Abstract: There is disclosed a polishing pad for mirror-polishing a semiconductor wafer, especially in a finish polishing process, by use of a polishing machine which includes a turn table on which a polishing pad is attached, a unit for feeding a polishing agent onto a surface of the polishing pad, and a mechanism for pressing a semiconductor wafer onto the surface of the polishing pad. The polishing pad includes a top layer formed of a porous soft material, a bottom layer formed of a rubber elastomer, and an intermediate layer formed of a hard plastic sheet. The hard plastic sheet is disposed between the top layer and the bottom layer and is bonded to the bottom layer. In the polishing pad, undulation produced in the bottom layer due to a horizontal force generated during polishing is prevented from being transferred to the top layer of the polishing pad, and unevenness in polishing stock removal stemming from warpage or undulation of a wafer itself can be mitigated.

Abstract: In a separable slide fastener, a succession of discrete fastener elements molded on a pair of parallel connecting yarns at regular distances are folded individually in a U-shape about an inner edge of each of opposed fastener tapes and are attached by sewing threads. Several of the fastener elements are removed from a bottom end portion of each fastener tape by cutting the connecting yarns with corresponding part of the sewing threads remaining uncut as cores. Each of upper and lower legs of a lowermost one of said fastener elements is flatted to form a small-thickness portion. An insertion pin of a separable bottom stop assembly is attached to the bottom end portion of one fastener tape by clenching so as to hold the small-thickness portions and the cores, and a box pin is attached to the bottom end portion of the other fastener tape in the same manner.

Abstract: A slide fastener is disclosed which comprises a pair of stringer tapes each having molded thereon a row of coupling elements. The elements is formed from a thermoplastic resin composition containing 0.01-10 weight % of an organopolysiloxane. The resin composition facilitates separation of the stringers from the mold and movement of a slider on the fastener.