Abstract: Embodiments of a microelectronic assembly includes: a package substrate and an integrated circuit (IC) die coupled to a surface of the package substrate by first interconnects and second interconnects, the first interconnects and the second interconnects comprising solder. The first interconnects are larger than the second interconnects, the first interconnects and the second interconnects further comprise bumps on the IC die and bond-pads on the surface of the package substrate, with the solder coupled to the bumps and the bond-pads, lateral sides of the bumps have a coating of a material that prevents solder wicking, and the surface of the package substrate includes insulative baffles between the bond-pads.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first layer, where the first layer comprises glass, a second layer over the first layer, where the second layer comprises glass, and a third layer over the second layer, where the third layer comprises glass. In an embodiment, a pair of traces are in the second layer, and a first gap is below the pair of traces, where the first gap is in the first layer and the second layer. In an embodiment, a second gap is above the pair of traces, where the second gap is in the second layer and the third layer.

Abstract: The present application provides a micro-ingredient tower for filling a container with a number of different micro-ingredients. The micro-ingredient tower may include a number of micro-ingredient containers therein and a nozzle head. The nozzle head may include a number of dispensing needles therein such that each of the dispensing needles doses a micro-ingredient into the container.

Abstract: The present disclosure provides a process to make whole soy foodstuff or beverage without removing soy pulp or okara during the process. The process includes liquefying whole soybeans, forming a liquefaction product, wherein the liquefaction product comprises a liquid fraction and a soy pulp fraction; and treating the liquefaction product with an enzyme, thereby forming a whole soy base. The whole soy base can itself serve as a soy beverage, or alternatively combined with other ingredients or subjected to further treatment to make final soy foodstuff or beverages.

Abstract: Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes first waveguides over a package substrate. The first waveguides include first angled conductive layers, first transmission lines, and first cavities. The semiconductor package also includes a first dielectric over the first waveguides and package substrate, second waveguides over the first dielectric and first waveguides, and a second dielectric over the second waveguides and first dielectric. The second waveguides include second angled conductive layers, second transmission lines, and second cavities. The first angled conductive layers are positioned over the first transmission lines and package substrate having a first pattern of first triangular structures.

Abstract: A system includes a package layer with microchannels to spread heat localized in the package at an electronic die. The microchannel is integrated onto or into the package layer. The microchannel has a hollow heat conducting material through which a fluid is to flow to spread the heat. The microchannel has a triangular cross-section or a trapezoidal cross-section. The microchannel can be sealed in the integration process to result in a closed heat pipe structure in which liquid flows through expansion and compression in response to heating and cooling, respectively.

Abstract: A system includes a package layer with microchannels to spread heat localized in the package at an electronic die. The microchannel is integrated onto or into the package layer. The microchannel has a hollow heat conducting material with a rectangular cross-section through which a fluid is to flow to spread the heat. The microchannel can be an open channel that is sealed with a pump to cause the fluid to flow through the microchannel. The microchannel can be sealed in the integration process to result in a closed heat pipe structure in which liquid flows through expansion and compression in response to heating and cooling, respectively.

Abstract: The present application provides a filling line for filling a container with one of a number of different beverages. The filling line may include a water circuit with a counter-pressure nozzle to fill the container with carbonated water and one or more micro-ingredient towers with a number of micro-ingredients therein positioned downstream of the counter-pressure nozzle to fill the container with the micro-ingredients.

Abstract: Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes first waveguides over a package substrate. The first waveguides include first angled conductive layers, first transmission lines, and first cavities. The semiconductor package also includes a first dielectric over the first waveguides and package substrate, second waveguides over the first dielectric and first waveguides, and a second dielectric over the second waveguides and first dielectric. The second waveguides include second angled conductive layers, second transmission lines, and second cavities. The first angled conductive layers are positioned over the first transmission lines and package substrate having a first pattern of first triangular structures.

Abstract: The present application provides a filling line for filling a container with one of a number of different beverages. The filling line may include a water circuit with a counter-pressure nozzle to fill the container with carbonated water and one or more micro-ingredient towers with a number of micro-ingredients therein positioned downstream of the counter-pressure nozzle to fill the container with the micro-ingredients.

Abstract: The present application provides a micro-ingredient tower for filling a container with a number of different micro-ingredients. The micro-ingredient tower may include a number of micro-ingredient containers therein and a nozzle head. The nozzle head may include a number of dispensing needles therein such that each of the dispensing needles doses a micro-ingredient into the container.

Abstract: This disclosure provides systems and methods for generating potable water from contaminated water sources, particularly well water. By eliminating the purified water holding tank, employing a combination of source tank with carbon and reverse osmosis filters in series, and using an actuated pump to supply impure water from the source, a simple on-demand system is provided that is especially adapted for use in remote locations. The system and method are particularly useful where only direct current power, such as from a solar photovoltaic panel power, is available.

Abstract: Systems and methods for blending low solubility ingredients are provided. In one embodiment, a method of blending a low solubility ingredient into a beverage solution includes dissolving the low solubility ingredient in a preselected solvent to provide a first solution. In one embodiment, the preselected solvent is preheated. The method also includes mixing various ingredients from one or more pre-blend batches to form a beverage syrup and mixing the first solution with the beverage syrup to form the beverage solution.

Abstract: This disclosure provides systems and methods for generating potable water from contaminated water sources, particularly well water. By eliminating the purified water holding tank, employing a combination of source tank with carbon and reverse osmosis filters in series, and using an actuated pump to supply impure water from the source, a simple on-demand system is provided that is especially adapted for use in remote locations. The system and method are particularly useful where only direct current power, such as from a solar photovoltaic panel power, is available.

Abstract: Functionality is disclosed herein for a pascalization process for food and beverage products, and possibly other materials. The process includes inputting an unprocessed product, pressurizing the unprocessed product to a first pressure to create a pressurized product, holding the pressurized product at the first pressure for a predetermined hold time and depressurizing the pressurized product to a second pressure to create a processed product. The second pressure is less than the first pressure. The process also includes outputting the processed product.