Patents by Inventor Mamoru Yamakawa

Mamoru Yamakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED light module with heat releasing casing and grooved backing to contain conductive bonding fluids
    Patent number: 8610165
    Abstract: An LED module structure and a light fixture provided with the structure includes a heat releasing casing; an LED package having an LED chip mounted on a base material, a material having both heat conductance and electric insulation property placed between the heat releasing casing and the LED package upon fitting of the LED package to the heat releasing casing, and a plastic fluid or adhesive agent having particles with high heat conductivity. The material has a groove with outside smaller than an outside dimension of the LED package. The groove receives excess plastic fluid or excess adhesive agent on a surface to which the LED package is firmly attached.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: December 17, 2013
    Assignee: Panasonic Corporation
    Inventors: Mamoru Yamakawa, Jun Takashima, Koji Uenoyama
  • LIGHTING STRUCTURE AND LIGHT FIXTURE
    Publication number: 20120188763
    Abstract: An LED module structure and a light fixture provided with the structure includes a heat releasing casing; an LED package having an LED chip mounted on a base material, a material having both heat conductance and electric insulation property placed between the heat releasing casing and the LED package upon fitting of the LED package to the heat releasing casing, and a plastic fluid or adhesive agent having particles with high heat conductivity. The material has a groove with outside smaller than an outside dimension of the LED package. The groove receives excess plastic fluid or excess adhesive agent on a surface to which the LED package is firmly attached.
    Type: Application
    Filed: November 17, 2011
    Publication date: July 26, 2012
    Inventors: Mamoru Yamakawa, Jun Takashima, Koji Uenoyama