Abstract: A reflector is disclosed which enables bright image display with a wide angle of view and can be efficiently fabricated by a a simplified process. The reflector includes a resin layer having at its surface microscopic projections and depressions and formed by application of a coating composition containing a binder resin and crosslinked resin particles.

Abstract: A thermosetting composite dielectric film characterized in that the film has flexibility and is made of a thermosetting resin such as an epoxy resin having an epoxy equivalent of 150 to 2500 and containing dielectric ceramics having a high dielectric constant and in that the film has a dielectric constant of 25 or more.

Abstract: A method is disclosed which can form a thin metal film in a cost-effective manner and by a simple process of applying a coating composition. The method involves applying a coating composition containing colloidal particles of noble metal or copper, as obtained by reducing a compound of the noble metal or copper in the presence of a polymeric dispersant, to form a coating film, and heating the coating film so that the colloidal particles present therein are fused together to form a thin metal film.

Abstract: Disclosed is a simple correction method of defects in color layer, which occur in production of color filter. The method does not have the problems associated with the conventional correction methods. The present invention provides a method for correcting defects in a color filter, comprising:(a) forming an electrodeposited film having certain color by means of electrodeposition method on defect portions of a color filter which comprises a transparent substrate, a transparent electrode formed on at least a portion of the transparent substrate and a color layer having a color pattern formed thereon, wherein the color layer has defect portions that formation of the color layer is incomplete, and(b) curing the electrodeposited film with heat or ultraviolet light.

Abstract: Water spotting which occurs during rinsing of an electrodeposited photosensitive resist composition on a copper layer of a printed circuit board is reduced by applying an aqueous solution containing a surfactant. The surfactant is preferably a salt of an acylated polypeptide which is solid at ambient room temperature and forms a thin uniform film when the solution is dried.

Abstract: A positive-type photosensitive resin composition containing a resin which results from reactions between a specific polyepoxide compound, a carboxylic acid compound having a specific phenolic hydroxyl group, a carboxylic acid compound having no specific phenolic hydroxyl group, and 1,2-quinone diazide sulfonyl halide. The resin composition has high exposure sensitivity, is capable of inhibiting swell or dissolution of unexposed areas during the stage of development, and yet retains other favorable properties. The resin composition has also attained short developing time.

Abstract: The present invention has as its object providing a solder mask which permits high density mounting, is suitable for protecting conductor circuits, particularly has mask thickness on the circuit parts and each edge part of the circuits which make almost no difference from those on other parts, and is excellent in electrical insulation, heat resistance and solvent resistance.

Abstract: A positive type photosensitive resinous composition comprising a binder resin and a quinone diazide compound, the binder resin being a copolymer of(a) at least one phosphoric acid ester monomer represented by the formula: ##STR1## (b) at least one acid group containing .alpha.,.beta.-ethylenically unsaturated monomer, and(c) other copolymerizable .alpha.,.beta.-ethylenically unsaturated monomers than (a) and (b), which is specifically useful for the formation of resist coating in the preparation of printed circuit board.

Abstract: The invention provides an aqueous electrodeposition coating composition for a positive working resist and an image-forming method using the same. The coating composition is very stable under storage conditions and is capable of resulting in a positive working resist which is specifically useful in the preparation of a printed circuit board with mini-via-holes.

Abstract: The invention provides an aqueous electrodeposition coating composition for a positive working resist and an image-forming method using the same. The coating composition is very stable under storage conditions and is capable of resulting in a positive working resist which is specifically useful in the preparation of a printed circuit board with mini-via-holes.

Abstract: The invention provides a positive type photosensitive resinous composition comprising a resin obtained by the reaction of a polyepoxide compound, an aromatic or heterocyclic carboxylic acid bearing a phenolic hydroxyl group(s) and 1,2-quinondiazido sulfonic acid halide with the use of those three components in a defined proportion, which is useful for microfabrication photo-resist and photosensitive materials for use in lithographic plates because of excellent flexibility and adhesion to supporting substrates, when developed, non-exposed area are extremely resistive toward swelling.

Abstract: There is hereby provided a photosensitive resin composition suitable for a relief printing plate having an excellent resistance to a water based ink, whereby water or a water like solvent can be employed as a developing solution, which comprises;(i) a polymer (A) having a molecular weight of 5,000 to 500,000 which contains an amino group and a polymerizable double bond moiety,(ii) a monomer (B) having an .alpha.,.beta.-ethylenically unsaturated bond and a free acid group which can quaternize the nitrogen atom of the polymer (A),(iii) a photopolymerizable unsaturated compound (C), and(iv) a photopolymerization initiator (D).

Abstract: The invention provides a photosensitive resin composition specifically useful for microfabrication resist films and photosensitive materials for use in lithographic plates because of excellent flexibility and adhesion, and moreover, when developed, non-exposed parts being of extremely less swelling nature.

Abstract: The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.

Abstract: The invention provides a method for preparing a printed circuit board with solder plated circuit and through-holes, using a specifically prepared photoresist material and a combination of exposure, development, solder plating and etching means.This method is particularly useful for the preparation of a printed circuit-board with solder plated circuit and through-holes bearing a high density circuit pattern.

Abstract: The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.