Patents by Inventor Mamoru Mohri

Mamoru Mohri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anodic bondable porcelain and composition for the porcelain
    Patent number: 8481441
    Abstract: An anodic bondable low-temperature fired porcelain having high-strength and low-thermal-expansion, wherein a conductive ion during anodic bonding is an Li ion, containing a complex oxide having a composition represented by the following formula: (1?x)(?Li2O-?MgO-?Al2O3-?Si2O2).xBi2O3??(1) where x represents a mass ratio of 0.01 to 0.1, and ?, ?, ? and ? have a molar ratio of 2 to 5:1 to 2:1 to 2:7 to 17.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: July 9, 2013
    Assignee: Nikko Company
    Inventors: Mamoru Mohri, Naoki Kidani
  • ANODIC BONDABLE PORCELAIN AND COMPOSITION FOR THE PORCELAIN
    Publication number: 20110108931
    Abstract: An anodic bondable low-temperature fired porcelain having high-strength and low-thermal-expansion, wherein a conductive ion during anodic bonding is an Li ion, containing a complex oxide having a composition represented by the following formula: (1?x)(?Li2O-?MgO-?Al2O3-?Si2O2).xBi2O3??(1) where x represents a mass ratio of 0.01 to 0.1, and ?, ?, ? and ? have a molar ratio of 2 to 5:1 to 2:1 to 2:7 to 17.
    Type: Application
    Filed: August 4, 2009
    Publication date: May 12, 2011
    Applicant: NIKKO COMPANY
    Inventors: Mamoru Mohri, Naoki Kidani
  • Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste
    Patent number: 5922245
    Abstract: A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable.
    Type: Grant
    Filed: September 3, 1997
    Date of Patent: July 13, 1999
    Assignee: Nikko Company
    Inventors: Mamoru Mohri, Motoharu Miyakoshi, Kiyoshi Mizushima
  • Conductor paste for plugging through-holes in ceramic circuit boards and a ceramic circuit board having this conductor paste
    Patent number: 5698015
    Abstract: A conductor paste for plugging a through-hole in a ceramic substrate which includes an electrically conductive powder having a metal powder as its main component, a swelling agent and a vehicle, and may also include adhesion improvers. After sintering the conductor paste, a conductor plug is created which will not fall out of the through-hole, is resistant to chipping during the leveling process and may be gas impermeable.
    Type: Grant
    Filed: March 26, 1996
    Date of Patent: December 16, 1997
    Assignee: Nikko Company
    Inventors: Mamoru Mohri, Motoharu Miyakoshi, Kiyoshi Mizushima