. A combustion chamber is fed with the sufficiently atomized fuel, which prevents combustion failure in the combustion chamber to attain reduction of particulate matters.
    Type: Application
    Filed: November 5, 2008
    Publication date: October 21, 2010
    Applicant: IHI Corporation
    Inventors: Youichi Marutani, Yasunori Ashikaga, Mamoru Kurashina