Abstract: An apparatus for bonding at least two substrates to each other comprises a plurality of substrate bonding machines arranged adjacent to one another and an input transporter extending adjacent to the plurality of substrate bonding machines which is operative to deliver the substrates to each of the substrate bonding machines. The input transporter is supplied with substrates by an onloading station. An output transporter extending adjacent to the plurality of substrate bonding machines is operative to receive bonded substrates from each of the substrate bonding machines and deliver the bonded substrates to an offloading station for removal from the apparatus.

Abstract: Real-time alignment of substrates is conducted by way of placing a first substrate together with a second substrate located over the first substrate in a fixed relative position onto a first substrate holder. The first substrate holder is operative to support the first substrate. A second substrate holder is operative to contact and control the position of the second substrate relative to the first substrate. A pattern recognition system is operative to view reference marks on the first and second substrates for determining their relative alignment, and a positioning mechanism coupled to the first substrate holder and/or the second substrate holder will align the first substrate relative to the second substrate based on their relative alignment as determined by the pattern recognition system. Thereafter, the substrates are fully laminated to secure them to each other.

Abstract: An array of semiconductor components, comprising a first plurality of semiconductor components and a second plurality of semiconductor components held on a carrier, is bonded onto one or more substrates. The first plurality of semiconductor components is first located for pick-up by a transfer device, and each semiconductor component comprised in the first plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates. After the first plurality of semiconductor components have been picked up and bonded, the carrier is rotated and the second plurality of semiconductor components is located for pick-up by the transfer device. Thereafter, each semiconductor component comprised in the second plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates.

Abstract: Real-time alignment of substrates is conducted by way of placing a first substrate together with a second substrate located over the first substrate in a fixed relative position onto a first substrate holder. The first substrate holder is operative to support the first substrate. A second substrate holder is operative to contact and control the position of the second substrate relative to the first substrate. A pattern recognition system is operative to view reference marks on the first and second substrates for determining their relative alignment, and a positioning mechanism coupled to the first substrate holder and/or the second substrate holder will align the first substrate relative to the second substrate based on their relative alignment as determined by the pattern recognition system. Thereafter, the substrates are fully laminated to secure them to each other.

Abstract: An apparatus for bonding at least two substrates to each other comprises a plurality of substrate bonding machines arranged adjacent to one another and an input transporter extending adjacent to the plurality of substrate bonding machines which is operative to deliver the substrates to each of the substrate bonding machines. The input transporter is supplied with substrates by an onloading station. An output transporter extending adjacent to the plurality of substrate bonding machines is operative to receive bonded substrates from each of the substrate bonding machines and deliver the bonded substrates to an offloading station for removal from the apparatus.

Abstract: Multiple types of adhesives contained in separate containers are transferred from a supply of adhesives to a substrate. A first stamping pin is moved to a position of a first container containing a first adhesive, and the first adhesive is transferred with the first stamping pin from the first container to the substrate before bonding a first die onto the first adhesive. A second stamping pin is then moved to a position of a second container containing a second adhesive, and the second adhesive is transferred with the second stamping pin from the second container to the substrate before bonding a second die onto the second adhesive.

Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.

Abstract: An array of semiconductor components, comprising a first plurality of semiconductor components and a second plurality of semiconductor components held on a carrier, is bonded onto one or more substrates. The first plurality of semiconductor components is first located for pick-up by a transfer device, and each semiconductor component comprised in the first plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates. After the first plurality of semiconductor components have been picked up and bonded, the carrier is rotated and the second plurality of semiconductor components is located for pick-up by the transfer device. Thereafter, each semiconductor component comprised in the second plurality of semiconductor components is picked up with the transfer device and is bonded onto a respective bonding position on the one or more substrates.

Abstract: A bonding apparatus for conducting bonding on substrates comprises a first substrate holding device for clamping a first substrate during bonding and a second substrate holding device for clamping a second substrate during bonding. Each substrate holding device is operative to move sequentially between its respective onloading position for receiving substrates, bonding position whereat substrates are bonded and offloading position whereat bonded substrates are removed from the substrate holding device. A first actuator is operative to drive the first substrate holding device along a first feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a first return path. A second actuator is operative to drive the second substrate holding device along a second feeding path from its onloading position to its bonding position and from its offloading position to its onloading position along a second return path.

Abstract: Multiple connector clips are bondable onto an electronic device simultaneously with a rotary clip bonder, wherein a pick head comprising a plurality of collets is positioned at a clip supply channel. A plurality of connector clips are picked up from the clip supply channel in a fixed orientation with the pick head and are conveyed to a clip bonding area where the electronic device is located. The pick head is rotated with a rotary motor about a rotational axis passing through a shaft connecting the rotary motor to the pick head in order to change the orientation of the plurality of connector clips, before the connector clips are bonded at the clip bonding area.

Abstract: Multiple types of adhesives contained in separate containers are transferred from a supply of adhesives to a substrate. A first stamping pin is moved to a position of a first container containing a first adhesive, and the first adhesive is transferred with the first stamping pin from the first container to the substrate before bonding a first die onto the first adhesive. A second stamping pin is then moved to a position of a second container containing a second adhesive, and the second adhesive is transferred with the second stamping pin from the second container to the substrate before bonding a second die onto the second adhesive.

Abstract: Multiple connector clips are bondable onto an electronic device simultaneously with a rotary clip bonder, wherein a pick head comprising a plurality of collets is positioned at a clip supply channel. A plurality of connector clips are picked up from the clip supply channel in a fixed orientation with the pick head and are conveyed to a clip bonding area where the electronic device is located. The pick head is rotated with a rotary motor about a rotational axis passing through a shaft connecting the rotary motor to the pick head in order to change the orientation of the plurality of connector clips, before the connector clips are bonded at the clip bonding area.

Abstract: The invention provides an apparatus and a method for positioning an object coupled to a first support structure and a second support structure. A first actuator drives the first support structure along a first axis and a second actuator drives the first support structure along a second axis orthogonal to the first axis. A third actuator comprising a forcer and a stator is provided for driving the second support structure that is guided for movement relative to the first support structure along a third axis orthogonal to the first and second axes. The forcer is coupled to the second support structure and is movable with respect to the stator, and the stator is relatively stationary and decoupled from the second support structure.