Abstract: A chemical mechanical polishing apparatus is provided which is capable of polishing an essentially non-streaked mirrored surface in a highly efficient manner, and which is capable of achieving a degree of flatness of +/-0.1 mm or less.

Abstract: A polishing apparatus is provided with a fixed gear and at least one planet gear which meshes with the fixed gear to make at least one spindle coupled to said planet gear perform orbital revolution and own rotation by making the planet gear rotate around its own axis while orbitally revolving said planet gear around the fixed gear, thus rotating the workpieces fitted to said spindle in the polishing bath to be subject to fluidized polishing with the media filled up in the polishing bath, wherein said spindle is formed as a cylinder in which a rotary shaft is arranged rotatably and a rotating mechanism for rotating the rotary shaft is provided to rotate the workpieces at the same time the rotation of said rotary shaft, thus permitting the workpieces to be uniformly polished.