Abstract: An airport baggage recording system. The airport baggage recording system comprises a telescopic robotic arm that loads airport baggage. The robotic arm has one end connected to an upright by a pivot and a second end connected to a disc. A radio frequency identification (RFID) reader is located in the disc that reads RFID tags on the airport baggage when the airport baggage is placed on the disc during loading. Another RFID reader is located on the pivot that reads the RFID tags on the airport baggage when the airport baggage is placed on the disc during loading. The RFID reader in the disc and the RFID reader on the pivot both read the RFID tags on the airport baggage to prevent errors in reading the RFID tags on the airport baggage during loading.

Abstract: An airport baggage recording system. The airport baggage recording system comprises a telescopic robotic arm that loads airport baggage. The robotic arm has one end connected to an upright by a pivot and a second end connected to a disc. A radio frequency identification (RFID) reader is located in the disc that reads RFID tags on the airport baggage when the airport baggage is placed on the disc during loading. Another RFID reader is located on the pivot that reads the RFID tags on the airport baggage when the airport baggage is placed on the disc during loading. The RFID reader in the disc and the RFID reader on the pivot both read the RFID tags on the airport baggage to prevent errors in reading the RFID tags on the airport baggage during loading.

Abstract: Disclosed is a device for holding a plurality of semiconductor devices during thermocompression bonding, comprising: a body; a plurality of support surfaces at a first side of the body, each support surface being configured for holding at least one semiconductor device during thermocompression bonding; and a plurality of internal conduits within the body, each internal conduit extending from an opening of a respective one of the support surfaces at the first side of the body to an opening at a second side of the body. In particular, the openings at the second side of the body are configured to be connected to separate pneumatic paths to be in fluid communication therewith, each pneumatic path having an independently controlled pneumatic suction force so that the openings of the support surfaces at the first side of the body are operative to selectively hold the one or more semiconductor devices against the support surfaces at the first side of the body or to release the same therefrom.

Abstract: Disclosed is a device for holding a plurality of semiconductor devices during thermocompression bonding, comprising: a body; a plurality of support surfaces at a first side of the body, each support surface being configured for holding at least one semiconductor device during thermocompression bonding; and a plurality of internal conduits within the body, each internal conduit extending from an opening of a respective one of the support surfaces at the first side of the body to an opening at a second side of the body. In particular, the openings at the second side of the body are configured to be connected to separate pneumatic paths to be in fluid communication therewith, each pneumatic path having an independently controlled pneumatic suction force so that the openings of the support surfaces at the first side of the body are operative to selectively hold the one or more semiconductor devices against the support surfaces at the first side of the body or to release the same therefrom.