Patents by Inventor Mamoru Yanagisawa

Mamoru Yanagisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package for enclosing semiconductor elements
    Patent number: 4458291
    Abstract: A package for enclosing semiconductor elements having side surfaces at which cross sections of conductive wires for receiving a voltage to effect electric plating are exposed. The side surfaces are provided with a static electricity-preventing device, such recesses formed in the side surfaces, insulating films formed on the side surfaces or removable frames positioned on the side surfaces, so that a high voltage due to static electricity from an exterior source is not applied to the conductive wires.
    Type: Grant
    Filed: July 20, 1982
    Date of Patent: July 3, 1984
    Assignee: Fujitsu Limited
    Inventors: Mamoru Yanagisawa, Hidehiko Akasaki, Hideji Aoki