Abstract: According to the present disclosure, a semiconductor apparatus comprises a plurality of integrated circuits, an IC frame on which the plurality of integrated circuits are mounted, and a sealing material. The IC frame comprises a first protrusion extending in a longitudinal direction of the IC frame, a second protrusion positioned on the opposite side to the first protrusion in the IC frame and extending in an opposite direction to the first protrusion, and a third protrusion extending in a direction perpendicular to the longitudinal direction of the IC frame and incorporated in the sealing material.

Abstract: A semiconductor device includes: a package to seal a semiconductor element; a lead frame having one end portion connected to the semiconductor element and the other end portion protruding from a side surface of the package; a plurality of threaded holes formed in the package to enable the package to be fixed to the substrate; and a resin part capable of closing each of the plurality of threaded holes. A type name of the semiconductor device is represented by open and closed states of the respective threaded holes.

Abstract: According to the present disclosure, a semiconductor apparatus comprises a plurality of integrated circuits, an IC frame on which the plurality of integrated circuits are mounted, and a sealing material. The IC frame comprises a first protrusion extending in a longitudinal direction of the IC frame, a second protrusion positioned on the opposite side to the first protrusion in the IC frame and extending in an opposite direction to the first protrusion, and a third protrusion extending in a direction perpendicular to the longitudinal direction of the IC frame and incorporated in the sealing material.

Abstract: A semiconductor device includes: a package to seal a semiconductor element; a lead frame having one end portion connected to the semiconductor element and the other end portion protruding from a side surface of the package; a plurality of threaded holes formed in the package to enable the package to be fixed to the substrate; and a resin part capable of closing each of the plurality of threaded holes. A type name of the semiconductor device is represented by open and closed states of the respective threaded holes.

Abstract: The invention includes an output circuit that outputs an operation signal to a direct current breaker that interrupts a direct current main circuit, and a processor that samples, at predetermined time intervals, digital data wherein a value detected by a direct current transformer that detects a current of the direct current main circuit is measured as an input current, calculates a computed measurement value to be output to a display circuit, and outputs control information for executing a protection process using measurement value sampling data obtained by the sampling to the output circuit, and executes a protection process of the direct current main circuit at every sampling.

Abstract: The invention includes an output circuit that outputs an operation signal to a direct current breaker that interrupts a direct current main circuit, and a processor that samples, at predetermined time intervals, digital data wherein a value detected by a direct current transformer that detects a current of the direct current main circuit is measured as an input current, calculates a computed measurement value to be output to a display circuit, and outputs control information for executing a protection process using measurement value sampling data obtained by the sampling to the output circuit, and executes a protection process of the direct current main circuit at every sampling.