Abstract: A mold for molding an expanded resin, wherein a silicone rubber layer (40) having a JIS-A hardness of 20 to 70 is formed as a heat-insulating layer at least on a part or the whole of the inner wall surface that forms a cavity (20) of a mold main body (10) which is for use in molding an expanded resin and which is made of an aluminum material. This mold for molding an expanded resin is effectively usable in molding expanded polystyrene or the like by a bead molding method, and can produce a molded product of an expanded resin with high thermal efficiency by virtue of high heat insulation performance. Further, the mold can be easily produced with good execution efficiency.

Abstract: Provided is a room temperature and humidity thickening thermo-conductive silicone grease composition with high shape retention characteristics and good workability despite a low viscosity in an initial phase. Essential components of the room temperature and humidity thickening thermo-conductive silicone grease composition of the present invention are: (A) organopolysiloxane with a viscosity of between 0.1 Pa·s and 1,000 Pa·s at 25° C.

Abstract: Provided is a room temperature and humidity thickening thermo-conductive silicone grease composition with high shape retention characteristics and good workability despite a low viscosity in an initial phase. Essential components of the room temperature and humidity thickening thermo-conductive silicone grease composition of the present invention are: (A) organopolysiloxane with a viscosity of between 0.1 Pa·s and 1,000 Pa·s at 25° C.

Abstract: A room temperature fast-curing organopolysiloxane composition which has excellent fast curability as well as deep curability is provided without using an organic compound having C?O group and the organic compound having NH2 group which are the volatile components. A method for curing such composition is also provided. The room temperature fast-curing organopolysiloxane composition comprises: (A) 100 parts by weight of a diorganopolysiloxane having both ends terminated with hydroxy group and/or a hydrolyzable group; (B) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 alkenoxysilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; (C) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 aminosilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; and (D) 0.01 to 10 parts by weight of a curing catalyst.

Abstract: A room temperature fast-curing organopolysiloxane composition which has excellent fast curability as well as deep curability is provided without using an organic compound having C?O group and the organic compound having NH2 group which are the volatile components. A method for curing such composition is also provided. The room temperature fast-curing organopolysiloxane composition comprises: (A) 100 parts by weight of a diorganopolysiloxane having both ends terminated with hydroxy group and/or a hydrolyzable group; (B) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 alkenoxysilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; (C) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 aminosilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; and (D) 0.01 to 10 parts by weight of a curing catalyst.

Abstract: A room temperature fast-curing organopolysiloxane composition which has excellent fast curability as well as deep curability is provided without using an organic compound having C?O group and the organic compound having NH2 group which are the volatile components. A method for curing such composition is also provided. The room temperature fast-curing organopolysiloxane composition comprises: (A) 100 parts by weight of a diorganopolysiloxane having both ends terminated with hydroxy group and/or a hydrolyzable group; (B) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 alkenoxysilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; (C) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 aminosilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; and (D) 0.01 to 10 parts by weight of a curing catalyst.

Abstract: An organopolysiloxane composition suited for magnesium alloy bonding comprises (A) a specific organopolysiloxane, (B) a non-reactive silicone oil, (C) zinc oxide surface treated with a silane or siloxane treating agent, (D) heavy calcium carbonate surface treated with a paraffin treating agent, (E) an organosilicon compound having at least three hydrolyzable radicals or a partial hydrolyzate thereof, (F) a silane coupling agent having at least one epoxy radical, and (G) a titanium chelate catalyst. The composition has improved chemical resistance.

Abstract: A room temperature curable organopolysiloxane composition comprising (A) a diorganopolysiloxane endcapped at both ends of the molecular chain with hydroxy group (HO—(R2SiO)n—H wherein R represents a monovalent hydrocarbon group, and n represents an integer of at least 10); (B) a silane having at least two dialkyl ketoxime groups in its molecule (R1x—Si(—O—N?CR2R3)4?x wherein R1 represents a monovalent hydrocarbon group, R2 and R3 represents a monovalent hydrocarbon group or R2 and R3 may together form a ring with the carbon atom to which they are bonded to, and x represents an integer of 0 to 2 and/or a partial hydrolysate thereof; (C) a filler selected from the group consisting of zinc carbonate, zinc oxide, zinc hydroxide, and mixtures thereof; (D) a curing catalyst; and (E) a hindered phenol compound having a molecular weight of at least 400.

Abstract: A room temperature fast-curing organopolysiloxane composition which has excellent fast curability as well as deep curability is provided without using an organic compound having C?O group and the organic compound having NH2 group which are the volatile components. A method for curing such composition is also provided. The room temperature fast-curing organopolysiloxane composition comprises: (A) 100 parts by weight of a diorganopolysiloxane having both ends terminated with hydroxy group and/or a hydrolyzable group; (B) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 alkenoxysilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; (C) 0.5 to 10 parts by weight of a silane and/or a siloxane having at least 3 aminosilyl groups in its molecule and being capable of forming a compound having —NH2 group by hydrolysis; and (D) 0.01 to 10 parts by weight of a curing catalyst.

Abstract: An organopolysiloxane composition for bonding to magnesium alloys comprises (A) 100 parts by weight of an organopolysiloxane of the following general formula (1) and/or (2) wherein R may be the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of at least 10, X represents an oxygen atom or an alkylene group having 2 to 5 carbon atoms, and m independently represents an integer of 0 or 1, (B) 0.1 to 50 parts by weight of an organosilicon compound having at least three hydrolyzable groups bonded to silicon atoms in one molecule and/or a partial hydrolyzate thereof, and (C) 0.1 to 15 parts by weight of an acidic silane coupling agent.

Abstract: An organopolysiloxane composition suited for magnesium alloy bonding comprises (A) a specific organopolysiloxane, (B) a non-reactive silicone oil, (C) zinc oxide surface treated with a silane or siloxane treating agent, (D) heavy calcium carbonate surface treated with a paraffin treating agent, (E) an organosilicon compound having at least three hydrolyzable radicals or a partial hydrolyzate thereof, (F) a silane coupling agent having at least one epoxy radical, and (G) a titanium chelate catalyst. The composition has improved chemical resistance.

Abstract: An organopolysiloxane composition for bonding to magnesium alloys comprises (A) 100 parts by weight of an organopolysiloxane of the following general formula (1) and/or (2) wherein R may be the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of at least 10, X represents an oxygen atom or an alkylene group having 2 to 5 carbon atoms, and m independently represents an integer of 0 or 1, (B) 0.1 to 50 parts by weight of an organosilicon compound having at least three hydrolyzable groups bonded to silicon atoms in one molecule and/or a partial hydrolyzate thereof, and (C) 0.1 to 15 parts by weight of an acidic silane coupling agent.

Abstract: A room temperature organopolysiloxane composition is provided, which can be cured rapidly and right down to deep sections. The cured products have good rubber characteristics. The composition includes (A) 100 parts by weight of a diorganopolysiloxane represented by a general formula (1) shown below, wherein R represents a substituted or unsubstituted monovalent hydrocarbon group, X represents, independently, an OH group, an alkoxy group or an acyloxy group, a represents an integer from 0 to 2, and n represents a number which results in a viscosity at 25° C. of 25 to 1,000,000 mm2/s; (B) 2 to 50 parts by weight of a hydrolysable silane with at least two acyloxy groups, a partial hydrolysis-condensation product thereof, or a mixture thereof; and (C) 5 to 200 parts by weight of an inorganic filler capable of generating water through a reaction with a carboxylic acid generated by hydrolysis of the constituent (B).

Abstract: A room temperature organopolysiloxane composition is provided, which can be cured rapidly and right down to deep sections. The cured products have good rubber characteristics.

Abstract: In a process for preparing a one-package RTV organopolysiloxane composition comprising (A) an organopolysiloxane containing at least two Si—OH groups or hydrolyzable groups, (B) an organosilane having at least two hydrolyzable groups or a partial hydrolyzate thereof, and (C) an inorganic filler, components (A) and (B) are premixed in a substantially anhydrous state, and component (C) is then added to the premix. Despite the absence of sag-control agents, the composition in the uncured state has a sufficient viscosity for sag-control, ease of extrusion, and improved slump properties.

Abstract: A room temperature curable organopolysiloxane composition including:(A) a diorganopolysiloxane terminated with a hydroxyl group at the both terminal ends and having a viscosity at 25.degree. C. of 25 to 1,000,000 cSt,(B) an organosilane having 3 or more hydrolyzable groups per molecule, a partially hydrolyzed and condensed product thereof or a mixture thereof, said hydrolyzable group is a ketoxime group or an alkenyloxy groups, anda thin leaf-like inorganic filler. This can give cured products with good oil resistance, and suitable as FIPG materials for automobiles.

Abstract: A method for preparing a room temperature curing organopolysiloxane composition having good working properties, which comprises (A) a diorganopolysiloxane having at least two hydroxyl groups bonded to silicon atoms in one molecule, (B) a thixotropy improver, (C) a finely divided silica powder, (D) at least one member selected from organosilanes having two or more ketoxime groups bonded to a silicon atom in one molecule and partial hydrolyzates thereof, (E) a curing catalyst for the condensation curing reaction between (A) and (D) components, and (F) an amine-based silane coupling agent for imparting adhesiveness to the composition, wherein the (A), (B) and (C) components are first mixed, with which the (D) and (E) components are further mixed, and the (F) component is finally added to and mixed with the resultant mixture.